FR2203890A1 - - Google Patents

Info

Publication number
FR2203890A1
FR2203890A1 FR7337216A FR7337216A FR2203890A1 FR 2203890 A1 FR2203890 A1 FR 2203890A1 FR 7337216 A FR7337216 A FR 7337216A FR 7337216 A FR7337216 A FR 7337216A FR 2203890 A1 FR2203890 A1 FR 2203890A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7337216A
Other languages
French (fr)
Other versions
FR2203890B1 (sv
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of FR2203890A1 publication Critical patent/FR2203890A1/fr
Application granted granted Critical
Publication of FR2203890B1 publication Critical patent/FR2203890B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
FR7337216A 1972-10-19 1973-10-18 Expired FR2203890B1 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29885672A 1972-10-19 1972-10-19

Publications (2)

Publication Number Publication Date
FR2203890A1 true FR2203890A1 (sv) 1974-05-17
FR2203890B1 FR2203890B1 (sv) 1976-07-23

Family

ID=23152265

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7337216A Expired FR2203890B1 (sv) 1972-10-19 1973-10-18

Country Status (9)

Country Link
US (1) US3798141A (sv)
JP (1) JPS4974140A (sv)
BE (1) BE806230A (sv)
CA (1) CA1026704A (sv)
DE (1) DE2351664B2 (sv)
FR (1) FR2203890B1 (sv)
GB (1) GB1408352A (sv)
IT (1) IT999661B (sv)
NL (1) NL157062B (sv)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2739727A1 (de) * 1976-09-03 1978-03-16 Philips Nv Verfahren zur herstellung eines mit einem goldmuster versehenen koerpers

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3898141A (en) * 1974-02-08 1975-08-05 Bell Telephone Labor Inc Electrolytic oxidation and etching of III-V compound semiconductors
GB1539309A (en) * 1976-12-14 1979-01-31 Inoue Japax Res Electrochemical polishing
US4206028A (en) * 1976-12-14 1980-06-03 Inoue-Japax Research Incorporated Electrochemical polishing system
DE3029277C2 (de) * 1980-08-01 1983-10-20 Siemens AG, 1000 Berlin und 8000 München Aufbau von Metallschichten
WO2002030401A2 (en) 2000-10-11 2002-04-18 Microchips, Inc. Microchip reservoir devices and facilitated corrosion of electrodes
AU2002326304A1 (en) 2001-05-31 2002-12-16 Massachusetts Institute Of Technology Microchip devices with improved reservoir opening
US7175752B2 (en) * 2002-05-24 2007-02-13 Federal-Mogul Worldwide, Inc. Method and apparatus for electrochemical machining

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3566358A (en) * 1968-03-19 1971-02-23 Bevier Hasbrouck Integrated multi-computer system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3566358A (en) * 1968-03-19 1971-02-23 Bevier Hasbrouck Integrated multi-computer system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
J.ELECTROCHEM. SOC.. 108, 1961 , 720-725.) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2739727A1 (de) * 1976-09-03 1978-03-16 Philips Nv Verfahren zur herstellung eines mit einem goldmuster versehenen koerpers
FR2363886A1 (fr) * 1976-09-03 1978-03-31 Philips Nv Procede pour la realisation d'un corps muni d'une configuration d'or et corps ainsi realise

Also Published As

Publication number Publication date
DE2351664A1 (de) 1974-05-02
GB1408352A (en) 1975-10-01
NL7314162A (sv) 1974-04-23
CA1026704A (en) 1978-02-21
IT999661B (it) 1976-03-10
NL157062B (nl) 1978-06-15
JPS4974140A (sv) 1974-07-17
FR2203890B1 (sv) 1976-07-23
DE2351664B2 (de) 1975-09-18
BE806230A (fr) 1974-02-15
US3798141A (en) 1974-03-19

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Legal Events

Date Code Title Description
ST Notification of lapse