FR2104144A5 - - Google Patents
Info
- Publication number
- FR2104144A5 FR2104144A5 FR7129112A FR7129112A FR2104144A5 FR 2104144 A5 FR2104144 A5 FR 2104144A5 FR 7129112 A FR7129112 A FR 7129112A FR 7129112 A FR7129112 A FR 7129112A FR 2104144 A5 FR2104144 A5 FR 2104144A5
- Authority
- FR
- France
- Prior art keywords
- housing
- frame
- gold
- leads
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W76/157—
-
- H10W70/421—
-
- H10W70/682—
-
- H10W72/5522—
-
- H10W74/00—
-
- H10W90/756—
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US6237570A | 1970-08-10 | 1970-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2104144A5 true FR2104144A5 (enExample) | 1972-04-14 |
Family
ID=22042069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7129112A Expired FR2104144A5 (enExample) | 1970-08-10 | 1971-08-09 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5139509B1 (enExample) |
| CA (1) | CA931284A (enExample) |
| DE (1) | DE2138554A1 (enExample) |
| FR (1) | FR2104144A5 (enExample) |
| GB (1) | GB1320835A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2368175A1 (fr) * | 1976-10-13 | 1978-05-12 | Matra Engins | Convertisseur statique modulaire pour machines a reluctance variable |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5733459U (enExample) * | 1980-07-30 | 1982-02-22 |
-
1971
- 1971-06-22 CA CA116256A patent/CA931284A/en not_active Expired
- 1971-06-28 GB GB3022371A patent/GB1320835A/en not_active Expired
- 1971-07-24 JP JP46055590A patent/JPS5139509B1/ja active Pending
- 1971-08-02 DE DE19712138554 patent/DE2138554A1/de active Pending
- 1971-08-09 FR FR7129112A patent/FR2104144A5/fr not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2368175A1 (fr) * | 1976-10-13 | 1978-05-12 | Matra Engins | Convertisseur statique modulaire pour machines a reluctance variable |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1320835A (en) | 1973-06-20 |
| DE2138554A1 (de) | 1972-02-17 |
| CA931284A (en) | 1973-07-31 |
| JPS5139509B1 (enExample) | 1976-10-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MY109101A (en) | Thin type semiconductor device, module structure using the device and method of mounting the device on board | |
| GB1341454A (en) | Packaging of semiconductor devices | |
| KR920000128A (ko) | 수지 봉지형 반도체장치 및 그 리이드 프레임 | |
| MY123034A (en) | Semiconductor device and method of fabricating the same | |
| KR890702249A (ko) | 반도체 장치 패키지의 제조방법 및 그 장치 | |
| GB1038007A (en) | Electrical assembly | |
| GB1383297A (en) | Electrical integrated circuit package | |
| FR2104144A5 (enExample) | ||
| JPS5721847A (en) | Semiconductor device | |
| GB1206759A (en) | Semiconductor devices | |
| SE319835B (enExample) | ||
| JPS59154051A (ja) | 半導体装置 | |
| JPS57157550A (en) | Semiconductor device | |
| JPS6482554A (en) | Resin-sealed semiconductor device | |
| JPS6455291A (en) | Integrated circuit device | |
| GB1329810A (en) | Semiconductor device packaging | |
| JPS57159032A (en) | Forming method for package of electronic timepiece | |
| JPS5776867A (en) | Semiconductor device | |
| JPS5588358A (en) | Resin-sealed semiconductor device | |
| JPS645079A (en) | Semiconductor light emitting device | |
| JPS6427236A (en) | Wire bonding method | |
| JPS60110145A (ja) | 樹脂封止型半導体装置 | |
| JPS6457652A (en) | Lead frame for photosensitive semiconductor element | |
| JPS641262A (en) | Electronic device and manufacture thereof | |
| JPH0750750B2 (ja) | 電子部品搭載用パッケージ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |