GB1408352A - Electrolytic methods of etching thin films - Google Patents

Electrolytic methods of etching thin films

Info

Publication number
GB1408352A
GB1408352A GB4878373A GB4878373A GB1408352A GB 1408352 A GB1408352 A GB 1408352A GB 4878373 A GB4878373 A GB 4878373A GB 4878373 A GB4878373 A GB 4878373A GB 1408352 A GB1408352 A GB 1408352A
Authority
GB
United Kingdom
Prior art keywords
etched
reference electrode
auxiliary electrode
periodicity
oct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4878373A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1408352A publication Critical patent/GB1408352A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

1408352 Electrolytic etching of thin metal films WESTERN ELECTRIC CO Inc 19 Oct 1973 [19 Oct 1972] 48783/73 Heading C7B A thin film containing Au, Pt and/or Rh is etched electrolytically by immersion in an acid bath of pH less than 1, together with an auxiliary electrode and a reference electrode and applying between the film and auxiliary electrode a potential which periodically varies between limiting values of 1600 mV and -60mV (hydrogen scale) with respect to the reference electrode. Rh is selectively etched with respect to Au with an upper potential of 900-1100mV; Rh and Pt are selectively etched at 1100-1450 mV; and Rh, Pt and Au are etched together above 1450 mV. A pulsed potentiostat leaving a periodicity of 1-10 mSec may be used. The acid may be HF, HCl, HClO 4 , H 2 SO 4 or H 3 PO 4 . The film may be a composite comprising the following respective layers on an insulating substrate; (1) a transition metal e.g. Ti, (2) Pt or Rh, (3) Au. Speed of etching is controlled by variation of the periodicity. A carbon auxiliary electrode is specified together with a calomel reference electrode. The Ti layer may be etched by a constant or pulsed voltage of e.g. -300 to -500 mV.
GB4878373A 1972-10-19 1973-10-19 Electrolytic methods of etching thin films Expired GB1408352A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29885672A 1972-10-19 1972-10-19

Publications (1)

Publication Number Publication Date
GB1408352A true GB1408352A (en) 1975-10-01

Family

ID=23152265

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4878373A Expired GB1408352A (en) 1972-10-19 1973-10-19 Electrolytic methods of etching thin films

Country Status (9)

Country Link
US (1) US3798141A (en)
JP (1) JPS4974140A (en)
BE (1) BE806230A (en)
CA (1) CA1026704A (en)
DE (1) DE2351664B2 (en)
FR (1) FR2203890B1 (en)
GB (1) GB1408352A (en)
IT (1) IT999661B (en)
NL (1) NL157062B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3898141A (en) * 1974-02-08 1975-08-05 Bell Telephone Labor Inc Electrolytic oxidation and etching of III-V compound semiconductors
NL7609816A (en) * 1976-09-03 1978-03-07 Philips Nv PROCESS OF MANUFACTURING A BODY PROVIDED WITH A GOLD PATTERN AND BODY MANUFACTURED BY THE PROCESS.
US4206028A (en) * 1976-12-14 1980-06-03 Inoue-Japax Research Incorporated Electrochemical polishing system
GB1539309A (en) * 1976-12-14 1979-01-31 Inoue Japax Res Electrochemical polishing
DE3029277C2 (en) * 1980-08-01 1983-10-20 Siemens AG, 1000 Berlin und 8000 München Build-up of metal layers
WO2002030401A2 (en) 2000-10-11 2002-04-18 Microchips, Inc. Microchip reservoir devices and facilitated corrosion of electrodes
WO2002099457A1 (en) 2001-05-31 2002-12-12 Massachusetts Inst Technology Microchip devices with improved reservoir opening
US7175752B2 (en) * 2002-05-24 2007-02-13 Federal-Mogul Worldwide, Inc. Method and apparatus for electrochemical machining

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3566358A (en) * 1968-03-19 1971-02-23 Bevier Hasbrouck Integrated multi-computer system

Also Published As

Publication number Publication date
JPS4974140A (en) 1974-07-17
DE2351664A1 (en) 1974-05-02
FR2203890B1 (en) 1976-07-23
FR2203890A1 (en) 1974-05-17
BE806230A (en) 1974-02-15
NL157062B (en) 1978-06-15
US3798141A (en) 1974-03-19
DE2351664B2 (en) 1975-09-18
NL7314162A (en) 1974-04-23
CA1026704A (en) 1978-02-21
IT999661B (en) 1976-03-10

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee