FR2640430B1 - Composant opto-electronique comprenant, notamment un boitier dans lequel est decoupee une fenetre - Google Patents
Composant opto-electronique comprenant, notamment un boitier dans lequel est decoupee une fenetreInfo
- Publication number
- FR2640430B1 FR2640430B1 FR8816222A FR8816222A FR2640430B1 FR 2640430 B1 FR2640430 B1 FR 2640430B1 FR 8816222 A FR8816222 A FR 8816222A FR 8816222 A FR8816222 A FR 8816222A FR 2640430 B1 FR2640430 B1 FR 2640430B1
- Authority
- FR
- France
- Prior art keywords
- opto
- window
- housing
- cut
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005693 optoelectronics Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8816222A FR2640430B1 (fr) | 1988-12-09 | 1988-12-09 | Composant opto-electronique comprenant, notamment un boitier dans lequel est decoupee une fenetre |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8816222A FR2640430B1 (fr) | 1988-12-09 | 1988-12-09 | Composant opto-electronique comprenant, notamment un boitier dans lequel est decoupee une fenetre |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2640430A1 FR2640430A1 (fr) | 1990-06-15 |
FR2640430B1 true FR2640430B1 (fr) | 1992-07-31 |
Family
ID=9372775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8816222A Expired - Fee Related FR2640430B1 (fr) | 1988-12-09 | 1988-12-09 | Composant opto-electronique comprenant, notamment un boitier dans lequel est decoupee une fenetre |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2640430B1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4210331A1 (de) * | 1992-03-30 | 1993-10-07 | Bodenseewerk Geraetetech | Verbindung einer Fotodiode mit einem Lichtwellenleiter |
US6130448A (en) * | 1998-08-21 | 2000-10-10 | Gentex Corporation | Optical sensor package and method of making same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1581436A (en) * | 1977-05-30 | 1980-12-17 | Emi Ltd | Semiconductor device encapsulation |
US4268113A (en) * | 1979-04-16 | 1981-05-19 | International Business Machines Corporation | Signal coupling element for substrate-mounted optical transducers |
US4355321A (en) * | 1981-02-02 | 1982-10-19 | Varian Associates, Inc. | Optoelectronic assembly including light transmissive single crystal semiconductor window |
JPS59220982A (ja) * | 1983-05-31 | 1984-12-12 | Sumitomo Electric Ind Ltd | 光素子用パッケ−ジ |
EP0175936B1 (fr) * | 1984-09-24 | 1988-11-09 | Siemens Aktiengesellschaft | Appareil opto-électronique |
FR2586825B1 (fr) * | 1985-08-28 | 1987-10-23 | Comp Generale Electricite | Dispositif de couplage d'une fibre optique a une diode photosensible a eclairement arriere. |
-
1988
- 1988-12-09 FR FR8816222A patent/FR2640430B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2640430A1 (fr) | 1990-06-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |