FR2427758A1 - Boitier pour composants electriques et electroniques - Google Patents

Boitier pour composants electriques et electroniques

Info

Publication number
FR2427758A1
FR2427758A1 FR7914294A FR7914294A FR2427758A1 FR 2427758 A1 FR2427758 A1 FR 2427758A1 FR 7914294 A FR7914294 A FR 7914294A FR 7914294 A FR7914294 A FR 7914294A FR 2427758 A1 FR2427758 A1 FR 2427758A1
Authority
FR
France
Prior art keywords
electrical
box
housing
conductors
weldability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7914294A
Other languages
English (en)
Other versions
FR2427758B3 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Jenaer Glaswerk Schott and Gen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenaer Glaswerk Schott and Gen filed Critical Jenaer Glaswerk Schott and Gen
Publication of FR2427758A1 publication Critical patent/FR2427758A1/fr
Application granted granted Critical
Publication of FR2427758B3 publication Critical patent/FR2427758B3/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4817—Conductive parts for containers, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing
    • Y10T428/31612—As silicone, silane or siloxane

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Boîtier pour l'encapsulage des composants électroniques ou électriques, constitué d'une plaque de base 1 traversée par des conducteurs 2 et d'un capot 4, ce boîtier ayant été revêtu d'une couche améliorant la soudabilité des conducteurs et sa résistance à la corrosion. Les surfaces influençant les propriétés électriques à l'intérieur du boîtier sont revêtues de silanes, et/ou le boîtier est composé de matériaux inhibant la diffusion de l'hydrogène, et/ou la couche améliorant la soudabilité des conducteurs électriques et la résistance à la corrosion du boîtier est déposée par un procédé s'effectuant sans dégagement d'hydrogène. Les composants électroniques ou électriques contenus dans un tel boîtier sont notamment des transistors, des diodes, des thyristors, des circuits intégrés, des quartz oscillateurs ou des relais.
FR7914294A 1978-06-03 1979-06-05 Boitier pour composants electriques et electroniques Granted FR2427758A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2824426A DE2824426C2 (de) 1978-06-03 1978-06-03 Gehäuse zur Kapselung von elektrischen und/oder elektronischen Bauelementen

Publications (2)

Publication Number Publication Date
FR2427758A1 true FR2427758A1 (fr) 1979-12-28
FR2427758B3 FR2427758B3 (fr) 1982-05-14

Family

ID=6040951

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7914294A Granted FR2427758A1 (fr) 1978-06-03 1979-06-05 Boitier pour composants electriques et electroniques

Country Status (6)

Country Link
US (1) US4338486A (fr)
DE (1) DE2824426C2 (fr)
FR (1) FR2427758A1 (fr)
GB (1) GB2023941B (fr)
IT (1) IT1165671B (fr)
NL (1) NL7902744A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2450503A1 (fr) * 1979-03-02 1980-09-26 Texas Instruments Inc Capsule pour semi-conducteur

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2919404C2 (de) * 1979-05-14 1986-04-03 Siemens AG, 1000 Berlin und 8000 München Gehäuse für Halbleiterbauelement
FR2568443B1 (fr) * 1984-07-27 1986-11-14 Cepe Boitier a fermeture a froid supportant les hautes temperatures
DE3936613A1 (de) * 1989-11-03 1991-05-08 Technotron Gmbh & Co Kg Mehrfach verschliessbarers hybridschaltkreisgehaeuse
US6749105B2 (en) * 2002-03-21 2004-06-15 Motorola, Inc. Method and apparatus for securing a metallic substrate to a metallic housing
DE10237904B4 (de) * 2002-06-14 2007-05-31 Ifm Electronic Gmbh Elektronischer Sensor und Baueinheit aus einem elektronischen Sensor und einem Befestigungselement
WO2007089828A2 (fr) * 2006-01-31 2007-08-09 Solidica, Inc. capteurs intelligents cachés mis en réseau et autres circuits totalement encapsulés
US20130167482A1 (en) * 2011-09-08 2013-07-04 Advanced Numicro Systems, Inc. Vacuum sealing process of a mems package

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2814572A (en) * 1955-08-17 1957-11-26 Dow Corning Organosilicon compounds and a method for waterproofing glass and product produced thereby
USB326592I5 (fr) * 1961-03-27
US3586926A (en) * 1967-11-30 1971-06-22 Nippon Electric Co Hermetically sealed semiconductor device with absorptive agent
US3675310A (en) * 1971-04-20 1972-07-11 Us Interior Soldering method
US4177322A (en) * 1978-04-28 1979-12-04 Dow Corning Corporation Method of improving high voltage insulating devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2450503A1 (fr) * 1979-03-02 1980-09-26 Texas Instruments Inc Capsule pour semi-conducteur

Also Published As

Publication number Publication date
US4338486A (en) 1982-07-06
NL7902744A (nl) 1979-12-05
FR2427758B3 (fr) 1982-05-14
GB2023941A (en) 1980-01-03
IT1165671B (it) 1987-04-22
DE2824426A1 (de) 1979-12-06
DE2824426C2 (de) 1982-09-02
GB2023941B (en) 1982-06-30
IT7967928A0 (it) 1979-05-04

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