GB2035335B - Polyacetal resin composition excellent in heat stability and surface processability and process for surface treating same - Google Patents

Polyacetal resin composition excellent in heat stability and surface processability and process for surface treating same

Info

Publication number
GB2035335B
GB2035335B GB7936174A GB7936174A GB2035335B GB 2035335 B GB2035335 B GB 2035335B GB 7936174 A GB7936174 A GB 7936174A GB 7936174 A GB7936174 A GB 7936174A GB 2035335 B GB2035335 B GB 2035335B
Authority
GB
United Kingdom
Prior art keywords
resin composition
heat stability
polyacetal resin
composition excellent
processability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7936174A
Other versions
GB2035335A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP53130479A external-priority patent/JPS584936B2/en
Priority claimed from JP10410279A external-priority patent/JPS5628236A/en
Application filed by Asahi Chemical Industry Co Ltd, Asahi Kasei Kogyo KK filed Critical Asahi Chemical Industry Co Ltd
Publication of GB2035335A publication Critical patent/GB2035335A/en
Application granted granted Critical
Publication of GB2035335B publication Critical patent/GB2035335B/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals
    • C08L59/02—Polyacetals containing polyoxymethylene sequences only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2359/00—Characterised by the use of polyacetals containing polyoxymethylene sequences only
    • C08J2359/02—Copolyoxymethylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L47/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06—Unsaturated polyesters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemically Coating (AREA)
GB7936174A 1978-10-25 1979-10-18 Polyacetal resin composition excellent in heat stability and surface processability and process for surface treating same Expired GB2035335B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP53130479A JPS584936B2 (en) 1978-10-25 1978-10-25 Surface treatment method for polyacetal resin composition
JP10410279A JPS5628236A (en) 1979-08-17 1979-08-17 Polyacetal resin composition for molded article to be surface treated and having excellent thermal stability

Publications (2)

Publication Number Publication Date
GB2035335A GB2035335A (en) 1980-06-18
GB2035335B true GB2035335B (en) 1983-01-19

Family

ID=26444647

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7936174A Expired GB2035335B (en) 1978-10-25 1979-10-18 Polyacetal resin composition excellent in heat stability and surface processability and process for surface treating same

Country Status (4)

Country Link
DE (2) DE2953528C2 (en)
FR (1) FR2439803A1 (en)
GB (1) GB2035335B (en)
IT (1) IT1164132B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4587033A (en) * 1984-07-02 1986-05-06 Monsanto Company Polymeric acetal carboxylate compositions
JPH0665704B2 (en) * 1985-02-04 1994-08-24 ポリプラスチックス株式会社 Polyacetal resin composition for plating
JPH07110917B2 (en) * 1988-07-14 1995-11-29 ポリプラスチックス株式会社 Weather resistant polyacetal resin composition
JP2989610B2 (en) * 1988-08-22 1999-12-13 ポリプラスチックス株式会社 Weatherable polyacetal resin composition
DE69026641T2 (en) * 1989-03-17 1996-10-17 Du Pont Polyacetal resins containing non-meltable polymer or cellulose stabilizers
AU718841B2 (en) * 1995-10-31 2000-04-20 Indigo Medical, Incorporated Light-diffusing device for an optical fiber, methods of producing and using same, and apparatus for diffusing light from an optical fiber
DE19725054A1 (en) * 1997-06-13 1998-12-17 Basf Ag Molding compounds resistant to sliding friction
US20040228971A1 (en) * 2003-05-13 2004-11-18 Pascal Scaramuzzino Modified polyacetals for decorative applications
US20040258906A1 (en) * 2003-06-20 2004-12-23 Pascal Scaramuzzino Modified polyacetals for plating
WO2009050176A1 (en) * 2007-10-16 2009-04-23 Basf Se Method for producing impact-resistant modified pom

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1026017A (en) * 1962-04-19 1966-04-14 Celanese Corp Oxymethylene polymer compositions
GB1048115A (en) * 1963-09-09 1966-11-09 Toyo Rayon Co Ltd Process for melt-shaping polyacetal
DE2233143C3 (en) * 1972-07-06 1980-09-18 Hoechst Ag, 6000 Frankfurt Thermoplastic molding compounds based on poly (oxymethylene)
DE2108475A1 (en) * 1971-02-23 1972-09-07 Thoener R Eching polyoxy methylene (co) olymer articles - with phosphoric acid and alcohol mixt before metal plating
JPS606969B2 (en) * 1975-04-30 1985-02-21 旭化成株式会社 Reinforced polyacetal resin composition and method for producing the same
JPS5936644B2 (en) * 1975-04-30 1984-09-05 旭化成株式会社 Polyoxymethylene resin composition
JPS599580B2 (en) * 1975-05-12 1984-03-03 旭化成株式会社 Highly lubricating resin composition
JPS53102358A (en) * 1977-02-19 1978-09-06 Fuji Electric Co Ltd Arc extinguishing thermosetting resin composition

Also Published As

Publication number Publication date
FR2439803A1 (en) 1980-05-23
IT7950647A0 (en) 1979-10-23
FR2439803B1 (en) 1985-03-08
GB2035335A (en) 1980-06-18
DE2953528C2 (en) 1982-03-18
DE2942744A1 (en) 1980-04-30
IT1164132B (en) 1987-04-08
DE2942744C2 (en) 1982-05-06

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19971018