FI842039A - Fodral foer optiskt element. - Google Patents

Fodral foer optiskt element. Download PDF

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Publication number
FI842039A
FI842039A FI842039A FI842039A FI842039A FI 842039 A FI842039 A FI 842039A FI 842039 A FI842039 A FI 842039A FI 842039 A FI842039 A FI 842039A FI 842039 A FI842039 A FI 842039A
Authority
FI
Finland
Prior art keywords
optical element
bonded
opening
fodral
foer
Prior art date
Application number
FI842039A
Other languages
English (en)
Other versions
FI74167B (fi
FI74167C (fi
FI842039A0 (fi
Inventor
Hideaki Nishizawa
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of FI842039A0 publication Critical patent/FI842039A0/fi
Publication of FI842039A publication Critical patent/FI842039A/fi
Publication of FI74167B publication Critical patent/FI74167B/fi
Application granted granted Critical
Publication of FI74167C publication Critical patent/FI74167C/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)
  • Optical Couplings Of Light Guides (AREA)
FI842039A 1983-05-31 1984-05-22 Hoelje foer optiskt element. FI74167C (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9762883 1983-05-31
JP58097628A JPS59220982A (ja) 1983-05-31 1983-05-31 光素子用パッケ−ジ

Publications (4)

Publication Number Publication Date
FI842039A0 FI842039A0 (fi) 1984-05-22
FI842039A true FI842039A (fi) 1984-12-01
FI74167B FI74167B (fi) 1987-08-31
FI74167C FI74167C (fi) 1987-12-10

Family

ID=14197440

Family Applications (1)

Application Number Title Priority Date Filing Date
FI842039A FI74167C (fi) 1983-05-31 1984-05-22 Hoelje foer optiskt element.

Country Status (10)

Country Link
US (1) US4636647A (fi)
EP (1) EP0127401B1 (fi)
JP (1) JPS59220982A (fi)
KR (1) KR890003386B1 (fi)
AU (1) AU575322B2 (fi)
CA (1) CA1242520A (fi)
DE (1) DE3473536D1 (fi)
DK (1) DK160112C (fi)
FI (1) FI74167C (fi)
NO (1) NO165515C (fi)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU573645B2 (en) * 1983-11-21 1988-06-16 Sumitomo Electric Industries, Ltd. Package for opto-electrical device
CA1267468A (en) * 1983-11-21 1990-04-03 Hideaki Nishizawa Optical device package
WO1987002833A1 (en) * 1985-10-28 1987-05-07 American Telephone & Telegraph Company Multilayer ceramic laser package
US4865038A (en) * 1986-10-09 1989-09-12 Novametrix Medical Systems, Inc. Sensor appliance for non-invasive monitoring
US5177806A (en) * 1986-12-05 1993-01-05 E. I. Du Pont De Nemours And Company Optical fiber feedthrough
FR2640430B1 (fr) * 1988-12-09 1992-07-31 Cit Alcatel Composant opto-electronique comprenant, notamment un boitier dans lequel est decoupee une fenetre
GB2228618B (en) * 1989-02-27 1993-04-14 Philips Electronic Associated Radiation detector
US4990896A (en) * 1989-05-09 1991-02-05 Gray William F Light responsive device for monitoring on-line indicator lights
US5149958A (en) * 1990-12-12 1992-09-22 Eastman Kodak Company Optoelectronic device component package
DE4214792A1 (de) * 1992-05-04 1993-11-11 Telefunken Microelectron Verfahren zum Herstellen eines optoelektronischen Koppelelements
DE19643911A1 (de) * 1996-10-30 1998-05-07 Sick Ag Schaltungsanordnung mit auf einem mit Leiterbahnen versehenen Substrat angebrachten optoelektronischen Bauelementen
US6214427B1 (en) 1998-08-28 2001-04-10 General Electric Company Method of making an electronic device having a single crystal substrate formed by solid state crystal conversion
GB2372633A (en) * 2001-02-24 2002-08-28 Mitel Semiconductor Ab Flip-chip mounted optical device
US7359646B2 (en) * 2001-09-14 2008-04-15 Finisar Corporation Transmitter and/or receiver arrangement of optical signal transmission
US6630661B1 (en) * 2001-12-12 2003-10-07 Amkor Technology, Inc. Sensor module with integrated discrete components mounted on a window
US7476906B2 (en) * 2002-01-09 2009-01-13 Osram Opto Semiconductors Gmbh Photodiode array and method for establishing a link between a first semiconductor element and a second semiconductor element
JP2004235324A (ja) * 2003-01-29 2004-08-19 Mitsubishi Electric Corp 表面実装型光部品
EP1496551B1 (en) * 2003-07-09 2013-08-21 Nichia Corporation Light emitting diode, method of manufacturing the same and lighting equipment incorporating the same
JP4670251B2 (ja) * 2004-04-13 2011-04-13 日亜化学工業株式会社 発光装置
JP5049145B2 (ja) * 2008-01-22 2012-10-17 日東電工株式会社 光導波路デバイスの製法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4965790A (fi) * 1972-10-27 1974-06-26
JPS5387380A (en) * 1977-01-12 1978-08-01 Kao Corp Tris(omega-hydroxy polyether)isocyanurate and its preparation
JPS5451788A (en) * 1977-09-30 1979-04-23 Mitsubishi Electric Corp Photoelectric transducer
JPS5513963A (en) * 1978-07-17 1980-01-31 Nec Corp Photo semiconductor device
US4227098A (en) * 1979-02-21 1980-10-07 General Electric Company Solid state relay
US4233614A (en) * 1979-03-06 1980-11-11 Rca Corporation Light emitting diode
US4355321A (en) * 1981-02-02 1982-10-19 Varian Associates, Inc. Optoelectronic assembly including light transmissive single crystal semiconductor window

Also Published As

Publication number Publication date
DK160112C (da) 1991-07-01
NO165515C (no) 1991-02-20
EP0127401B1 (en) 1988-08-17
DK160112B (da) 1991-01-28
NO842126L (no) 1984-12-03
KR890003386B1 (ko) 1989-09-19
NO165515B (no) 1990-11-12
CA1242520A (en) 1988-09-27
FI74167B (fi) 1987-08-31
DK253184A (da) 1984-12-01
JPS59220982A (ja) 1984-12-12
US4636647A (en) 1987-01-13
DE3473536D1 (en) 1988-09-22
DK253184D0 (da) 1984-05-23
EP0127401A1 (en) 1984-12-05
AU2808584A (en) 1984-12-06
KR840009372A (ko) 1984-12-26
FI74167C (fi) 1987-12-10
FI842039A0 (fi) 1984-05-22
JPH0481348B2 (fi) 1992-12-22
AU575322B2 (en) 1988-07-28

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Legal Events

Date Code Title Description
MM Patent lapsed
MM Patent lapsed

Owner name: SUMITOMO ELECTRIC INDUSTRIES, LTD.