BE783938A - Procede pour eliminer les proeminences sur une surface de semi-conducteur - Google Patents
Procede pour eliminer les proeminences sur une surface de semi-conducteurInfo
- Publication number
- BE783938A BE783938A BE783938A BE783938A BE783938A BE 783938 A BE783938 A BE 783938A BE 783938 A BE783938 A BE 783938A BE 783938 A BE783938 A BE 783938A BE 783938 A BE783938 A BE 783938A
- Authority
- BE
- Belgium
- Prior art keywords
- proeminences
- eliminating
- semiconductor surface
- semiconductor
- eliminating proeminences
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
- H01L21/30608—Anisotropic liquid etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/051—Etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/106—Masks, special
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Weting (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14808171A | 1971-05-28 | 1971-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE783938A true BE783938A (fr) | 1972-09-18 |
Family
ID=22524177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE783938A BE783938A (fr) | 1971-05-28 | 1972-05-25 | Procede pour eliminer les proeminences sur une surface de semi-conducteur |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US3718514A (fr) |
| JP (1) | JPS51427B1 (fr) |
| BE (1) | BE783938A (fr) |
| CA (1) | CA921374A (fr) |
| CH (1) | CH541230A (fr) |
| DE (1) | DE2225366C3 (fr) |
| FR (1) | FR2139975B1 (fr) |
| GB (1) | GB1389941A (fr) |
| HK (1) | HK35676A (fr) |
| IT (1) | IT958953B (fr) |
| NL (1) | NL7207145A (fr) |
| SE (1) | SE379213B (fr) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2431647C3 (de) * | 1974-07-02 | 1982-04-22 | Robert Bosch Gmbh, 7000 Stuttgart | Verfahren zum Entfernen von Vorsprüngen an der Oberfläche einer epitaktischen Halbleiterschicht |
| US3990925A (en) * | 1975-03-31 | 1976-11-09 | Bell Telephone Laboratories, Incorporated | Removal of projections on epitaxial layers |
| US4238275A (en) * | 1978-12-29 | 1980-12-09 | International Business Machines Corporation | Pyrocatechol-amine-water solution for the determination of defects |
| JPS5612723A (en) * | 1979-07-11 | 1981-02-07 | Fujitsu Ltd | Manufacture of semiconductor device |
| US4515652A (en) * | 1984-03-20 | 1985-05-07 | Harris Corporation | Plasma sculpturing with a non-planar sacrificial layer |
| FR2578107A1 (fr) * | 1985-02-26 | 1986-08-29 | Socem | Dispositif de connexion et de support, notamment pour le raccordement de lignes electriques |
| US4789646A (en) * | 1987-07-20 | 1988-12-06 | North American Philips Corporation, Signetics Division Company | Method for selective surface treatment of semiconductor structures |
| US5387316A (en) * | 1992-12-09 | 1995-02-07 | Motorola, Inc. | Wafer etch protection method |
-
1971
- 1971-05-28 US US00148081A patent/US3718514A/en not_active Expired - Lifetime
- 1971-12-06 CA CA129401A patent/CA921374A/en not_active Expired
-
1972
- 1972-05-19 SE SE7206604A patent/SE379213B/xx unknown
- 1972-05-23 IT IT68633/72A patent/IT958953B/it active
- 1972-05-24 CH CH762572A patent/CH541230A/de not_active IP Right Cessation
- 1972-05-25 BE BE783938A patent/BE783938A/fr unknown
- 1972-05-25 GB GB2467872A patent/GB1389941A/en not_active Expired
- 1972-05-25 DE DE2225366A patent/DE2225366C3/de not_active Expired
- 1972-05-26 NL NL7207145A patent/NL7207145A/xx unknown
- 1972-05-26 FR FR7218928A patent/FR2139975B1/fr not_active Expired
- 1972-05-29 JP JP47052589A patent/JPS51427B1/ja active Pending
-
1976
- 1976-06-10 HK HK356/76*UA patent/HK35676A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| HK35676A (en) | 1976-06-18 |
| JPS51427B1 (fr) | 1976-01-08 |
| FR2139975B1 (fr) | 1977-04-01 |
| IT958953B (it) | 1973-10-30 |
| CH541230A (de) | 1973-08-31 |
| US3718514A (en) | 1973-02-27 |
| NL7207145A (fr) | 1972-11-30 |
| GB1389941A (en) | 1975-04-09 |
| DE2225366C3 (de) | 1974-06-27 |
| DE2225366A1 (de) | 1972-12-14 |
| SE379213B (fr) | 1975-09-29 |
| FR2139975A1 (fr) | 1973-01-12 |
| CA921374A (en) | 1973-02-20 |
| DE2225366B2 (de) | 1973-11-22 |
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