CA1026704A - Electroetching thin noble metal film - Google Patents

Electroetching thin noble metal film

Info

Publication number
CA1026704A
CA1026704A CA170,822A CA170822A CA1026704A CA 1026704 A CA1026704 A CA 1026704A CA 170822 A CA170822 A CA 170822A CA 1026704 A CA1026704 A CA 1026704A
Authority
CA
Canada
Prior art keywords
electroetching
metal film
noble metal
thin noble
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA170,822A
Other languages
French (fr)
Other versions
CA170822S (en
Inventor
Joseph Yahalom
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of CA1026704A publication Critical patent/CA1026704A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CA170,822A 1972-10-19 1973-05-09 Electroetching thin noble metal film Expired CA1026704A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29885672A 1972-10-19 1972-10-19

Publications (1)

Publication Number Publication Date
CA1026704A true CA1026704A (en) 1978-02-21

Family

ID=23152265

Family Applications (1)

Application Number Title Priority Date Filing Date
CA170,822A Expired CA1026704A (en) 1972-10-19 1973-05-09 Electroetching thin noble metal film

Country Status (9)

Country Link
US (1) US3798141A (en)
JP (1) JPS4974140A (en)
BE (1) BE806230A (en)
CA (1) CA1026704A (en)
DE (1) DE2351664B2 (en)
FR (1) FR2203890B1 (en)
GB (1) GB1408352A (en)
IT (1) IT999661B (en)
NL (1) NL157062B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3898141A (en) * 1974-02-08 1975-08-05 Bell Telephone Labor Inc Electrolytic oxidation and etching of III-V compound semiconductors
NL7609816A (en) * 1976-09-03 1978-03-07 Philips Nv PROCESS OF MANUFACTURING A BODY PROVIDED WITH A GOLD PATTERN AND BODY MANUFACTURED BY THE PROCESS.
GB1539309A (en) * 1976-12-14 1979-01-31 Inoue Japax Res Electrochemical polishing
US4206028A (en) * 1976-12-14 1980-06-03 Inoue-Japax Research Incorporated Electrochemical polishing system
DE3029277C2 (en) * 1980-08-01 1983-10-20 Siemens AG, 1000 Berlin und 8000 München Build-up of metal layers
US6773429B2 (en) 2000-10-11 2004-08-10 Microchips, Inc. Microchip reservoir devices and facilitated corrosion of electrodes
AU2002326304A1 (en) 2001-05-31 2002-12-16 Massachusetts Institute Of Technology Microchip devices with improved reservoir opening
US7175752B2 (en) * 2002-05-24 2007-02-13 Federal-Mogul Worldwide, Inc. Method and apparatus for electrochemical machining

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3566358A (en) * 1968-03-19 1971-02-23 Bevier Hasbrouck Integrated multi-computer system

Also Published As

Publication number Publication date
GB1408352A (en) 1975-10-01
FR2203890A1 (en) 1974-05-17
NL157062B (en) 1978-06-15
US3798141A (en) 1974-03-19
IT999661B (en) 1976-03-10
BE806230A (en) 1974-02-15
NL7314162A (en) 1974-04-23
FR2203890B1 (en) 1976-07-23
JPS4974140A (en) 1974-07-17
DE2351664A1 (en) 1974-05-02
DE2351664B2 (en) 1975-09-18

Similar Documents

Publication Publication Date Title
CA982745A (en) Metal imidazolate-catalyzed systems
CA981062A (en) Dental alloys
CA989206A (en) Copper-noble metal containing material for metallization
CA1026704A (en) Electroetching thin noble metal film
CA1006845A (en) Metal oxide coatings
CA963669A (en) Metal oxide casting
SU588352A1 (en) Follow-up registering piezograph
CA993603A (en) Precious metal sensitizing solutions
CA913505A (en) Etching metals
CA894713A (en) Alloys
CA907133A (en) Tin-lithium-lead alloy
CA1006847A (en) Metal oxide coatings
CA1012386A (en) Zinc alloy
CA900953A (en) Metal fabrication
CA946356A (en) Metal reel
CA915055A (en) Metal dissolution
CA892485A (en) Aluminium-base alloys
CA890848A (en) Alloys
CA913941A (en) Niobium-base alloys
CA892486A (en) Aluminium-zinc-magnesium alloys
CA910090A (en) Alloy steel
CA896922A (en) Metal de soudure
CA895213A (en) Corrosion-resistant alloys
CA914753A (en) Electrochemical processes
CA904560A (en) Metal casting