CA1026704A - Electroetching thin noble metal film - Google Patents

Electroetching thin noble metal film

Info

Publication number
CA1026704A
CA1026704A CA170,822A CA170822A CA1026704A CA 1026704 A CA1026704 A CA 1026704A CA 170822 A CA170822 A CA 170822A CA 1026704 A CA1026704 A CA 1026704A
Authority
CA
Canada
Prior art keywords
electroetching
metal film
noble metal
thin noble
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA170,822A
Other languages
English (en)
French (fr)
Other versions
CA170822S (en
Inventor
Joseph Yahalom
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of CA1026704A publication Critical patent/CA1026704A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00Electrolytic etching or polishing
    • C25F3/02Etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CA170,822A 1972-10-19 1973-05-09 Electroetching thin noble metal film Expired CA1026704A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29885672A 1972-10-19 1972-10-19

Publications (1)

Publication Number Publication Date
CA1026704A true CA1026704A (en) 1978-02-21

Family

ID=23152265

Family Applications (1)

Application Number Title Priority Date Filing Date
CA170,822A Expired CA1026704A (en) 1972-10-19 1973-05-09 Electroetching thin noble metal film

Country Status (9)

Country Link
US (1) US3798141A (sv)
JP (1) JPS4974140A (sv)
BE (1) BE806230A (sv)
CA (1) CA1026704A (sv)
DE (1) DE2351664B2 (sv)
FR (1) FR2203890B1 (sv)
GB (1) GB1408352A (sv)
IT (1) IT999661B (sv)
NL (1) NL157062B (sv)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3898141A (en) * 1974-02-08 1975-08-05 Bell Telephone Labor Inc Electrolytic oxidation and etching of III-V compound semiconductors
NL7609816A (nl) * 1976-09-03 1978-03-07 Philips Nv Werkwijze voor het vervaardigen van een lichaam voorzien met een goudpatroon en lichaam ver- vaardigd volgens de werkwijze.
US4206028A (en) * 1976-12-14 1980-06-03 Inoue-Japax Research Incorporated Electrochemical polishing system
GB1539309A (en) * 1976-12-14 1979-01-31 Inoue Japax Res Electrochemical polishing
DE3029277C2 (de) * 1980-08-01 1983-10-20 Siemens AG, 1000 Berlin und 8000 München Aufbau von Metallschichten
AU2002224453A1 (en) 2000-10-11 2002-04-22 Microchips, Inc. Microchip reservoir devices and facilitated corrosion of electrodes
US6875208B2 (en) 2001-05-31 2005-04-05 Massachusetts Institute Of Technology Microchip devices with improved reservoir opening
US7175752B2 (en) * 2002-05-24 2007-02-13 Federal-Mogul Worldwide, Inc. Method and apparatus for electrochemical machining

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3566358A (en) * 1968-03-19 1971-02-23 Bevier Hasbrouck Integrated multi-computer system

Also Published As

Publication number Publication date
NL157062B (nl) 1978-06-15
FR2203890A1 (sv) 1974-05-17
BE806230A (fr) 1974-02-15
US3798141A (en) 1974-03-19
GB1408352A (en) 1975-10-01
IT999661B (it) 1976-03-10
DE2351664A1 (de) 1974-05-02
NL7314162A (sv) 1974-04-23
JPS4974140A (sv) 1974-07-17
DE2351664B2 (de) 1975-09-18
FR2203890B1 (sv) 1976-07-23

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