FR2288391B1 - - Google Patents

Info

Publication number
FR2288391B1
FR2288391B1 FR7531393A FR7531393A FR2288391B1 FR 2288391 B1 FR2288391 B1 FR 2288391B1 FR 7531393 A FR7531393 A FR 7531393A FR 7531393 A FR7531393 A FR 7531393A FR 2288391 B1 FR2288391 B1 FR 2288391B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7531393A
Other versions
FR2288391A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2288391A1 publication Critical patent/FR2288391A1/fr
Application granted granted Critical
Publication of FR2288391B1 publication Critical patent/FR2288391B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0804—Emitter regions of bipolar transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
    • H01L21/2251—Diffusion into or out of group IV semiconductors
    • H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
    • H01L21/2257—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer being silicon or silicide or SIPOS, e.g. polysilicon, porous silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/36—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the concentration or distribution of impurities in the bulk material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/024—Defect control-gettering and annealing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/122—Polycrystalline
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/124—Polycrystalline emitter
FR7531393A 1974-10-18 1975-10-14 Procede pour la realisation d'une zone dopee d'un type de conductibilite dans un corps semi-conducteur, ainsi qu'un transistor fabrique selon ce procede Granted FR2288391A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2449688A DE2449688C3 (de) 1974-10-18 1974-10-18 Verfahren zur Herstellung einer dotierten Zone eines Leitfähigkeitstyps in einem Halbleiterkörper

Publications (2)

Publication Number Publication Date
FR2288391A1 FR2288391A1 (fr) 1976-05-14
FR2288391B1 true FR2288391B1 (fr) 1982-10-01

Family

ID=5928640

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7531393A Granted FR2288391A1 (fr) 1974-10-18 1975-10-14 Procede pour la realisation d'une zone dopee d'un type de conductibilite dans un corps semi-conducteur, ainsi qu'un transistor fabrique selon ce procede

Country Status (7)

Country Link
US (1) US4063967A (fr)
JP (1) JPS5952533B2 (fr)
CA (1) CA1055620A (fr)
DE (1) DE2449688C3 (fr)
FR (1) FR2288391A1 (fr)
GB (1) GB1464801A (fr)
IT (1) IT1043400B (fr)

