FR2279222A1 - Procede pour doper une couche semiconductrice - Google Patents
Procede pour doper une couche semiconductriceInfo
- Publication number
- FR2279222A1 FR2279222A1 FR7521062A FR7521062A FR2279222A1 FR 2279222 A1 FR2279222 A1 FR 2279222A1 FR 7521062 A FR7521062 A FR 7521062A FR 7521062 A FR7521062 A FR 7521062A FR 2279222 A1 FR2279222 A1 FR 2279222A1
- Authority
- FR
- France
- Prior art keywords
- doping
- semiconductor layer
- semiconductor
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
- H10P34/20—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices for inducing a nuclear reaction transmuting chemical elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/165—Transmutation doping
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2433991A DE2433991A1 (de) | 1974-07-15 | 1974-07-15 | Verfahren zum dotieren einer halbleiterschicht |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2279222A1 true FR2279222A1 (fr) | 1976-02-13 |
| FR2279222B1 FR2279222B1 (enExample) | 1979-04-06 |
Family
ID=5920613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7521062A Granted FR2279222A1 (fr) | 1974-07-15 | 1975-07-04 | Procede pour doper une couche semiconductrice |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3967982A (enExample) |
| JP (1) | JPS5140074A (enExample) |
| BE (1) | BE831381A (enExample) |
| DE (1) | DE2433991A1 (enExample) |
| FR (1) | FR2279222A1 (enExample) |
| IT (1) | IT1039205B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2552621C3 (de) * | 1975-11-24 | 1979-09-13 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum Herstellen von n-dotierten Siliciumeinkristallen mit in radialer Richtung tellerförmigem Profil des spezifischen Widerstandes |
| US4277307A (en) * | 1977-10-17 | 1981-07-07 | Siemens Aktiengesellschaft | Method of restoring Si crystal lattice order after neutron irradiation |
| DE2753488C2 (de) * | 1977-12-01 | 1986-06-19 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen | Verfahren zur Herstellung von n-dotiertem Silicium durch Neutronenbestrahlung |
| US4278475A (en) * | 1979-01-04 | 1981-07-14 | Westinghouse Electric Corp. | Forming of contoured irradiated regions in materials such as semiconductor bodies by nuclear radiation |
| US4348351A (en) * | 1980-04-21 | 1982-09-07 | Monsanto Company | Method for producing neutron doped silicon having controlled dopant variation |
| DE3044723C2 (de) * | 1980-11-27 | 1984-01-26 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung eines mit einer niederohmigen aktiven Halbleiterschicht versehenen hochohmigen Substratkörpers |
| JPS57210635A (en) * | 1981-06-19 | 1982-12-24 | Tokyo Daigaku | Manufacture of semiconductor device |
| US4526624A (en) * | 1982-07-02 | 1985-07-02 | California Institute Of Technology | Enhanced adhesion of films to semiconductors or metals by high energy bombardment |
| DE3511363A1 (de) * | 1985-03-28 | 1986-10-09 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von bereichen mit einstellbarer, gleichfoermiger dotierung in siliziumkristallscheiben durch neutronenbestrahlung sowie verwendung dieses verfahrens zur herstellung von leistungsthyristoren |
| DE3714357C2 (de) * | 1986-04-30 | 1994-02-03 | Toshiba Ceramics Co | Siliciumwafer und Verfahren zu dessen Herstellung und Siliziumwafer-Auswahleinrichtung |
| DE3942387A1 (de) * | 1989-12-21 | 1991-06-27 | Florian Fischer | Transportsystem, insbesondere zum transportieren von siliziumeinkristallen durch das becken eines forschungsreaktors |
| US5212100A (en) * | 1991-12-04 | 1993-05-18 | Texas Instruments Incorporated | P-well CMOS process using neutron activated doped N-/N+ silicon substrates |
| TW330318B (en) * | 1997-01-28 | 1998-04-21 | Ind Tech Res Inst | The BJT device and its producing method |
| US6372041B1 (en) | 1999-01-08 | 2002-04-16 | Gan Semiconductor Inc. | Method and apparatus for single crystal gallium nitride (GaN) bulk synthesis |
| WO2001004940A1 (en) * | 1999-07-13 | 2001-01-18 | Gan Semiconductor, Inc. | Method for doping gallium nitride (gan) substrates and the resulting doped gan substrate |
| GB9916370D0 (en) * | 1999-07-14 | 1999-09-15 | Koninkl Philips Electronics Nv | Manufacture of semiconductor devices and material |
| US9887087B1 (en) * | 2014-07-08 | 2018-02-06 | Michael Keith Fuller | Semiconductor and other materials by thermal neutron transmutation |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1194374A (enExample) * | 1957-04-12 | 1959-11-09 | ||
| DE1948884B2 (de) * | 1969-09-27 | 1971-09-30 | Verfahren zum beseitigen von inversionsschichten |
-
1974
- 1974-07-15 DE DE2433991A patent/DE2433991A1/de active Pending
-
1975
- 1975-07-04 FR FR7521062A patent/FR2279222A1/fr active Granted
- 1975-07-11 US US05/595,150 patent/US3967982A/en not_active Expired - Lifetime
- 1975-07-11 IT IT25306/75A patent/IT1039205B/it active
- 1975-07-15 BE BE158309A patent/BE831381A/xx unknown
- 1975-07-15 JP JP50086606A patent/JPS5140074A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5140074A (enExample) | 1976-04-03 |
| IT1039205B (it) | 1979-12-10 |
| DE2433991A1 (de) | 1976-02-05 |
| BE831381A (fr) | 1975-11-03 |
| US3967982A (en) | 1976-07-06 |
| FR2279222B1 (enExample) | 1979-04-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |