FR2433270A1 - Monture a connexions pour dispositifs electroniques - Google Patents

Monture a connexions pour dispositifs electroniques

Info

Publication number
FR2433270A1
FR2433270A1 FR7920355A FR7920355A FR2433270A1 FR 2433270 A1 FR2433270 A1 FR 2433270A1 FR 7920355 A FR7920355 A FR 7920355A FR 7920355 A FR7920355 A FR 7920355A FR 2433270 A1 FR2433270 A1 FR 2433270A1
Authority
FR
France
Prior art keywords
mount
electronic devices
conductors
connection
connection mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7920355A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of FR2433270A1 publication Critical patent/FR2433270A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Details Of Resistors (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

Monture à connexions pour dispositifs électroniques. Selon l'invention, une telle monture comprend un certain nombre de régions métallisées qui sont reliées à des régions métallisées espacées situées dans des rainures formées dans deux côtés opposés parallèles de celles-ci et auxquelles des conducteurs de connexion sont fixés. En s'étendant au-delà des côtés du substrat, ces conducteurs servent à centrer un couvercle ou à positionner et à établir une liaison avec une monture sans connexion. Des pattes prévues sur les conducteurs de connexion jouent aussi le rôle d'éléments de centrale et de positionnement. L'invention s'applique à la fabrication des circuits intégrés.
FR7920355A 1978-08-10 1979-08-09 Monture a connexions pour dispositifs electroniques Withdrawn FR2433270A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/932,609 US4224637A (en) 1978-08-10 1978-08-10 Leaded mounting and connector unit for an electronic device

Publications (1)

Publication Number Publication Date
FR2433270A1 true FR2433270A1 (fr) 1980-03-07

Family

ID=25462588

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7920355A Withdrawn FR2433270A1 (fr) 1978-08-10 1979-08-09 Monture a connexions pour dispositifs electroniques

Country Status (6)

Country Link
US (1) US4224637A (fr)
JP (1) JPS5524496A (fr)
CA (1) CA1113560A (fr)
DE (2) DE2932369A1 (fr)
FR (1) FR2433270A1 (fr)
GB (1) GB2028584A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3126825A1 (de) * 1980-07-18 1982-04-22 Thomas & Betts Corp., 08869 Raritan, N.J. Behaeltnis fuer elektronische baugruppen
FR2498791A1 (fr) * 1980-12-19 1982-07-30 Timex Corp Sous-ensemble dispositif d'affichage electro-optique-cadre de montage et module de dispositif d'horlogerie l'incorporant, ainsi que procede de fabrication du dispositif d'affichage electro-optique
DE10029289A1 (de) * 2000-06-14 2002-01-03 Infineon Technologies Ag Verbindungsanordnung aus elektrischen/elektronischen Bauelementeträgern

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6356706B2 (fr) * 1980-02-12 1988-11-09 Mostek Corp
US4364620A (en) * 1980-09-05 1982-12-21 Mostek Corporation Socket for housing a plurality of integrated circuits
US4441119A (en) * 1981-01-15 1984-04-03 Mostek Corporation Integrated circuit package
WO1982002458A1 (fr) * 1981-01-15 1982-07-22 Link Joseph Enveloppe de circuit integre
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
US4975762A (en) * 1981-06-11 1990-12-04 General Electric Ceramics, Inc. Alpha-particle-emitting ceramic composite cover
US4386463A (en) * 1981-10-05 1983-06-07 Mostek Corporation Lead frame embedding fixture
US4471263A (en) * 1982-03-08 1984-09-11 Burroughs Corporation Buttable display panels
JPS58169948A (ja) * 1982-03-30 1983-10-06 Fujitsu Ltd 樹脂封止型半導体装置
FR2538961B1 (fr) * 1982-12-30 1985-07-12 Europ Composants Electron Embase pour circuit integre
US4479298A (en) * 1983-07-26 1984-10-30 Storage Technology Partners Alignment apparatus and method for mounting LSI and VLSI packages to a printed circuit board
US4572757A (en) * 1984-01-23 1986-02-25 The Jade Corporation Method of making a microcircuit substrate
US4536825A (en) * 1984-03-29 1985-08-20 Unitrode Corporation Leadframe having severable fingers for aligning one or more electronic circuit device components
JPS6311638A (ja) * 1986-03-20 1988-01-19 Hitachi Ltd 高強度高靭性コバルト基合金及びその製造法
JPH0353703A (ja) * 1989-07-21 1991-03-07 Elmec Corp 電子部品の端子構造
US5233131A (en) * 1990-12-19 1993-08-03 Vlsi Technology, Inc. Integrated circuit die-to-leadframe interconnect assembly system
JP2575566B2 (ja) * 1992-01-24 1997-01-29 株式会社東芝 半導体装置
JP2745933B2 (ja) * 1992-02-17 1998-04-28 日本電気株式会社 Ｔａｂ−集積回路
JPH08167691A (ja) * 1994-12-13 1996-06-25 Toshiba Corp 半導体装置
US6395983B1 (en) * 1999-05-18 2002-05-28 Pulse Engineering, Inc. Electronic packaging device and method
EP2340557A1 (fr) * 2008-10-27 2011-07-06 Nxp B.V. Ensemble boîtier microélectronique, procédé de déconnexion d'un boîtier microélectronique

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1252522A (fr) * 1960-03-31 1961-01-27 Pipe à décantation avec dispositif de filtrage
US3689684A (en) * 1971-02-05 1972-09-05 Du Pont Lead frame connector and electronic packages containing same
US3784948A (en) * 1971-12-23 1974-01-08 Bunker Ramo Integrated circuit package of unified structure with variable resistor

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3617819A (en) * 1970-10-15 1971-11-02 Sylvania Electric Prod A semiconductor device having a connecting pad of low resistivity semiconductor material interconnecting gold electrodes and aluminum contacts of an enclosure
US3700788A (en) * 1971-01-28 1972-10-24 Coars Porcelain Co Electrical component package
US3789341A (en) * 1971-01-29 1974-01-29 Olivetti & Co Spa Circuit package
US3803458A (en) * 1971-07-09 1974-04-09 A Morena Package for a microelectronic device
US3735214A (en) * 1972-01-27 1973-05-22 Coilcraft Inc A header for mounting circuit elements for incorporation in an electric circuit
US4142203A (en) * 1976-12-20 1979-02-27 Avx Corporation Method of assembling a hermetically sealed semiconductor unit
US4139726A (en) * 1978-01-16 1979-02-13 Allen-Bradley Company Packaged microcircuit and method for assembly thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1252522A (fr) * 1960-03-31 1961-01-27 Pipe à décantation avec dispositif de filtrage
US3689684A (en) * 1971-02-05 1972-09-05 Du Pont Lead frame connector and electronic packages containing same
FR2124508A1 (fr) * 1971-02-05 1972-09-22 Du Pont
US3784948A (en) * 1971-12-23 1974-01-08 Bunker Ramo Integrated circuit package of unified structure with variable resistor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/77 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3126825A1 (de) * 1980-07-18 1982-04-22 Thomas & Betts Corp., 08869 Raritan, N.J. Behaeltnis fuer elektronische baugruppen
FR2498791A1 (fr) * 1980-12-19 1982-07-30 Timex Corp Sous-ensemble dispositif d'affichage electro-optique-cadre de montage et module de dispositif d'horlogerie l'incorporant, ainsi que procede de fabrication du dispositif d'affichage electro-optique
DE10029289A1 (de) * 2000-06-14 2002-01-03 Infineon Technologies Ag Verbindungsanordnung aus elektrischen/elektronischen Bauelementeträgern

Also Published As

Publication number Publication date
US4224637A (en) 1980-09-23
DE2932369A1 (de) 1980-02-21
GB2028584A (en) 1980-03-05
JPS5524496A (en) 1980-02-21
DE7922821U1 (de) 1979-11-08
CA1113560A (fr) 1981-12-01

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Legal Events

Date Code Title Description
ST Notification of lapse