FI953174A0 - Förbindnings- och monteringsteknik för flerchopmoduler - Google Patents

Förbindnings- och monteringsteknik för flerchopmoduler

Info

Publication number
FI953174A0
FI953174A0 FI953174A FI953174A FI953174A0 FI 953174 A0 FI953174 A0 FI 953174A0 FI 953174 A FI953174 A FI 953174A FI 953174 A FI953174 A FI 953174A FI 953174 A0 FI953174 A0 FI 953174A0
Authority
FI
Finland
Prior art keywords
connection
chip modules
installation technology
installation
technology
Prior art date
Application number
FI953174A
Other languages
English (en)
Finnish (fi)
Other versions
FI953174A (sv
FI116867B (sv
Inventor
Rainer Leuschner
Hellmut Ahne
Siegfried Birkle
Albert Hammerschmidt
Recai Sezi
Tobias Noll
Jr Ann Dumoulin
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of FI953174A0 publication Critical patent/FI953174A0/sv
Publication of FI953174A publication Critical patent/FI953174A/sv
Application granted granted Critical
Publication of FI116867B publication Critical patent/FI116867B/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Physical Vapour Deposition (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FI953174A 1994-06-27 1995-06-27 Förbindnings- och monteringsteknik för flerchipsmoduler FI116867B (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4422345 1994-06-27
DE4422345 1994-06-27

Publications (3)

Publication Number Publication Date
FI953174A0 true FI953174A0 (sv) 1995-06-27
FI953174A FI953174A (sv) 1995-12-28
FI116867B FI116867B (sv) 2006-03-15

Family

ID=6521543

Family Applications (1)

Application Number Title Priority Date Filing Date
FI953174A FI116867B (sv) 1994-06-27 1995-06-27 Förbindnings- och monteringsteknik för flerchipsmoduler

Country Status (5)

Country Link
US (1) US5556812A (sv)
EP (1) EP0690494B1 (sv)
JP (1) JP3630777B2 (sv)
DE (1) DE59510873D1 (sv)
FI (1) FI116867B (sv)

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US5550405A (en) * 1994-12-21 1996-08-27 Advanced Micro Devices, Incorporated Processing techniques for achieving production-worthy, low dielectric, low interconnect resistance and high performance ICS
WO1997006656A2 (en) * 1995-08-09 1997-02-20 Philips Electronics N.V. Method of manufacturing devices comprising a base with a conductor pattern of electrical conductors
US6037248A (en) * 1997-06-13 2000-03-14 Micron Technology, Inc. Method of fabricating integrated circuit wiring with low RC time delay
WO1999017366A1 (de) * 1997-09-29 1999-04-08 Siemens Aktiengesellschaft Halbleiterbauelement und verfahren zu seiner herstellung
US6727170B2 (en) * 1998-02-16 2004-04-27 Renesas Technology Corp. Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereof
JPH11340321A (ja) * 1998-05-27 1999-12-10 Sony Corp 半導体装置およびその製造方法
US6277203B1 (en) 1998-09-29 2001-08-21 Lam Research Corporation Method and apparatus for cleaning low K dielectric and metal wafer surfaces
DE19929179A1 (de) * 1999-06-25 2001-01-11 Siemens Ag Flexible Leiterplatte mit beidseitigem Zugriff
WO2001003173A1 (en) * 1999-07-01 2001-01-11 Lam Research Corporation Method for patterning a layer of a low dielectric constant material
EP1138804A3 (de) * 2000-03-27 2003-06-25 Infineon Technologies AG Bauelement mit zumindest zwei aneinander grenzenden Isolierschichten und Herstellungsverfahren dazu
US6678952B2 (en) * 2000-08-03 2004-01-20 Tessera, Inc. Method of making a microelectronic package including a component having conductive elements on a top side and a bottom side thereof
US6605519B2 (en) * 2001-05-02 2003-08-12 Unaxis Usa, Inc. Method for thin film lift-off processes using lateral extended etching masks and device
JP3834589B2 (ja) * 2001-06-27 2006-10-18 株式会社ルネサステクノロジ 半導体装置の製造方法
DE10250538B4 (de) * 2002-10-29 2008-02-21 Infineon Technologies Ag Elektronisches Bauteil als Multichipmodul und Verfahren zu dessen Herstellung
TWI248138B (en) * 2002-12-20 2006-01-21 Shipley Co Llc Electronic device manufacture
US20040187297A1 (en) * 2003-03-27 2004-09-30 E Touch Corporation Method of fabricating a polymer resistor in an interconnection via
US20040192039A1 (en) * 2003-03-27 2004-09-30 E Touch Corporation Method of fabricating a multi-layer circuit structure having embedded polymer resistors
KR20040092550A (ko) * 2003-04-24 2004-11-04 클라리언트 인터내셔널 리미티드 레지스트 조성물 및 레지스트 제거용 유기용제
US7150820B2 (en) * 2003-09-22 2006-12-19 Semitool, Inc. Thiourea- and cyanide-free bath and process for electrolytic etching of gold
US20050092616A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Baths, methods, and tools for superconformal deposition of conductive materials other than copper
DE10355586B4 (de) * 2003-11-28 2007-09-27 Infineon Technologies Ag Chip-on-Chip-Struktur und Verfahren zu deren Herstellung
KR100847985B1 (ko) * 2007-06-25 2008-07-22 삼성전자주식회사 금속 배선 형성방법
KR100916647B1 (ko) * 2007-11-26 2009-09-08 삼성전기주식회사 인쇄회로기판의 제조방법
CN102449748B (zh) * 2009-05-13 2015-06-17 宾夕法尼亚大学理事会 与碳纳米结构的光蚀刻划定的接触
WO2013057949A2 (en) * 2011-10-19 2013-04-25 Panasonic Corporation Manufacturing method for semiconductor package, semiconductor package, and semiconductor device
US20190098703A1 (en) * 2017-09-26 2019-03-28 E I Du Pont De Nemours And Company Heating elements and heating devices

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US4705606A (en) 1985-01-31 1987-11-10 Gould Inc. Thin-film electrical connections for integrated circuits
US5270253A (en) * 1986-01-27 1993-12-14 Mitsubishi Denki Kabushiki Kaisha Method of producing semiconductor device
WO1988005252A1 (en) 1987-01-12 1988-07-14 Allied Corporation Method for the manufacture of multilayer printed circuit boards
US4770897A (en) 1987-05-05 1988-09-13 Digital Equipment Corporation Multilayer interconnection system for multichip high performance semiconductor packaging
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DD272755A1 (de) * 1988-05-20 1989-10-18 Robotron Elektronik Verfahren zur herstellung eines mehrebenensubstrates
US5108785A (en) * 1989-09-15 1992-04-28 Microlithics Corporation Via formation method for multilayer interconnect board
JP3469251B2 (ja) * 1990-02-14 2003-11-25 株式会社東芝 半導体装置の製造方法
JPH03297103A (ja) * 1990-04-17 1991-12-27 Cmk Corp プリント配線板におけるカーボン抵抗体の形成方法
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Also Published As

Publication number Publication date
US5556812A (en) 1996-09-17
EP0690494A2 (de) 1996-01-03
FI953174A (sv) 1995-12-28
EP0690494A3 (de) 1998-03-18
JPH0818227A (ja) 1996-01-19
DE59510873D1 (de) 2004-04-22
EP0690494B1 (de) 2004-03-17
JP3630777B2 (ja) 2005-03-23
FI116867B (sv) 2006-03-15

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