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JPS5290273A (en) * 1976-01-23 1977-07-29 Hitachi Ltd Semiconductor device
NL7604445A (nl) * 1976-04-27 1977-10-31 Philips Nv Werkwijze ter vervaardiging van een halfgelei- derinrichting, en inrichting vervaardigd door toepassing van de werkwijze.
DE2627855A1 (de) * 1976-06-22 1977-12-29 Siemens Ag Halbleiterbauelement mit wenigstens zwei, einen pn-uebergang bildenden zonen unterschiedlichen leitungstyps sowie verfahren zu dessen herstellung
NL7710635A (nl) * 1977-09-29 1979-04-02 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting.
JPS5467778A (en) * 1977-11-10 1979-05-31 Toshiba Corp Production of semiconductor device
US4190466A (en) * 1977-12-22 1980-02-26 International Business Machines Corporation Method for making a bipolar transistor structure utilizing self-passivating diffusion sources
US4118250A (en) * 1977-12-30 1978-10-03 International Business Machines Corporation Process for producing integrated circuit devices by ion implantation
US4155779A (en) * 1978-08-21 1979-05-22 Bell Telephone Laboratories, Incorporated Control techniques for annealing semiconductors
US4214918A (en) * 1978-10-12 1980-07-29 Stanford University Method of forming polycrystalline semiconductor interconnections, resistors and contacts by applying radiation beam
US4274892A (en) * 1978-12-14 1981-06-23 Trw Inc. Dopant diffusion method of making semiconductor products
JPS5586151A (en) * 1978-12-23 1980-06-28 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacture of semiconductor integrated circuit
JPS55138877A (en) * 1979-04-17 1980-10-30 Seiko Instr & Electronics Ltd Method of fabricating semiconductor device
JPS5826829B2 (ja) * 1979-08-30 1983-06-06 富士通株式会社 ダイナミックメモリセルの製造方法
JPS5638815A (en) * 1979-09-07 1981-04-14 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacture of semiconductor device
US4452645A (en) * 1979-11-13 1984-06-05 International Business Machines Corporation Method of making emitter regions by implantation through a non-monocrystalline layer
DE3064143D1 (en) * 1979-12-03 1983-08-18 Ibm Process for producing a vertical pnp transistor and transistor so produced
US4534806A (en) * 1979-12-03 1985-08-13 International Business Machines Corporation Method for manufacturing vertical PNP transistor with shallow emitter
US4389255A (en) * 1980-01-14 1983-06-21 Burroughs Corporation Method of forming buried collector for bipolar transistor in a semiconductor by selective implantation of poly-si followed by oxidation and etch-off
US4485552A (en) * 1980-01-18 1984-12-04 International Business Machines Corporation Complementary transistor structure and method for manufacture
US4301588A (en) * 1980-02-01 1981-11-24 International Business Machines Corporation Consumable amorphous or polysilicon emitter process
US4803528A (en) * 1980-07-28 1989-02-07 General Electric Company Insulating film having electrically conducting portions
US4339285A (en) * 1980-07-28 1982-07-13 Rca Corporation Method for fabricating adjacent conducting and insulating regions in a film by laser irradiation
US4411708A (en) * 1980-08-25 1983-10-25 Trw Inc. Method of making precision doped polysilicon vertical ballast resistors by multiple implantations
JPS5766674A (en) * 1980-10-09 1982-04-22 Toshiba Corp Semiconductor device
JPS5931556Y2 (ja) * 1980-11-28 1984-09-06 功 田中 農作物の収納用網袋
JPS5793525A (en) * 1980-12-03 1982-06-10 Nec Corp Manufacture of semiconductor device
US4391651A (en) * 1981-10-15 1983-07-05 The United States Of America As Represented By The Secretary Of The Navy Method of forming a hyperabrupt interface in a GaAs substrate
JPS58122724A (ja) * 1982-01-18 1983-07-21 Toshiba Corp 半導体素子の製造方法
JPS59500296A (ja) * 1982-02-26 1984-02-23 ウエスタ−ン　エレクトリツク　カムパニ−，インコ−ポレ−テツド 半導体デバイスの製造方法
US4472212A (en) * 1982-02-26 1984-09-18 At&T Bell Laboratories Method for fabricating a semiconductor device
JPS58188157A (ja) * 1982-04-28 1983-11-02 Toshiba Corp 半導体装置およびその製造方法
CA1198226A (fr) * 1982-06-01 1985-12-17 Eliezer Kinsbron Methode de fabrication d'un dispositif semiconducteur
US4471524A (en) * 1982-06-01 1984-09-18 At&T Bell Laboratories Method for manufacturing an insulated gate field effect transistor device
US4888297A (en) * 1982-09-20 1989-12-19 International Business Machines Corporation Process for making a contact structure including polysilicon and metal alloys
GB2130793B (en) * 1982-11-22 1986-09-03 Gen Electric Co Plc Forming a doped region in a semiconductor body
JPS59113619A (ja) * 1982-12-20 1984-06-30 Matsushita Electronics Corp 半導体装置の製造方法
JPS59186367A (ja) * 1983-04-06 1984-10-23 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS6068611A (ja) * 1983-09-26 1985-04-19 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US4569701A (en) * 1984-04-05 1986-02-11 At&T Bell Laboratories Technique for doping from a polysilicon transfer layer
US4694561A (en) * 1984-11-30 1987-09-22 American Telephone And Telegraph Company, At&T Bell Laboratories Method of making high-performance trench capacitors for DRAM cells
US4898838A (en) * 1985-10-16 1990-02-06 Texas Instruments Incorporated Method for fabricating a poly emitter logic array
JPS6293929A (ja) * 1985-10-21 1987-04-30 Toshiba Corp 半導体装置の製造方法
JPS62208638A (ja) * 1986-03-07 1987-09-12 Toshiba Corp 半導体装置の製造方法
JP2695185B2 (ja) * 1988-05-02 1997-12-24 株式会社日立製作所 半導体集積回路装置及びその製造方法
JP2508818B2 (ja) * 1988-10-03 1996-06-19 三菱電機株式会社 半導体装置の製造方法
JPH0744275B2 (ja) * 1988-10-06 1995-05-15 日本電気株式会社 高耐圧ｍｏｓ型半導体装置の製造方法
US5028973A (en) * 1989-06-19 1991-07-02 Harris Corporation Bipolar transistor with high efficient emitter
US5188978A (en) * 1990-03-02 1993-02-23 International Business Machines Corporation Controlled silicon doping of III-V compounds by thermal oxidation of silicon capping layer
US5296388A (en) * 1990-07-13 1994-03-22 Matsushita Electric Industrial Co., Ltd. Fabrication method for semiconductor devices
JPH04199507A (ja) * 1990-11-28 1992-07-20 Mitsubishi Electric Corp ３―Ｖ族化合物半導体へのｎ型不純物固相拡散方法
DE59409300D1 (de) * 1993-06-23 2000-05-31 Siemens Ag Verfahren zur Herstellung von einem Isolationsgraben in einem Substrat für Smart-Power-Technologien
JPH07142419A (ja) * 1993-11-15 1995-06-02 Toshiba Corp 半導体装置の製造方法
US6451644B1 (en) * 1998-11-06 2002-09-17 Advanced Micro Devices, Inc. Method of providing a gate conductor with high dopant activation

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
US3460007A (en) * 1967-07-03 1969-08-05 Rca Corp Semiconductor junction device
US3558374A (en) * 1968-01-15 1971-01-26 Ibm Polycrystalline film having controlled grain size and method of making same
JPS4826179B1 (fr) * 1968-09-30 1973-08-07
US3548233A (en) * 1968-11-29 1970-12-15 Rca Corp Charge storage device with pn junction diode array target having semiconductor contact pads
US3717507A (en) * 1969-06-19 1973-02-20 Shibaura Electric Co Ltd Method of manufacturing semiconductor devices utilizing ion-implantation and arsenic diffusion
US3664896A (en) * 1969-07-28 1972-05-23 David M Duncan Deposited silicon diffusion sources
US3764413A (en) * 1970-11-25 1973-10-09 Nippon Electric Co Method of producing insulated gate field effect transistors
US3775191A (en) * 1971-06-28 1973-11-27 Bell Canada Northern Electric Modification of channel regions in insulated gate field effect transistors
JPS5217747B2 (fr) * 1971-08-09 1977-05-17
JPS4855663A (fr) * 1971-11-10 1973-08-04
JPS499186A (fr) * 1972-05-11 1974-01-26
US3928095A (en) * 1972-11-08 1975-12-23 Suwa Seikosha Kk Semiconductor device and process for manufacturing same

Also Published As

Publication number Publication date
DE2449688A1 (de) 1976-04-22
GB1464801A (en) 1977-02-16
JPS5165561A (fr) 1976-06-07
DE2449688C3 (de) 1980-07-10
US4063967A (en) 1977-12-20
JPS5952533B2 (ja) 1984-12-20
FR2288391A1 (fr) 1976-05-14
DE2449688B2 (de) 1979-10-04
IT1043400B (it) 1980-02-20
CA1055620A (fr) 1979-05-29

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