FR2439803A1 - Composition de resine de polyacetal excellente par sa stabilite a la chaleur et sa facilite de traitement, procede pour rendre sa surface rugueuse et produit obtenu - Google Patents
Composition de resine de polyacetal excellente par sa stabilite a la chaleur et sa facilite de traitement, procede pour rendre sa surface rugueuse et produit obtenuInfo
- Publication number
- FR2439803A1 FR2439803A1 FR7926404A FR7926404A FR2439803A1 FR 2439803 A1 FR2439803 A1 FR 2439803A1 FR 7926404 A FR7926404 A FR 7926404A FR 7926404 A FR7926404 A FR 7926404A FR 2439803 A1 FR2439803 A1 FR 2439803A1
- Authority
- FR
- France
- Prior art keywords
- polyacetal resin
- parts
- heat stability
- making
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229930182556 Polyacetal Natural products 0.000 title abstract 4
- 229920006324 polyoxymethylene Polymers 0.000 title abstract 4
- 239000011342 resin composition Substances 0.000 title 1
- 239000011347 resin Substances 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 abstract 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 abstract 1
- YPEMKASELPCGPB-UHFFFAOYSA-N 2-methylprop-2-enoic acid;prop-2-enamide Chemical compound NC(=O)C=C.CC(=C)C(O)=O YPEMKASELPCGPB-UHFFFAOYSA-N 0.000 abstract 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 abstract 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 abstract 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 abstract 1
- 239000004641 Diallyl-phthalate Substances 0.000 abstract 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 abstract 1
- 229910019142 PO4 Inorganic materials 0.000 abstract 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 abstract 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- 150000002148 esters Chemical class 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 230000000737 periodic effect Effects 0.000 abstract 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 abstract 1
- 239000010452 phosphate Substances 0.000 abstract 1
- 229920000728 polyester Polymers 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/14—Chemical modification with acids, their salts or anhydrides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals
- C08L59/02—Polyacetals containing polyoxymethylene sequences only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2359/00—Characterised by the use of polyacetals containing polyoxymethylene sequences only
- C08J2359/02—Copolyoxymethylenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L47/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/06—Unsaturated polyesters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53130479A JPS584936B2 (ja) | 1978-10-25 | 1978-10-25 | ポリアセタ−ル樹脂組成物の表面処理方法 |
JP10410279A JPS5628236A (en) | 1979-08-17 | 1979-08-17 | Polyacetal resin composition for molded article to be surface treated and having excellent thermal stability |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2439803A1 true FR2439803A1 (fr) | 1980-05-23 |
FR2439803B1 FR2439803B1 (it) | 1985-03-08 |
Family
ID=26444647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7926404A Granted FR2439803A1 (fr) | 1978-10-25 | 1979-10-24 | Composition de resine de polyacetal excellente par sa stabilite a la chaleur et sa facilite de traitement, procede pour rendre sa surface rugueuse et produit obtenu |
Country Status (4)
Country | Link |
---|---|
DE (2) | DE2942744C2 (it) |
FR (1) | FR2439803A1 (it) |
GB (1) | GB2035335B (it) |
IT (1) | IT1164132B (it) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0192356A2 (en) * | 1985-02-04 | 1986-08-27 | Polyplastics Co. Ltd. | Polyacetal resin composition |
EP0351235A2 (en) * | 1988-07-14 | 1990-01-17 | Polyplastics Co. Ltd. | Weather-resistant polyacetal resin composition |
EP0356167A2 (en) * | 1988-08-22 | 1990-02-28 | Polyplastics Co. Ltd. | Weather-resistant polyacetal resin composition |
EP0388809A2 (en) * | 1989-03-17 | 1990-09-26 | E.I. Du Pont De Nemours And Company | Polyacetal resins containing non-meltable polymer stabilizers or cellulose stabilizers |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4587033A (en) * | 1984-07-02 | 1986-05-06 | Monsanto Company | Polymeric acetal carboxylate compositions |
AU718841B2 (en) * | 1995-10-31 | 2000-04-20 | Indigo Medical, Incorporated | Light-diffusing device for an optical fiber, methods of producing and using same, and apparatus for diffusing light from an optical fiber |
DE19725054A1 (de) * | 1997-06-13 | 1998-12-17 | Basf Ag | Gleitreibebeständige Formmassen |
US20040228971A1 (en) * | 2003-05-13 | 2004-11-18 | Pascal Scaramuzzino | Modified polyacetals for decorative applications |
US20040258906A1 (en) * | 2003-06-20 | 2004-12-23 | Pascal Scaramuzzino | Modified polyacetals for plating |
WO2009050176A1 (de) * | 2007-10-16 | 2009-04-23 | Basf Se | Verfahren zur herstellung von schlagzähmodifiziertem pom |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1411952A (fr) * | 1963-09-09 | 1965-09-24 | Toyo Rayon Co Ltd | Procédé de formage par fusion de polyacétal |
GB1026017A (en) * | 1962-04-19 | 1966-04-14 | Celanese Corp | Oxymethylene polymer compositions |
DE2108475A1 (en) * | 1971-02-23 | 1972-09-07 | Thoener R | Eching polyoxy methylene (co) olymer articles - with phosphoric acid and alcohol mixt before metal plating |
FR2192138A2 (it) * | 1972-07-06 | 1974-02-08 | Hoechst Ag | |
JPS51128348A (en) * | 1975-04-30 | 1976-11-09 | Asahi Chem Ind Co Ltd | Polyoxymethylene resin composition and method of rreparing the same |
JPS51128349A (en) * | 1975-04-30 | 1976-11-09 | Asahi Chem Ind Co Ltd | Reinforled polyacetal resin composition and method of preparing the sa me |
JPS51131556A (en) * | 1975-05-12 | 1976-11-16 | Asahi Chem Ind Co Ltd | Highly lubricant resin composition |
JPS53102358A (en) * | 1977-02-19 | 1978-09-06 | Fuji Electric Co Ltd | Arc extinguishing thermosetting resin composition |
-
1979
- 1979-10-18 GB GB7936174A patent/GB2035335B/en not_active Expired
- 1979-10-23 DE DE2942744A patent/DE2942744C2/de not_active Expired
- 1979-10-23 DE DE2953528A patent/DE2953528C2/de not_active Expired
- 1979-10-23 IT IT50647/79A patent/IT1164132B/it active
- 1979-10-24 FR FR7926404A patent/FR2439803A1/fr active Granted
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1026017A (en) * | 1962-04-19 | 1966-04-14 | Celanese Corp | Oxymethylene polymer compositions |
FR1411952A (fr) * | 1963-09-09 | 1965-09-24 | Toyo Rayon Co Ltd | Procédé de formage par fusion de polyacétal |
DE2108475A1 (en) * | 1971-02-23 | 1972-09-07 | Thoener R | Eching polyoxy methylene (co) olymer articles - with phosphoric acid and alcohol mixt before metal plating |
FR2192138A2 (it) * | 1972-07-06 | 1974-02-08 | Hoechst Ag | |
JPS51128348A (en) * | 1975-04-30 | 1976-11-09 | Asahi Chem Ind Co Ltd | Polyoxymethylene resin composition and method of rreparing the same |
JPS51128349A (en) * | 1975-04-30 | 1976-11-09 | Asahi Chem Ind Co Ltd | Reinforled polyacetal resin composition and method of preparing the sa me |
JPS51131556A (en) * | 1975-05-12 | 1976-11-16 | Asahi Chem Ind Co Ltd | Highly lubricant resin composition |
JPS53102358A (en) * | 1977-02-19 | 1978-09-06 | Fuji Electric Co Ltd | Arc extinguishing thermosetting resin composition |
Non-Patent Citations (2)
Title |
---|
ABJP/78 * |
CA1977 * |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0192356A2 (en) * | 1985-02-04 | 1986-08-27 | Polyplastics Co. Ltd. | Polyacetal resin composition |
EP0192356A3 (en) * | 1985-02-04 | 1988-01-13 | Polyplastics Co. Ltd. | Polyacetal resin composition |
US4886851A (en) * | 1985-02-04 | 1989-12-12 | Polyplastics Company, Ltd. | Polyacetal resin composition |
EP0351235A2 (en) * | 1988-07-14 | 1990-01-17 | Polyplastics Co. Ltd. | Weather-resistant polyacetal resin composition |
EP0351235A3 (en) * | 1988-07-14 | 1991-06-05 | Polyplastics Co. Ltd. | Weather-resistant polyacetal resin composition |
US5079282A (en) * | 1988-07-14 | 1992-01-07 | Polyplastics Co., Ltd. | Weather-resistant polyacetal resin composition |
EP0356167A2 (en) * | 1988-08-22 | 1990-02-28 | Polyplastics Co. Ltd. | Weather-resistant polyacetal resin composition |
EP0356167A3 (en) * | 1988-08-22 | 1991-05-29 | Polyplastics Co. Ltd. | Weather-resistant polyacetal resin composition |
USRE34141E (en) * | 1988-08-22 | 1992-12-08 | Polyplastics Co., Ltd. | Weather-resistant polyacetal resin composition and molded articles therefrom |
EP0388809A2 (en) * | 1989-03-17 | 1990-09-26 | E.I. Du Pont De Nemours And Company | Polyacetal resins containing non-meltable polymer stabilizers or cellulose stabilizers |
EP0388809A3 (en) * | 1989-03-17 | 1992-03-04 | E.I. Du Pont De Nemours And Company | Polyacetal resins containing non-meltable polymer stabilizers or cellulose stabilizers |
Also Published As
Publication number | Publication date |
---|---|
FR2439803B1 (it) | 1985-03-08 |
GB2035335B (en) | 1983-01-19 |
DE2942744C2 (de) | 1982-05-06 |
DE2953528C2 (de) | 1982-03-18 |
IT1164132B (it) | 1987-04-08 |
DE2942744A1 (de) | 1980-04-30 |
IT7950647A0 (it) | 1979-10-23 |
GB2035335A (en) | 1980-06-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse | ||
ST | Notification of lapse |