FI951933A0 - Johtava maali, jolla on hyvä tarttuvuus metallioksidivaluun - Google Patents

Johtava maali, jolla on hyvä tarttuvuus metallioksidivaluun

Info

Publication number
FI951933A0
FI951933A0 FI951933A FI951933A FI951933A0 FI 951933 A0 FI951933 A0 FI 951933A0 FI 951933 A FI951933 A FI 951933A FI 951933 A FI951933 A FI 951933A FI 951933 A0 FI951933 A0 FI 951933A0
Authority
FI
Finland
Prior art keywords
metal oxide
good adhesion
cast product
target paint
leading target
Prior art date
Application number
FI951933A
Other languages
English (en)
Swedish (sv)
Other versions
FI951933A (fi
FI109473B (fi
Inventor
Shinichi Wakita
Original Assignee
Tatsuta Densen Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Densen Kk filed Critical Tatsuta Densen Kk
Publication of FI951933A publication Critical patent/FI951933A/fi
Publication of FI951933A0 publication Critical patent/FI951933A0/fi
Application granted granted Critical
Publication of FI109473B publication Critical patent/FI109473B/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09D161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
FI951933A 1993-08-25 1995-04-24 Johtava maali, jolla on hyvä tarttuvuus metallioksidivaluun FI109473B (fi)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP21056893A JP3309231B2 (ja) 1993-08-25 1993-08-25 金属酸化物成形体との密着性の良い導電塗料
JP21056893 1993-08-25
JP9401401 1994-08-24
PCT/JP1994/001401 WO1995006092A1 (fr) 1993-08-25 1994-08-24 Substance pour couche conductrice adherant bien a un objet moule en oxyde metallique

Publications (3)

Publication Number Publication Date
FI951933A FI951933A (fi) 1995-04-24
FI951933A0 true FI951933A0 (fi) 1995-04-24
FI109473B FI109473B (fi) 2002-08-15

Family

ID=16591478

Family Applications (1)

Application Number Title Priority Date Filing Date
FI951933A FI109473B (fi) 1993-08-25 1995-04-24 Johtava maali, jolla on hyvä tarttuvuus metallioksidivaluun

Country Status (9)

Country Link
US (1) US5567357A (fi)
EP (1) EP0666291B1 (fi)
JP (1) JP3309231B2 (fi)
KR (1) KR0161331B1 (fi)
CA (1) CA2146016C (fi)
DE (1) DE69421376T2 (fi)
FI (1) FI109473B (fi)
TW (1) TW242646B (fi)
WO (1) WO1995006092A1 (fi)

Families Citing this family (27)

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US6200451B1 (en) 1996-03-22 2001-03-13 Macdermid, Incorporated Method for enhancing the solderability of a surface
US7267259B2 (en) * 1999-02-17 2007-09-11 Ronald Redline Method for enhancing the solderability of a surface
US6544397B2 (en) 1996-03-22 2003-04-08 Ronald Redline Method for enhancing the solderability of a surface
US6905587B2 (en) * 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
US5981043A (en) * 1996-04-25 1999-11-09 Tatsuta Electric Wire And Cable Co., Ltd Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield
US6086791A (en) * 1998-09-14 2000-07-11 Progressive Coatings, Inc. Electrically conductive exothermic coatings
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
US7449081B2 (en) * 2000-06-21 2008-11-11 E. I. Du Pont De Nemours And Company Process for improving the emission of electron field emitters
KR100475549B1 (ko) * 2002-04-30 2005-03-10 제일모직주식회사 전자파 차폐용 도전성 블랙착색 코팅액 조성물, 그를이용한 코팅필름의 제조방법 및 그 코팅필름
KR100475550B1 (ko) * 2002-05-01 2005-03-10 제일모직주식회사 전자파차폐용 도전성 블랙착색 코팅액 조성물, 그를이용한 코팅필름의 제조방법 및 그 코팅필름
US6773757B1 (en) 2003-04-14 2004-08-10 Ronald Redline Coating for silver plated circuits
KR101228906B1 (ko) 2004-03-29 2013-02-01 쿄세라 코포레이션 세라믹 소결체와 그 제조방법 및 세라믹 소결체를 사용한장식용 부재
US8349393B2 (en) 2004-07-29 2013-01-08 Enthone Inc. Silver plating in electronics manufacture
CN101294012B (zh) * 2007-04-27 2011-05-25 比亚迪股份有限公司 一种导电涂料及其制备方法及导电涂层
US8017859B2 (en) * 2007-10-17 2011-09-13 Spansion Llc Photovoltaic thin coating for collector generator
JP2008124030A (ja) * 2007-11-30 2008-05-29 Jsr Corp 導電性ペースト組成物、転写フィルムおよびプラズマディスプレイパネル
KR101221716B1 (ko) * 2009-08-26 2013-01-11 주식회사 엘지화학 전도성 금속 잉크 조성물 및 전도성 패턴의 형성 방법
CN107210085A (zh) * 2015-03-05 2017-09-26 纳美仕有限公司 导电性铜浆料、导电性铜浆料固化膜和半导体装置
JP6151742B2 (ja) * 2015-06-09 2017-06-21 タツタ電線株式会社 導電性ペースト
JP6714244B2 (ja) * 2015-08-19 2020-06-24 ナミックス株式会社 樹脂組成物、銅ペースト、および半導体装置
WO2017135138A1 (ja) * 2016-02-03 2017-08-10 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅粉およびその製造方法
JP6811080B2 (ja) * 2016-02-03 2021-01-13 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅粉およびその製造方法
JP2017141330A (ja) * 2016-02-08 2017-08-17 ナミックス株式会社 樹脂組成物、導電性銅ペースト、導電性銅ペーストの硬化物、および半導体装置
JP6948111B2 (ja) * 2016-02-09 2021-10-13 ナミックス株式会社 樹脂組成物、導電性銅ペースト、および半導体装置
JP6992582B2 (ja) * 2018-02-20 2022-01-13 日油株式会社 導電性組成物、該導電性組成物を用いた硬化体及び積層体
KR102610328B1 (ko) 2018-12-17 2023-12-06 현대자동차주식회사 로즈골드색 구리 합금 및 이의 용도
EP3933881A1 (en) 2020-06-30 2022-01-05 VEC Imaging GmbH & Co. KG X-ray source with multiple grids

