ES8704038A1 - Dispositivo de circuito integrado. - Google Patents

Dispositivo de circuito integrado.

Info

Publication number
ES8704038A1
ES8704038A1 ES546383A ES546383A ES8704038A1 ES 8704038 A1 ES8704038 A1 ES 8704038A1 ES 546383 A ES546383 A ES 546383A ES 546383 A ES546383 A ES 546383A ES 8704038 A1 ES8704038 A1 ES 8704038A1
Authority
ES
Spain
Prior art keywords
diffusion barrier
circuit devices
integrated
barrier layer
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES546383A
Other languages
English (en)
Other versions
ES546383A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Publication of ES8704038A1 publication Critical patent/ES8704038A1/es
Publication of ES546383A0 publication Critical patent/ES546383A0/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53214—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
    • H01L23/53223—Additional layers associated with aluminium layers, e.g. adhesion, barrier, cladding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

ESTRUCTURAS DE METALIZACION UTILIZADAS EN DISPOSITIVOS DE TIPO SEMICONDUCTOR DE OXIDO METALICO. CONSTAN DE UN CUERPO DE SILICIO (10) QUE INCLUYE UNA REGION DE SILICIO (12) DE TIPO P QUE TIENE UNA REGION DE ALIMENTACION (14) DE TIPO NB CONVENCIONAL FORMADA EN LA MISMA; DE UNA CAPA (16) DE SILICIURO METALICO REFRACTARIO SUPERYACENTE SOBRE LA REGION DE ALIMENTACION (14); DE UNA CAPA DIELECTRICA MODELADA DE DIOXIDO DE SILICIO, DOPADO CON FOSFORO, QUE COMPRENDE DOS REGIONES (18, 20); Y DE UNA CAPA DE BARRERA (24) DE CARBONITRURO DE TITANIO QUE COMPRENDE UN MATERIAL DE BAJA RESISTENCIA, TERMICAMENTE ESTABLE, QUE ESTA INTERPUESTA ENTRE UNA CAPA DE ALUMINIO (22) Y LA CAPA DE SILICIURO (16). DE APLICACION EN DISPOSITIVOS MOS.-
ES546383A 1984-08-27 1985-08-23 Dispositivo de circuito integrado. Expired ES8704038A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64445984A 1984-08-27 1984-08-27

Publications (2)

Publication Number Publication Date
ES8704038A1 true ES8704038A1 (es) 1987-03-01
ES546383A0 ES546383A0 (es) 1987-03-01

Family

ID=24585000

Family Applications (1)

Application Number Title Priority Date Filing Date
ES546383A Expired ES8704038A1 (es) 1984-08-27 1985-08-23 Dispositivo de circuito integrado.

Country Status (8)

Country Link
EP (1) EP0192646B1 (es)
JP (1) JPH065733B2 (es)
KR (1) KR920009916B1 (es)
CA (1) CA1241457A (es)
DE (1) DE3574528D1 (es)
ES (1) ES8704038A1 (es)
IE (1) IE56850B1 (es)
WO (1) WO1986001640A1 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3663871D1 (en) * 1985-04-11 1989-07-13 Siemens Ag Integrated semiconductor circuit having an aluminium or aluminium alloy contact conductor path and an intermediate tantalum silicide layer as a diffusion barrier
JPH081950B2 (ja) * 1986-11-21 1996-01-10 株式会社東芝 半導体装置の製造方法
JPH01298765A (ja) * 1988-05-27 1989-12-01 Fujitsu Ltd 半導体装置及びその製造方法
KR920005242A (ko) * 1990-08-20 1992-03-28 김광호 게이트-절연체-반도체의 구조를 가지는 트랜지스터의 제조방법
EP0551117A2 (en) * 1992-01-08 1993-07-14 Mitsubishi Denki Kabushiki Kaisha Large scale integrated circuit device and thin film forming method and apparatus for the same
US6081034A (en) 1992-06-12 2000-06-27 Micron Technology, Inc. Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
KR0147626B1 (ko) * 1995-03-30 1998-11-02 김광호 타이타늄 카본 나이트라이드 게이트전극 형성방법
US5663088A (en) * 1995-05-19 1997-09-02 Micron Technology, Inc. Method of forming a Ta2 O5 dielectric layer with amorphous diffusion barrier layer and method of forming a capacitor having a Ta2 O5 dielectric layer and amorphous diffusion barrier layer
JP2675775B2 (ja) * 1996-08-08 1997-11-12 株式会社東芝 半導体装置
US5942799A (en) * 1997-11-20 1999-08-24 Novellus Systems, Inc. Multilayer diffusion barriers
US6051879A (en) 1997-12-16 2000-04-18 Micron Technology, Inc. Electrical interconnection for attachment to a substrate
US6534404B1 (en) 1999-11-24 2003-03-18 Novellus Systems, Inc. Method of depositing diffusion barrier for copper interconnect in integrated circuit

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3906540A (en) * 1973-04-02 1975-09-16 Nat Semiconductor Corp Metal-silicide Schottky diode employing an aluminum connector
JPS5877257A (ja) * 1981-11-04 1983-05-10 Hitachi Ltd 超高信頼性電極

Also Published As

Publication number Publication date
IE56850B1 (en) 1992-01-01
WO1986001640A1 (en) 1986-03-13
KR920009916B1 (ko) 1992-11-06
DE3574528D1 (de) 1990-01-04
EP0192646B1 (en) 1989-11-29
IE852091L (en) 1986-02-27
JPS62500060A (ja) 1987-01-08
EP0192646A1 (en) 1986-09-03
JPH065733B2 (ja) 1994-01-19
CA1241457A (en) 1988-08-30
ES546383A0 (es) 1987-03-01
KR860700312A (ko) 1986-08-01

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