SE319835B - - Google Patents
Info
- Publication number
- SE319835B SE319835B SE5139/65A SE513965A SE319835B SE 319835 B SE319835 B SE 319835B SE 5139/65 A SE5139/65 A SE 5139/65A SE 513965 A SE513965 A SE 513965A SE 319835 B SE319835 B SE 319835B
- Authority
- SE
- Sweden
- Prior art keywords
- header
- insulating material
- semi
- wires
- oxide
- Prior art date
Links
Classifications
-
- H10W74/01—
-
- H10W74/121—
-
- H10W72/01515—
-
- H10W72/075—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/5522—
-
- H10W72/884—
-
- H10W74/00—
-
- H10W90/754—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US361645A US3278813A (en) | 1964-04-22 | 1964-04-22 | Transistor housing containing packed, earthy, nonmetallic, electrically insulating material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE319835B true SE319835B (enExample) | 1970-01-26 |
Family
ID=23422903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE5139/65A SE319835B (enExample) | 1964-04-22 | 1965-04-21 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3278813A (enExample) |
| DE (1) | DE1489916B2 (enExample) |
| GB (1) | GB1065182A (enExample) |
| SE (1) | SE319835B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3449641A (en) * | 1966-01-11 | 1969-06-10 | Gen Electric | Epoxy encapsulated semiconductor device wherein the encapsulant comprises an epoxy novolak |
| US3492157A (en) * | 1966-06-20 | 1970-01-27 | Tokyo Shibaura Electric Co | Resin-sealed semiconductor device and manufacturing method for the same |
| US3659164A (en) * | 1970-11-23 | 1972-04-25 | Rca Corp | Internal construction for plastic semiconductor packages |
| US3742599A (en) * | 1970-12-14 | 1973-07-03 | Gen Electric | Processes for the fabrication of protected semiconductor devices |
| FR2156651B1 (enExample) * | 1971-10-01 | 1977-08-26 | Gen Electric | |
| JP2513055B2 (ja) * | 1990-02-14 | 1996-07-03 | 日本電装株式会社 | 半導体装置の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL241488A (enExample) * | 1958-07-21 | 1900-01-01 | ||
| US3200310A (en) * | 1959-09-22 | 1965-08-10 | Carman Lab Inc | Glass encapsulated semiconductor device |
| US3212160A (en) * | 1962-05-18 | 1965-10-19 | Transitron Electronic Corp | Method of manufacturing semiconductive devices |
-
1964
- 1964-04-22 US US361645A patent/US3278813A/en not_active Expired - Lifetime
-
1965
- 1965-04-05 GB GB14373/65A patent/GB1065182A/en not_active Expired
- 1965-04-21 SE SE5139/65A patent/SE319835B/xx unknown
- 1965-04-21 DE DE19651489916 patent/DE1489916B2/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB1065182A (en) | 1967-04-12 |
| DE1489916B2 (de) | 1971-04-15 |
| DE1489916A1 (de) | 1970-07-16 |
| US3278813A (en) | 1966-10-11 |
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