FR2662543B1 - Assemblage pour etablir un trajet electrique separable entre une zone situee sur un substrat et une zone situee sur un autre substrat. - Google Patents

Assemblage pour etablir un trajet electrique separable entre une zone situee sur un substrat et une zone situee sur un autre substrat.

Info

Publication number
FR2662543B1
FR2662543B1 FR919106040A FR9106040A FR2662543B1 FR 2662543 B1 FR2662543 B1 FR 2662543B1 FR 919106040 A FR919106040 A FR 919106040A FR 9106040 A FR9106040 A FR 9106040A FR 2662543 B1 FR2662543 B1 FR 2662543B1
Authority
FR
France
Prior art keywords
area located
substrate
establishing
assembly
electric path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR919106040A
Other languages
English (en)
Other versions
FR2662543A1 (fr
Inventor
Dimitry G Grabbe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of FR2662543A1 publication Critical patent/FR2662543A1/fr
Application granted granted Critical
Publication of FR2662543B1 publication Critical patent/FR2662543B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/07—Structure, shape, material or disposition of the bonding areas after the connecting process
    • H01L24/08—Structure, shape, material or disposition of the bonding areas after the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H01L2224/05557—Shape in side view comprising protrusions or indentations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0605—Shape
    • H01L2224/06051—Bonding areas having different shapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H01L2224/85207—Thermosonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/95—Electrical connector adapted to transmit electricity to mating connector without physical contact, e.g. by induction, magnetism, or electrostatic field
FR919106040A 1990-05-22 1991-05-17 Assemblage pour etablir un trajet electrique separable entre une zone situee sur un substrat et une zone situee sur un autre substrat. Expired - Lifetime FR2662543B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/526,877 US5047830A (en) 1990-05-22 1990-05-22 Field emitter array integrated circuit chip interconnection

Publications (2)

Publication Number Publication Date
FR2662543A1 FR2662543A1 (fr) 1991-11-29
FR2662543B1 true FR2662543B1 (fr) 1993-08-13

Family

ID=24099184

Family Applications (1)

Application Number Title Priority Date Filing Date
FR919106040A Expired - Lifetime FR2662543B1 (fr) 1990-05-22 1991-05-17 Assemblage pour etablir un trajet electrique separable entre une zone situee sur un substrat et une zone situee sur un autre substrat.

Country Status (3)

Country Link
US (1) US5047830A (fr)
JP (1) JP2896404B2 (fr)
FR (1) FR2662543B1 (fr)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5150192A (en) * 1990-09-27 1992-09-22 The United States Of America As Represented By The Secretary Of The Navy Field emitter array
US5105537A (en) * 1990-10-12 1992-04-21 International Business Machines Corporation Method for making a detachable electrical contact
US5245248A (en) * 1991-04-09 1993-09-14 Northeastern University Micro-emitter-based low-contact-force interconnection device
US5660570A (en) * 1991-04-09 1997-08-26 Northeastern University Micro emitter based low contact force interconnection device
US5220725A (en) * 1991-04-09 1993-06-22 Northeastern University Micro-emitter-based low-contact-force interconnection device
US5414298A (en) * 1993-03-26 1995-05-09 Tessera, Inc. Semiconductor chip assemblies and components with pressure contact
US5648890A (en) * 1993-07-30 1997-07-15 Sun Microsystems, Inc. Upgradable multi-chip module
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US5455390A (en) * 1994-02-01 1995-10-03 Tessera, Inc. Microelectronics unit mounting with multiple lead bonding
US6828668B2 (en) * 1994-07-07 2004-12-07 Tessera, Inc. Flexible lead structures and methods of making same
US6117694A (en) * 1994-07-07 2000-09-12 Tessera, Inc. Flexible lead structures and methods of making same
US5688716A (en) 1994-07-07 1997-11-18 Tessera, Inc. Fan-out semiconductor chip assembly
US5798286A (en) * 1995-09-22 1998-08-25 Tessera, Inc. Connecting multiple microelectronic elements with lead deformation
US6429112B1 (en) * 1994-07-07 2002-08-06 Tessera, Inc. Multi-layer substrates and fabrication processes
US5518964A (en) 1994-07-07 1996-05-21 Tessera, Inc. Microelectronic mounting with multiple lead deformation and bonding
US5830782A (en) * 1994-07-07 1998-11-03 Tessera, Inc. Microelectronic element bonding with deformation of leads in rows
US5590460A (en) 1994-07-19 1997-01-07 Tessera, Inc. Method of making multilayer circuit
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US6247228B1 (en) 1996-08-12 2001-06-19 Tessera, Inc. Electrical connection with inwardly deformable contacts
US6133072A (en) 1996-12-13 2000-10-17 Tessera, Inc. Microelectronic connector with planar elastomer sockets
US8421158B2 (en) 1998-12-21 2013-04-16 Megica Corporation Chip structure with a passive device and method for forming the same
US8178435B2 (en) 1998-12-21 2012-05-15 Megica Corporation High performance system-on-chip inductor using post passivation process
US6612852B1 (en) * 2000-04-13 2003-09-02 Molex Incorporated Contactless interconnection system
TWI236763B (en) * 2003-05-27 2005-07-21 Megic Corp High performance system-on-chip inductor using post passivation process

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3423638A (en) * 1964-09-02 1969-01-21 Gti Corp Micromodular package with compression means holding contacts engaged
JPS5325632B2 (fr) * 1973-03-22 1978-07-27
NL7713758A (nl) * 1977-12-13 1979-06-15 Philips Nv Halfgeleiderinrichting.
DE2926756C2 (de) * 1979-07-03 1984-03-22 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Schottky-Dioden-Anordnung
JPS56126933A (en) * 1980-03-11 1981-10-05 Nippon Telegr & Teleph Corp <Ntt> Contactless evaluator for semiconductor
JPS5738540A (en) * 1980-08-19 1982-03-03 Toshiba Corp Field emission type ion source
US4513308A (en) * 1982-09-23 1985-04-23 The United States Of America As Represented By The Secretary Of The Navy p-n Junction controlled field emitter array cathode
DE3680336D1 (de) * 1985-12-20 1991-08-22 Hughes Aircraft Co Zusammenpressender sockel fuer mikro-verbindungen.
FR2593953B1 (fr) * 1986-01-24 1988-04-29 Commissariat Energie Atomique Procede de fabrication d'un dispositif de visualisation par cathodoluminescence excitee par emission de champ
AU598253B2 (en) * 1986-05-07 1990-06-21 Digital Equipment Corporation System for detachably mounting semi-conductors on conductor substrates
JPH02139843A (ja) * 1988-11-18 1990-05-29 Fujitsu Ltd 電界放射型３極素子およびその製造方法

Also Published As

Publication number Publication date
FR2662543A1 (fr) 1991-11-29
JPH04229632A (ja) 1992-08-19
US5047830A (en) 1991-09-10
JP2896404B2 (ja) 1999-05-31

Similar Documents

Publication Publication Date Title
FR2662543B1 (fr) Assemblage pour etablir un trajet electrique separable entre une zone situee sur un substrat et une zone situee sur un autre substrat.
DE69519967D1 (de) Halbleiteranordnung mit zwei Halbleitersubstrate
DE69535551D1 (de) Halbleiteranordnung mit Kontaktlöchern
DE69408657T2 (de) TAB-Lötflächengeometrie für Halbleiterbauelemente
DE68922585T2 (de) Elektrische Verbindung mit zwei Elementen.
DE3789860T2 (de) Elektrischer Schalter mit zwei Ansprechbedingungen.
DE69312355T2 (de) Oberflächen-Steckverbinder für mit Chips zusammenwirkenden Kontakten
IT8419759A0 (it) Complesso vibratorio a piu&#39;ampiezze.
FR2696040B1 (fr) Appareil interrupteur à contacts pour montage sur circuit imprimé.
FR2764117B1 (fr) Contact sur une region de type p
NO894656L (no) Fremgangsmaate for fremstilling av et elektrodemoenster paa et substrat.
ES1032243Y (es) Un dispositivo de conmutacion electrico termicamente controlado.
TR23672A (tr) Suelfidik olmiyan cevherler icin toplayici olarak propoksillendirilmis yag esasina dayanan alkil- suelfoksinatlar
FR2730855B1 (fr) Appareil electrique modulaire a evidement sur une face laterale
FR2706139B1 (fr) Matériau pour brasure.
DE69108685D1 (de) Einpresskontaktstift.
FR2788164B1 (fr) Appareillage electrique de coupure dont un organe de contact est muni d&#39;une fente
FR2676258B1 (fr) Organe d&#39;assemblage pour pieces.
FR2752141B1 (fr) Protection pour un circuit electrique sur un substrat
FR2656952B1 (fr) Coupe-circuit integre a un thermostat pour appareil electrique.
USD282827S (en) Programmable light timing switch for mounting on an electrical outlet
FR2655122B1 (fr) Joint d&#39;etancheite pour connecteur electrique, et connecteur qui en est equipe.
FR2719712B1 (fr) Contacteur électrique tournant conçu pour un assemblage perfectionné.
FR2689327B1 (fr) Connexion hyperfrequence entre un connecteur coaxial et des elements disposes sur un substrat dielectrique.
FR2678423B1 (fr) Boitier pour un appareillage electrique.