FI20115488A - Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä - Google Patents

Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä Download PDF

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Publication number
FI20115488A
FI20115488A FI20115488A FI20115488A FI20115488A FI 20115488 A FI20115488 A FI 20115488A FI 20115488 A FI20115488 A FI 20115488A FI 20115488 A FI20115488 A FI 20115488A FI 20115488 A FI20115488 A FI 20115488A
Authority
FI
Finland
Prior art keywords
roll
production method
mass production
electrical bridges
bridges
Prior art date
Application number
FI20115488A
Other languages
English (en)
Swedish (sv)
Other versions
FI20115488A0 (fi
FI125720B (fi
Inventor
Tom Marttila
Original Assignee
Tecnomar Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tecnomar Oy filed Critical Tecnomar Oy
Publication of FI20115488A0 publication Critical patent/FI20115488A0/fi
Priority to FI20115488A priority Critical patent/FI125720B/fi
Priority to US13/881,987 priority patent/US8931166B2/en
Priority to BR112013010052-4A priority patent/BR112013010052B1/pt
Priority to ES12785334.9T priority patent/ES2475200T3/es
Priority to JP2013549860A priority patent/JP5544050B2/ja
Priority to EP12785334.9A priority patent/EP2620043B1/en
Priority to RU2013122712/07A priority patent/RU2519062C1/ru
Priority to PCT/FI2012/050475 priority patent/WO2012156590A1/en
Priority to CN201280004139.2A priority patent/CN103262671B/zh
Publication of FI20115488A publication Critical patent/FI20115488A/fi
Application granted granted Critical
Publication of FI125720B publication Critical patent/FI125720B/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
FI20115488A 2011-05-19 2011-05-19 Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä FI125720B (fi)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FI20115488A FI125720B (fi) 2011-05-19 2011-05-19 Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä
JP2013549860A JP5544050B2 (ja) 2011-05-19 2012-05-21 リール・トゥ・リールの大量生産に適した電気ブリッジの製造方法
BR112013010052-4A BR112013010052B1 (pt) 2011-05-19 2012-05-21 método de fabricação bobina-a-bobina de pontes elétricas ou entradas e ponte elétrica de uma antena de bobina de um tag rfid
ES12785334.9T ES2475200T3 (es) 2011-05-19 2012-05-21 Método de fabricación de puentes eléctricos adecuados para fabricación en masa carrete a carrete
US13/881,987 US8931166B2 (en) 2011-05-19 2012-05-21 Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing
EP12785334.9A EP2620043B1 (en) 2011-05-19 2012-05-21 Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing
RU2013122712/07A RU2519062C1 (ru) 2011-05-19 2012-05-21 Способ изготовления электрических перемычек, пригодный для массового производства по рулонной технологии
PCT/FI2012/050475 WO2012156590A1 (en) 2011-05-19 2012-05-21 Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing
CN201280004139.2A CN103262671B (zh) 2011-05-19 2012-05-21 适合于卷取大规模制造的电桥的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20115488 2011-05-19
FI20115488A FI125720B (fi) 2011-05-19 2011-05-19 Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä

Publications (3)

Publication Number Publication Date
FI20115488A0 FI20115488A0 (fi) 2011-05-19
FI20115488A true FI20115488A (fi) 2012-11-20
FI125720B FI125720B (fi) 2016-01-29

Family

ID=44071614

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20115488A FI125720B (fi) 2011-05-19 2011-05-19 Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä

Country Status (9)

Country Link
US (1) US8931166B2 (fi)
EP (1) EP2620043B1 (fi)
JP (1) JP5544050B2 (fi)
CN (1) CN103262671B (fi)
BR (1) BR112013010052B1 (fi)
ES (1) ES2475200T3 (fi)
FI (1) FI125720B (fi)
RU (1) RU2519062C1 (fi)
WO (1) WO2012156590A1 (fi)

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US9812782B2 (en) 2011-08-08 2017-11-07 Féinics Amatech Teoranta Coupling frames for RFID devices
US9634391B2 (en) 2011-08-08 2017-04-25 Féinics Amatech Teoranta RFID transponder chip modules
US10248902B1 (en) 2017-11-06 2019-04-02 Féinics Amatech Teoranta Coupling frames for RFID devices
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US20130220689A1 (en) 2013-08-29
RU2519062C1 (ru) 2014-06-10
JP2014503100A (ja) 2014-02-06
ES2475200T3 (es) 2014-07-10
FI20115488A0 (fi) 2011-05-19
EP2620043A4 (en) 2013-10-30
FI125720B (fi) 2016-01-29
EP2620043A1 (en) 2013-07-31
EP2620043B1 (en) 2014-05-14
BR112013010052A2 (pt) 2016-08-02
US8931166B2 (en) 2015-01-13
JP5544050B2 (ja) 2014-07-09
CN103262671A (zh) 2013-08-21
CN103262671B (zh) 2014-07-30
BR112013010052B1 (pt) 2020-07-21

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