FR2371714A1 - Procede pour delimiter une surface sur un substrat, a l'aide d'un cache durcissable par irradiation, et article obtenu - Google Patents

Procede pour delimiter une surface sur un substrat, a l'aide d'un cache durcissable par irradiation, et article obtenu

Info

Publication number
FR2371714A1
FR2371714A1 FR7724367A FR7724367A FR2371714A1 FR 2371714 A1 FR2371714 A1 FR 2371714A1 FR 7724367 A FR7724367 A FR 7724367A FR 7724367 A FR7724367 A FR 7724367A FR 2371714 A1 FR2371714 A1 FR 2371714A1
Authority
FR
France
Prior art keywords
substrate
delimitate
article obtained
resist
irradiation curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7724367A
Other languages
English (en)
French (fr)
Other versions
FR2371714B1 (US08080257-20111220-C00005.png
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of FR2371714A1 publication Critical patent/FR2371714A1/fr
Application granted granted Critical
Publication of FR2371714B1 publication Critical patent/FR2371714B1/fr
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Electron Beam Exposure (AREA)
FR7724367A 1976-08-06 1977-08-08 Procede pour delimiter une surface sur un substrat, a l'aide d'un cache durcissable par irradiation, et article obtenu Granted FR2371714A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71239476A 1976-08-06 1976-08-06

Publications (2)

Publication Number Publication Date
FR2371714A1 true FR2371714A1 (fr) 1978-06-16
FR2371714B1 FR2371714B1 (US08080257-20111220-C00005.png) 1980-07-11

Family

ID=24861928

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7724367A Granted FR2371714A1 (fr) 1976-08-06 1977-08-08 Procede pour delimiter une surface sur un substrat, a l'aide d'un cache durcissable par irradiation, et article obtenu

Country Status (11)

Country Link
US (1) US4130424A (US08080257-20111220-C00005.png)
JP (1) JPS5320771A (US08080257-20111220-C00005.png)
BE (1) BE857537A (US08080257-20111220-C00005.png)
CA (1) CA1088737A (US08080257-20111220-C00005.png)
DE (1) DE2735377C2 (US08080257-20111220-C00005.png)
ES (1) ES461397A1 (US08080257-20111220-C00005.png)
FR (1) FR2371714A1 (US08080257-20111220-C00005.png)
GB (1) GB1588892A (US08080257-20111220-C00005.png)
IT (1) IT1086540B (US08080257-20111220-C00005.png)
NL (1) NL170775C (US08080257-20111220-C00005.png)
SE (1) SE420244B (US08080257-20111220-C00005.png)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2352007A1 (fr) * 1976-05-21 1977-12-16 Thomson Csf Resine sensible aux electrons et procede de fabrication de ladite resine
FR2382709A1 (fr) * 1977-03-04 1978-09-29 Thomson Csf Famille de composes comportant un cycle thiirane, reticulables par irradiation photonique
US4279986A (en) * 1977-06-01 1981-07-21 Nippon Electric Co., Ltd. Negative resist and radical scavenger composition with capability of preventing post-irradiation polymerization
CS193322B1 (en) * 1977-11-07 1979-10-31 Jaroslav Kalal Electron resisit
US4208211A (en) * 1978-05-23 1980-06-17 Bell Telephone Laboratories, Incorporated Fabrication based on radiation sensitive resists and related products
US4225664A (en) * 1979-02-22 1980-09-30 Bell Telephone Laboratories, Incorporated X-ray resist containing poly(2,3-dichloro-1-propyl acrylate) and poly(glycidyl methacrylate-co-ethyl acrylate)
JPS5629231A (en) * 1979-08-17 1981-03-24 Hitachi Ltd Radiation sensitive material and pattern forming method
US4262081A (en) * 1979-11-21 1981-04-14 Bell Telephone Laboratories, Incorporated Fabrication based on radiation sensitive resists of halo-alkyl styrene polymers
US4332881A (en) * 1980-07-28 1982-06-01 Bell Telephone Laboratories, Incorporated Resist adhesion in integrated circuit processing
US4430419A (en) * 1981-01-22 1984-02-07 Nippon Telegraph & Telephone Public Corporation Positive resist and method for manufacturing a pattern thereof
DE3109728C2 (de) * 1981-03-13 1986-08-14 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von Resiststrukturen
DE3109809C2 (de) * 1981-03-13 1986-07-31 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von Resiststrukturen
JPS58168047A (ja) * 1982-03-30 1983-10-04 Somar Corp 感光性材料
US4511757A (en) * 1983-07-13 1985-04-16 At&T Technologies, Inc. Circuit board fabrication leading to increased capacity
US4628022A (en) * 1983-07-13 1986-12-09 At&T Technologies, Inc. Multilayer circuit board fabrication process and polymer insulator used therein
US4795693A (en) * 1983-07-13 1989-01-03 American Telephone And Telegraph Company, At&T Technologies, Inc. Multilayer circuit board fabrication process
JPS6039351U (ja) * 1983-08-27 1985-03-19 株式会社新潟工器 消雪ノズル
JPS6071368U (ja) * 1983-10-25 1985-05-20 株式会社新潟工器 消雪用ノズル
GB2163435B (en) * 1984-07-11 1987-07-22 Asahi Chemical Ind Image-forming materials sensitive to high-energy beam
JPS61104988A (ja) * 1984-10-24 1986-05-23 ダウ化工株式会社 蓄熱水槽の構造
US5024969A (en) * 1990-02-23 1991-06-18 Reche John J Hybrid circuit structure fabrication methods using high energy electron beam curing
US5565538A (en) * 1994-09-21 1996-10-15 Great Lakes Chemical Corporation Dibromostyrene-glycidyl(meth)acrylate copolymers
DE19813670C1 (de) 1998-03-27 1999-07-08 Daimler Chrysler Ag Kraftfahrzeug mit einer den Rücksitzbereich vom Vordersitzbereich abtrennenden Trennwand
US7198882B2 (en) * 2001-11-20 2007-04-03 Eastman Kodak Company Adhesion promoting polymeric materials and planographic printing elements containing them
GB0127713D0 (en) * 2001-11-20 2002-01-09 Eastman Kodak Co Adhesion promoting polymeric materials and planographic printing elements containing them
EP2343597B1 (en) * 2003-04-02 2015-08-05 Nissan Chemical Industries, Ltd. Use of an underlayer coating forming composition for lithography
US9002497B2 (en) * 2003-07-03 2015-04-07 Kla-Tencor Technologies Corp. Methods and systems for inspection of wafers and reticles using designer intent data

