FR2148649A1 - - Google Patents

Info

Publication number
FR2148649A1
FR2148649A1 FR7229230A FR7229230A FR2148649A1 FR 2148649 A1 FR2148649 A1 FR 2148649A1 FR 7229230 A FR7229230 A FR 7229230A FR 7229230 A FR7229230 A FR 7229230A FR 2148649 A1 FR2148649 A1 FR 2148649A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7229230A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Augat Inc
Original Assignee
Augat Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Augat Inc filed Critical Augat Inc
Publication of FR2148649A1 publication Critical patent/FR2148649A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H05K7/1046—J-shaped leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
FR7229230A 1971-08-12 1972-08-11 Withdrawn FR2148649A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00171217A US3825876A (en) 1971-08-12 1971-08-12 Electrical component mounting

Publications (1)

Publication Number Publication Date
FR2148649A1 true FR2148649A1 (fr) 1973-03-23

Family

ID=22622964

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7229230A Withdrawn FR2148649A1 (fr) 1971-08-12 1972-08-11

Country Status (4)

Country Link
US (1) US3825876A (fr)
JP (1) JPS4827681A (fr)
DE (1) DE2239424A1 (fr)
FR (1) FR2148649A1 (fr)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3861030A (en) * 1974-04-04 1975-01-21 Raychem Corp Article and method for locating contacts
US4026412A (en) * 1974-09-26 1977-05-31 Henson Richard D Electronic circuit carrier and test fixture
US3932012A (en) * 1974-09-27 1976-01-13 Gte Automatic Electric Laboratories Incorporated Component terminal system
US3997227A (en) * 1975-07-28 1976-12-14 Cutchaw John M Connector and handling device for multilead electronic packages
US4017143A (en) * 1975-12-16 1977-04-12 Litton Systems, Inc. Solderless electrical contact
US4019094A (en) * 1975-12-19 1977-04-19 General Electric Company Static control shorting clip for semiconductor package
US4222090A (en) * 1977-11-25 1980-09-09 Jaffe Richard A Micromodular electronic package
US4322119A (en) * 1980-03-05 1982-03-30 Bell Telephone Laboratories, Incorporated Circuit module mounting assembly
US4354718A (en) * 1980-08-18 1982-10-19 Amp Incorporated Dual-in-line package carrier and socket assembly
US4541032A (en) * 1980-10-21 1985-09-10 B/K Patent Development Company, Inc. Modular electrical shunts for integrated circuit applications
US4381134A (en) * 1981-03-13 1983-04-26 Bell Telephone Laboratories, Incorporated Electrical connector for plated-through holes
US4417777A (en) * 1981-10-13 1983-11-29 Molex Incorporated Integrated circuit carrier assembly
US4417095A (en) * 1981-10-23 1983-11-22 Northern Telecom Limited Support member for electronic devices
JPS58161282A (ja) * 1982-03-19 1983-09-24 株式会社日立製作所 プリント配線板用電気機器ソケツト
US4490001A (en) * 1983-02-07 1984-12-25 Matsushita Electric Industrial Co., Ltd. Dip carrier and socket
US4829818A (en) * 1983-12-27 1989-05-16 Honeywell Inc. Flow sensor housing
US4595794A (en) * 1984-03-19 1986-06-17 At&T Bell Laboratories Component mounting apparatus
US4943891A (en) * 1988-09-28 1990-07-24 Alan Ouellette Microelement and base assembly
JPH03134982A (ja) * 1989-10-19 1991-06-07 Seikosha Co Ltd Ｉｃホルダ
JPH0711422Y2 (ja) * 1989-12-25 1995-03-15 山一電機工業株式会社 Ｉｃソケット
US5043534A (en) * 1990-07-02 1991-08-27 Olin Corporation Metal electronic package having improved resistance to electromagnetic interference
US6591674B2 (en) * 2000-12-21 2003-07-15 Honeywell International Inc. System for sensing the motion or pressure of a fluid, the system having dimensions less than 1.5 inches, a metal lead frame with a coefficient of thermal expansion that is less than that of the body, or two rtds and a heat source
JP2004063688A (ja) * 2002-07-26 2004-02-26 Mitsubishi Electric Corp 半導体装置及び半導体アセンブリモジュール
US20040163717A1 (en) * 2003-02-21 2004-08-26 Cookson Electronics, Inc. MEMS device assembly
US20050012212A1 (en) * 2003-07-17 2005-01-20 Cookson Electronics, Inc. Reconnectable chip interface and chip package
US6881074B1 (en) * 2003-09-29 2005-04-19 Cookson Electronics, Inc. Electrical circuit assembly with micro-socket
KR100602442B1 (ko) * 2004-05-18 2006-07-19 삼성전자주식회사 매개 기판을 갖는 볼 그리드 어레이 패키지용 테스트 소켓
US9888558B2 (en) * 2010-06-03 2018-02-06 Yazaki Corporation Wiring substrate and manufacturing method thereof
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
JP1603175S (fr) * 2017-10-19 2018-05-07
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
JP1632999S (fr) * 2018-06-12 2019-06-03
JP1641098S (fr) 2018-06-26 2019-09-09
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
JP1725616S (ja) * 2022-02-25 2022-09-26 半導体モジュール

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2648031A (en) * 1951-07-17 1953-08-04 Gen Electric Intermediate frequency transformer assembly
GB1102711A (en) * 1963-09-17 1968-02-07 Ass Elect Ind Improvements in or relating to mounting devices
US3311790A (en) * 1965-02-17 1967-03-28 Brown Engineering Company Inc Micromodule connector and assembly
US3345541A (en) * 1966-02-21 1967-10-03 Amp Inc Mounting and connecting means for circuit devices
GB1152765A (en) * 1967-01-24 1969-05-21 Amp Inc An Electrical Circuit Assembly
US3447040A (en) * 1967-03-10 1969-05-27 Brown Eng Co Inc Micro-element carrier-connector
US3434687A (en) * 1967-09-22 1969-03-25 Us Navy Circuit module guide and retaining device
US3660799A (en) * 1969-06-17 1972-05-02 Honeywell Inf Systems Connector device

Also Published As

Publication number Publication date
DE2239424A1 (de) 1973-02-22
JPS4827681A (fr) 1973-04-12
US3825876A (en) 1974-07-23

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Legal Events

Date Code Title Description
ST Notification of lapse