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53135495A (en) * 1977-04-28 1978-11-27 Fujikura Kasei Kk Method of manufacturing electroconductive composition
US4387115A (en) * 1980-08-08 1983-06-07 Mitsui Toatsu Chemicals, Inc. Composition for conductive cured product
JPS6058268B2 (ja) * 1981-10-29 1985-12-19 藤倉化成株式会社 導電性銅ペ−スト組成物
JPS58117606A (ja) * 1981-12-29 1983-07-13 三井東圧化学株式会社 スル−ホ−ル部の導電方法
JPS5949272A (ja) * 1982-09-14 1984-03-21 Toshiba Corp 導電性塗料
JPS62179566A (ja) * 1986-01-31 1987-08-06 Toyobo Co Ltd 導電性樹脂組成物
JPH0266802A (ja) * 1988-08-31 1990-03-06 Toyama Pref Gov 導電性組成物
JP2619289B2 (ja) * 1989-06-20 1997-06-11 三井金属鉱業株式会社 銅導電性組成物
JPH0367402A (ja) * 1989-08-03 1991-03-22 Toagosei Chem Ind Co Ltd 導電性組成物
JPH0373503A (ja) * 1989-08-14 1991-03-28 Mitsui Mining & Smelting Co Ltd 回路形成方法
JPH03133006A (ja) * 1989-10-18 1991-06-06 Asahi Chem Ind Co Ltd 銀銅合金系導電性ペーストならびに該ペーストを用いた導電体
JP2702796B2 (ja) * 1990-02-23 1998-01-26 旭化成工業株式会社 銀合金導電性ペースト
JPH03264678A (ja) * 1990-03-15 1991-11-25 Showa Denko Kk 導電性ペースト用銅粉
JP2847563B2 (ja) * 1990-04-24 1999-01-20 旭化成工業株式会社 電子線硬化型の導電性ペースト組成物
JPH0477639A (ja) * 1990-07-20 1992-03-11 Tatsuta Electric Wire & Cable Co Ltd 測温抵抗体
JPH04214773A (ja) * 1990-11-30 1992-08-05 Kao Corp 導電性ペースト及び導電性塗膜
JPH0821254B2 (ja) * 1991-02-22 1996-03-04 旭化成工業株式会社 銅合金系組成物、それを用いて印刷された成形物、ペーストおよび接着剤
JPH0528829A (ja) * 1991-07-12 1993-02-05 Tokyo Cosmos Electric Co Ltd 導電塗料及びその導電膜形成方法
JPH05217422A (ja) * 1992-02-04 1993-08-27 Kao Corp 導電性ペーストおよび導電性塗膜
JP2514516B2 (ja) * 1992-02-05 1996-07-10 タツタ電線株式会社 半田付け可能な導電性ペ―スト
US5372749A (en) * 1992-02-19 1994-12-13 Beijing Technology Of Printing Research Institute Chinese Method for surface treating conductive copper powder with a treating agent and coupler

Also Published As

Publication number Publication date
CA2146016A1 (en) 1995-03-02
FI951933A (fi) 1995-04-24
EP0666291B1 (en) 1999-10-27
JP3309231B2 (ja) 2002-07-29
EP0666291A1 (en) 1995-08-09
JPH0762274A (ja) 1995-03-07
KR0161331B1 (ko) 1999-01-15
EP0666291A4 (en) 1997-08-20
WO1995006092A1 (fr) 1995-03-02
CA2146016C (en) 1999-01-12
TW242646B (en) 1995-03-11
DE69421376T2 (de) 2000-03-23
FI109473B (fi) 2002-08-15
KR950703615A (ko) 1995-09-20
US5567357A (en) 1996-10-22
DE69421376D1 (de) 1999-12-02

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Legal Events

Date Code Title Description
MA Patent expired