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1423760A (fr) * 1963-10-25 1966-01-07 Kalle Ag Matériel photosensible pour la réalisation photomécanique de formes d'impression et son procédé de fabrication
FR1507602A (fr) * 1966-01-07 1967-12-29 Kalle Ag Couche de reproduction photosensible
US3885060A (en) * 1968-08-23 1975-05-20 Hitachi Ltd Production of insolubilized organic polymers
FR2341904A1 (fr) * 1976-02-18 1977-09-16 Hitachi Ltd Matiere sensible aux radiations et procede de son utilisation

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1032392A (en) * 1973-10-23 1978-06-06 Eugene D. Feit High energy radiation curable resist and preparatory process
US3916035A (en) * 1973-11-05 1975-10-28 Texas Instruments Inc Epoxy-polymer electron beam resists
US3931435A (en) * 1974-12-20 1976-01-06 International Business Machines Corporation Electron beam positive resists containing acetate polymers

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1423760A (fr) * 1963-10-25 1966-01-07 Kalle Ag Matériel photosensible pour la réalisation photomécanique de formes d'impression et son procédé de fabrication
FR1507602A (fr) * 1966-01-07 1967-12-29 Kalle Ag Couche de reproduction photosensible
US3885060A (en) * 1968-08-23 1975-05-20 Hitachi Ltd Production of insolubilized organic polymers
FR2341904A1 (fr) * 1976-02-18 1977-09-16 Hitachi Ltd Matiere sensible aux radiations et procede de son utilisation

Also Published As

Publication number Publication date
SE420244B (sv) 1981-09-21
BE857537A (fr) 1977-12-01
JPS5320771A (en) 1978-02-25
DE2735377C2 (de) 1983-06-23
NL170775C (nl) 1982-12-16
FR2371714B1 (US08080257-20111220-C00005.png) 1980-07-11
CA1088737A (en) 1980-11-04
GB1588892A (en) 1981-04-29
IT1086540B (it) 1985-05-28
SE7708681L (sv) 1978-02-07
DE2735377A1 (de) 1978-02-09
NL7708693A (nl) 1978-02-08
JPS5751654B2 (US08080257-20111220-C00005.png) 1982-11-02
US4130424A (en) 1978-12-19
NL170775B (nl) 1982-07-16
ES461397A1 (es) 1979-05-16

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