IT7967928A0 - Involucro per elementi strutturali elettrici ed elettronici - Google Patents

Involucro per elementi strutturali elettrici ed elettronici

Info

Publication number
IT7967928A0
IT7967928A0 IT7967928A IT6792879A IT7967928A0 IT 7967928 A0 IT7967928 A0 IT 7967928A0 IT 7967928 A IT7967928 A IT 7967928A IT 6792879 A IT6792879 A IT 6792879A IT 7967928 A0 IT7967928 A0 IT 7967928A0
Authority
IT
Italy
Prior art keywords
enclosure
electrical
structural elements
electronic structural
electronic
Prior art date
Application number
IT7967928A
Other languages
English (en)
Other versions
IT1165671B (it
Original Assignee
Jenaer Glaswerk Schott & Gen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenaer Glaswerk Schott & Gen filed Critical Jenaer Glaswerk Schott & Gen
Publication of IT7967928A0 publication Critical patent/IT7967928A0/it
Application granted granted Critical
Publication of IT1165671B publication Critical patent/IT1165671B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4817—Conductive parts for containers, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing
    • Y10T428/31612—As silicone, silane or siloxane

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Electroplating Methods And Accessories (AREA)
IT67928/79A 1978-06-03 1979-05-04 Involucro per elementi strutturali elettrici ed elettronici IT1165671B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2824426A DE2824426C2 (de) 1978-06-03 1978-06-03 Gehäuse zur Kapselung von elektrischen und/oder elektronischen Bauelementen

Publications (2)

Publication Number Publication Date
IT7967928A0 true IT7967928A0 (it) 1979-05-04
IT1165671B IT1165671B (it) 1987-04-22

Family

ID=6040951

Family Applications (1)

Application Number Title Priority Date Filing Date
IT67928/79A IT1165671B (it) 1978-06-03 1979-05-04 Involucro per elementi strutturali elettrici ed elettronici

Country Status (6)

Country Link
US (1) US4338486A (it)
DE (1) DE2824426C2 (it)
FR (1) FR2427758A1 (it)
GB (1) GB2023941B (it)
IT (1) IT1165671B (it)
NL (1) NL7902744A (it)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3007141A1 (de) * 1979-03-02 1980-09-11 Texas Instruments Inc Gehaeuse fuer eine halbleitervorrichtung
DE2919404C2 (de) * 1979-05-14 1986-04-03 Siemens AG, 1000 Berlin und 8000 München Gehäuse für Halbleiterbauelement
FR2568443B1 (fr) * 1984-07-27 1986-11-14 Cepe Boitier a fermeture a froid supportant les hautes temperatures
DE3936613A1 (de) * 1989-11-03 1991-05-08 Technotron Gmbh & Co Kg Mehrfach verschliessbarers hybridschaltkreisgehaeuse
US6749105B2 (en) * 2002-03-21 2004-06-15 Motorola, Inc. Method and apparatus for securing a metallic substrate to a metallic housing
DE10237904B4 (de) * 2002-06-14 2007-05-31 Ifm Electronic Gmbh Elektronischer Sensor und Baueinheit aus einem elektronischen Sensor und einem Befestigungselement
US20070177362A1 (en) * 2006-01-31 2007-08-02 Fortson Frederick O Covert intelligent networked sensors and other fully encapsulated circuits
US20130167482A1 (en) * 2011-09-08 2013-07-04 Advanced Numicro Systems, Inc. Vacuum sealing process of a mems package

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2814572A (en) * 1955-08-17 1957-11-26 Dow Corning Organosilicon compounds and a method for waterproofing glass and product produced thereby
USB326592I5 (it) * 1961-03-27
US3586926A (en) * 1967-11-30 1971-06-22 Nippon Electric Co Hermetically sealed semiconductor device with absorptive agent
US3675310A (en) * 1971-04-20 1972-07-11 Us Interior Soldering method
US4177322A (en) * 1978-04-28 1979-12-04 Dow Corning Corporation Method of improving high voltage insulating devices

Also Published As

Publication number Publication date
US4338486A (en) 1982-07-06
NL7902744A (nl) 1979-12-05
DE2824426C2 (de) 1982-09-02
FR2427758A1 (fr) 1979-12-28
IT1165671B (it) 1987-04-22
FR2427758B3 (it) 1982-05-14
GB2023941A (en) 1980-01-03
DE2824426A1 (de) 1979-12-06
GB2023941B (en) 1982-06-30

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