FR1185331A - Procédé de fabrication d'appareils électriques à circuits imprimés - Google Patents

Procédé de fabrication d'appareils électriques à circuits imprimés

Info

Publication number
FR1185331A
FR1185331A FR1185331DA FR1185331A FR 1185331 A FR1185331 A FR 1185331A FR 1185331D A FR1185331D A FR 1185331DA FR 1185331 A FR1185331 A FR 1185331A
Authority
FR
France
Prior art keywords
printed circuit
manufacturing process
electrical devices
circuit electrical
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blaupunkt Werke GmbH
Original Assignee
Blaupunkt Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blaupunkt Werke GmbH filed Critical Blaupunkt Werke GmbH
Application granted granted Critical
Publication of FR1185331A publication Critical patent/FR1185331A/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
FR1185331D 1956-02-04 1957-01-15 Procédé de fabrication d'appareils électriques à circuits imprimés Expired FR1185331A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEB39006A DE1064127B (de) 1956-02-04 1956-02-04 Verfahren zur Bestueckung von sogenannten gedruckten Schaltungen mit Schaltungselementen

Publications (1)

Publication Number Publication Date
FR1185331A true FR1185331A (fr) 1959-07-31

Family

ID=40430117

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1185331D Expired FR1185331A (fr) 1956-02-04 1957-01-15 Procédé de fabrication d'appareils électriques à circuits imprimés

Country Status (2)

Country Link
DE (2) DE1064127B (fr)
FR (1) FR1185331A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2934999A1 (de) * 1979-08-30 1981-04-09 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zum vorschub von in magazinen gestapelten einzelteilen
EP0171838A1 (fr) * 1984-07-17 1986-02-19 Koninklijke Philips Electronics N.V. Composant électrique encapsule

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3550238A (en) * 1968-03-28 1970-12-29 Usm Corp Multi-lead component inserter
US3586934A (en) * 1969-04-21 1971-06-22 Gen Electric High voltage ceramic capacitor assembly and method of making same
DE2344684C3 (de) * 1973-09-05 1981-09-03 Draloric Electronic GmbH, 8500 Nürnberg Elektrischer Scheibenkondensator für gedruckte Schaltungen und Verfahren zu seiner Herstellung
JPS52124168A (en) * 1976-04-12 1977-10-18 Matsushita Electric Ind Co Ltd Method of assembling electronic device circuit
JPS52126764A (en) * 1976-04-15 1977-10-24 Matsushita Electric Ind Co Ltd Device for assembling electronic device circuit
JPS6039605B2 (ja) * 1979-05-10 1985-09-06 ソニー株式会社 物品移送装置
JPS55150241A (en) * 1979-05-12 1980-11-22 Sony Corp Apparatus for disposing chiplike part
JPS55151435A (en) * 1979-05-12 1980-11-26 Sony Corp Controlling device for feeding of parts
DE2935021A1 (de) * 1979-08-30 1981-03-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung und verfahren zur bestueckung von leiterplatten mit elektrischen bauelementen
DE2935081C2 (de) * 1979-08-30 1985-12-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zur Bestückung von Leiterplatten.
US4457451A (en) * 1980-09-29 1984-07-03 Sony Corporation Apparatus for feeding electric circuit elements
DE3153476C2 (en) * 1981-01-23 1990-02-01 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De Assembly head for electronic components
DE3102206A1 (de) 1981-01-23 1982-08-19 Siemens AG, 1000 Berlin und 8000 München Montagekopf zum montieren von elektronischen bauteilen
DE3120298C2 (de) * 1981-05-21 1983-07-07 Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut Kondensator in Chip-Bauweise
DE3134617C2 (de) * 1981-09-01 1989-11-02 Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut Folien-Kondensator
CH664320A5 (de) * 1982-03-08 1988-02-29 Miroslav Tresky Dr Ing Vorrichtung zum bestuecken eines objektes mit verschiedenen in elektrischen und elektronischen schaltkreisen ueblichen komponenten.
DE3320257A1 (de) * 1983-02-28 1984-08-30 Wolfgang Dipl.-Ing. 6800 Mannheim Westermann Kunststoffolien-wickelkondensator
DE3445698A1 (de) * 1984-12-14 1986-06-26 C. Conradty Nürnberg GmbH & Co KG, 8505 Röthenbach Chip-varistor und verfahren zu seiner herstellung
DE3615307C2 (de) * 1986-05-06 1994-07-07 Johann Leonhard Huettlinger Spule für automatische SMD-Bestückung
EP0327860A1 (fr) * 1988-02-10 1989-08-16 Siemens Aktiengesellschaft Composant électrique du type pastille et son procédé de fabrication
DE3813435A1 (de) * 1988-04-21 1989-11-02 Siemens Ag Bauelement in chip-bauweise zum befestigen auf einer schaltplatte, mit einem elektrischen oder elektronischen funktionskoerper
FR2639787B1 (fr) * 1988-11-25 1991-01-25 Thomson Csf Assemblage d'un composant sur un support d'interconnexion par plots metallises brases
JPH03187203A (ja) * 1989-12-07 1991-08-15 Siemens Ag 高容量バリスタ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE582748C (de) * 1931-08-23 1933-08-22 Wego Werke A G Stabfoermiger Kondensator mit Metallkappen, welche die Elektroden des Kondensators, die mit den Belegungen organisch verbunden sein koennen, aufnehmen und an dem Kondensator direkt hergestellt sind
US2613252A (en) * 1947-09-23 1952-10-07 Erie Resistor Corp Electric circuit and component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2934999A1 (de) * 1979-08-30 1981-04-09 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zum vorschub von in magazinen gestapelten einzelteilen
EP0171838A1 (fr) * 1984-07-17 1986-02-19 Koninklijke Philips Electronics N.V. Composant électrique encapsule

Also Published As

Publication number Publication date
DE1064127B (de) 1959-08-27
DE1064574B (de) 1959-09-03

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