FR2456390B1 - - Google Patents
Info
- Publication number
- FR2456390B1 FR2456390B1 FR7911989A FR7911989A FR2456390B1 FR 2456390 B1 FR2456390 B1 FR 2456390B1 FR 7911989 A FR7911989 A FR 7911989A FR 7911989 A FR7911989 A FR 7911989A FR 2456390 B1 FR2456390 B1 FR 2456390B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H10W40/778—
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- H10W70/429—
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- H10W74/111—
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- H10W72/534—
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- H10W72/5363—
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- H10W72/5449—
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- H10W72/5522—
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- H10W72/5524—
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- H10W72/932—
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- H10W90/756—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7911989A FR2456390A1 (fr) | 1979-05-11 | 1979-05-11 | Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7911989A FR2456390A1 (fr) | 1979-05-11 | 1979-05-11 | Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2456390A1 FR2456390A1 (fr) | 1980-12-05 |
| FR2456390B1 true FR2456390B1 (cg-RX-API-DMAC10.html) | 1983-01-21 |
Family
ID=9225343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7911989A Granted FR2456390A1 (fr) | 1979-05-11 | 1979-05-11 | Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2456390A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3046192A1 (de) * | 1980-12-08 | 1982-07-15 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer ic-bausteine |
| US4331831A (en) * | 1980-11-28 | 1982-05-25 | Bell Telephone Laboratories, Incorporated | Package for semiconductor integrated circuits |
| JPS58169948A (ja) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | 樹脂封止型半導体装置 |
| EP0204102A3 (en) * | 1985-06-03 | 1987-11-19 | Motorola, Inc. | Direct connection of lead frame having flexible, tapered leads and mechanical die support |
| US4707418A (en) * | 1985-06-26 | 1987-11-17 | National Semiconductor Corporation | Nickel plated copper tape |
| US4701363A (en) * | 1986-01-27 | 1987-10-20 | Olin Corporation | Process for manufacturing bumped tape for tape automated bonding and the product produced thereby |
| FR2596607A1 (fr) * | 1986-03-28 | 1987-10-02 | Bull Sa | Procede de montage d'un circuit integre sur une carte de circuits imprimes, boitier de circuit integre en resultant et ruban porteur de circuits integres pour la mise en oeuvre du procede |
| US4924291A (en) * | 1988-10-24 | 1990-05-08 | Motorola Inc. | Flagless semiconductor package |
| US5041902A (en) * | 1989-12-14 | 1991-08-20 | Motorola, Inc. | Molded electronic package with compression structures |
| US5216283A (en) * | 1990-05-03 | 1993-06-01 | Motorola, Inc. | Semiconductor device having an insertable heat sink and method for mounting the same |
| JP2602380B2 (ja) * | 1991-10-23 | 1997-04-23 | 富士通株式会社 | 半導体装置及びその製造方法 |
| FR2940521B1 (fr) | 2008-12-19 | 2011-11-11 | 3D Plus | Procede de fabrication collective de modules electroniques pour montage en surface |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4026008A (en) * | 1972-10-02 | 1977-05-31 | Signetics Corporation | Semiconductor lead structure and assembly and method for fabricating same |
| US3930114A (en) * | 1975-03-17 | 1975-12-30 | Nat Semiconductor Corp | Integrated circuit package utilizing novel heat sink structure |
| US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
| DE2658532C2 (de) * | 1976-12-23 | 1984-02-16 | Siemens AG, 1000 Berlin und 8000 München | Zwischenträger zur Halterung und Kontaktierung eines Halbleiterkörpers und Verfahren zu dessen Herstellung |
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1979
- 1979-05-11 FR FR7911989A patent/FR2456390A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2456390A1 (fr) | 1980-12-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |