NL7902744A - Huis voor elektrische en elektronische bouwelementen. - Google Patents
Huis voor elektrische en elektronische bouwelementen.Info
- Publication number
- NL7902744A NL7902744A NL7902744A NL7902744A NL7902744A NL 7902744 A NL7902744 A NL 7902744A NL 7902744 A NL7902744 A NL 7902744A NL 7902744 A NL7902744 A NL 7902744A NL 7902744 A NL7902744 A NL 7902744A
- Authority
- NL
- Netherlands
- Prior art keywords
- house
- electrical
- electronic building
- building elements
- elements
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4817—Conductive parts for containers, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31609—Particulate metal or metal compound-containing
- Y10T428/31612—As silicone, silane or siloxane
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Casings For Electric Apparatus (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2824426A DE2824426C2 (de) | 1978-06-03 | 1978-06-03 | Gehäuse zur Kapselung von elektrischen und/oder elektronischen Bauelementen |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7902744A true NL7902744A (nl) | 1979-12-05 |
Family
ID=6040951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7902744A NL7902744A (nl) | 1978-06-03 | 1979-04-06 | Huis voor elektrische en elektronische bouwelementen. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4338486A (xx) |
DE (1) | DE2824426C2 (xx) |
FR (1) | FR2427758A1 (xx) |
GB (1) | GB2023941B (xx) |
IT (1) | IT1165671B (xx) |
NL (1) | NL7902744A (xx) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3007141A1 (de) * | 1979-03-02 | 1980-09-11 | Texas Instruments Inc | Gehaeuse fuer eine halbleitervorrichtung |
DE2919404C2 (de) * | 1979-05-14 | 1986-04-03 | Siemens AG, 1000 Berlin und 8000 München | Gehäuse für Halbleiterbauelement |
FR2568443B1 (fr) * | 1984-07-27 | 1986-11-14 | Cepe | Boitier a fermeture a froid supportant les hautes temperatures |
DE3936613A1 (de) * | 1989-11-03 | 1991-05-08 | Technotron Gmbh & Co Kg | Mehrfach verschliessbarers hybridschaltkreisgehaeuse |
US6749105B2 (en) * | 2002-03-21 | 2004-06-15 | Motorola, Inc. | Method and apparatus for securing a metallic substrate to a metallic housing |
DE10237904B4 (de) * | 2002-06-14 | 2007-05-31 | Ifm Electronic Gmbh | Elektronischer Sensor und Baueinheit aus einem elektronischen Sensor und einem Befestigungselement |
US20070177362A1 (en) * | 2006-01-31 | 2007-08-02 | Fortson Frederick O | Covert intelligent networked sensors and other fully encapsulated circuits |
US20130167482A1 (en) * | 2011-09-08 | 2013-07-04 | Advanced Numicro Systems, Inc. | Vacuum sealing process of a mems package |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2814572A (en) * | 1955-08-17 | 1957-11-26 | Dow Corning | Organosilicon compounds and a method for waterproofing glass and product produced thereby |
USB326592I5 (xx) * | 1961-03-27 | |||
US3586926A (en) * | 1967-11-30 | 1971-06-22 | Nippon Electric Co | Hermetically sealed semiconductor device with absorptive agent |
US3675310A (en) * | 1971-04-20 | 1972-07-11 | Us Interior | Soldering method |
US4177322A (en) * | 1978-04-28 | 1979-12-04 | Dow Corning Corporation | Method of improving high voltage insulating devices |
-
1978
- 1978-06-03 DE DE2824426A patent/DE2824426C2/de not_active Expired
-
1979
- 1979-04-06 NL NL7902744A patent/NL7902744A/xx not_active Application Discontinuation
- 1979-05-04 IT IT67928/79A patent/IT1165671B/it active
- 1979-05-29 GB GB7918524A patent/GB2023941B/en not_active Expired
- 1979-06-01 US US06/044,760 patent/US4338486A/en not_active Expired - Lifetime
- 1979-06-05 FR FR7914294A patent/FR2427758A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
DE2824426A1 (de) | 1979-12-06 |
IT7967928A0 (it) | 1979-05-04 |
GB2023941A (en) | 1980-01-03 |
US4338486A (en) | 1982-07-06 |
IT1165671B (it) | 1987-04-22 |
FR2427758B3 (xx) | 1982-05-14 |
GB2023941B (en) | 1982-06-30 |
FR2427758A1 (fr) | 1979-12-28 |
DE2824426C2 (de) | 1982-09-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
DNT | Communications of changes of names of applicants whose applications have been laid open to public inspection |
Free format text: SCHOTT GLASWERKE |
|
A85 | Still pending on 85-01-01 | ||
BV | The patent application has lapsed |