FI20070910A0 - Menetelmä piirilevyjen panelisointiin - Google Patents

Menetelmä piirilevyjen panelisointiin

Info

Publication number
FI20070910A0
FI20070910A0 FI20070910A FI20070910A FI20070910A0 FI 20070910 A0 FI20070910 A0 FI 20070910A0 FI 20070910 A FI20070910 A FI 20070910A FI 20070910 A FI20070910 A FI 20070910A FI 20070910 A0 FI20070910 A0 FI 20070910A0
Authority
FI
Finland
Prior art keywords
panel board
paneling
board paneling
panel
board
Prior art date
Application number
FI20070910A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Inventor
Kimmo Olavi Paananen
Original Assignee
Kimmo Olavi Paananen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kimmo Olavi Paananen filed Critical Kimmo Olavi Paananen
Priority to FI20070910A priority Critical patent/FI20070910A0/fi
Publication of FI20070910A0 publication Critical patent/FI20070910A0/fi
Priority to PCT/FI2008/050682 priority patent/WO2009068741A1/fr
Priority to US12/743,843 priority patent/US20100263207A1/en
Priority to KR1020107013882A priority patent/KR20100082032A/ko
Priority to CN200880119085.8A priority patent/CN101940076A/zh
Priority to EP08855005A priority patent/EP2223580A4/fr
Priority to JP2010535418A priority patent/JP2011505075A/ja
Priority to TW097145671A priority patent/TW200934321A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FI20070910A 2007-11-27 2007-11-27 Menetelmä piirilevyjen panelisointiin FI20070910A0 (fi)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FI20070910A FI20070910A0 (fi) 2007-11-27 2007-11-27 Menetelmä piirilevyjen panelisointiin
PCT/FI2008/050682 WO2009068741A1 (fr) 2007-11-27 2008-11-25 Procédé de panellisation destiné à la fabrication de cartes de circuits imprimés
US12/743,843 US20100263207A1 (en) 2007-11-27 2008-11-25 Panelizing Method for Printed Circuit Board Manufacturing
KR1020107013882A KR20100082032A (ko) 2007-11-27 2008-11-25 인쇄회로기판 제조를 위한 패널화 방법
CN200880119085.8A CN101940076A (zh) 2007-11-27 2008-11-25 用于印刷电路板制作的面板化方法
EP08855005A EP2223580A4 (fr) 2007-11-27 2008-11-25 Procédé de panellisation destiné à la fabrication de cartes de circuits imprimés
JP2010535418A JP2011505075A (ja) 2007-11-27 2008-11-25 印刷基板を製造するためのパネル化方法
TW097145671A TW200934321A (en) 2007-11-27 2008-11-26 Panelizing method for printed circuit board manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20070910A FI20070910A0 (fi) 2007-11-27 2007-11-27 Menetelmä piirilevyjen panelisointiin

Publications (1)

Publication Number Publication Date
FI20070910A0 true FI20070910A0 (fi) 2007-11-27

Family

ID=38786688

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20070910A FI20070910A0 (fi) 2007-11-27 2007-11-27 Menetelmä piirilevyjen panelisointiin

Country Status (8)

Country Link
US (1) US20100263207A1 (fr)
EP (1) EP2223580A4 (fr)
JP (1) JP2011505075A (fr)
KR (1) KR20100082032A (fr)
CN (1) CN101940076A (fr)
FI (1) FI20070910A0 (fr)
TW (1) TW200934321A (fr)
WO (1) WO2009068741A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT12323U1 (de) 2009-03-09 2012-03-15 Austria Tech & System Tech Verfahren und system zum verbinden einer mehrzahl von leiterplatten mit wenigstens einem rahmen- bzw. trägerelement sowie leiterplatte und rahmen- bzw. trägerelement
JP2011014890A (ja) * 2009-06-02 2011-01-20 Mitsubishi Chemicals Corp 金属基板及び光源装置
AT12320U1 (de) 2009-09-03 2012-03-15 Austria Tech & System Tech Verfahren zum verbinden einer mehrzahl von elementen einer leiterplatte, leiterplatte sowie verwendung eines derartigen verfahrens
AT12722U1 (de) * 2010-03-16 2012-10-15 Austria Tech & System Tech Verfahren und verbund zum bearbeiten bzw. behandeln einer mehrzahl von leiterplatten sowie verwendung hiefür
AT12738U1 (de) * 2010-10-13 2012-10-15 Austria Tech & System Tech Verfahren und system zum bereitstellen eines insbesondere eine mehrzahl von leiterplattenelementen enthaltenden plattenförmigen gegenstands
CN103369861A (zh) * 2012-04-09 2013-10-23 富葵精密组件(深圳)有限公司 连片电路板以及连片电路板的制作方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3465435A (en) * 1967-05-08 1969-09-09 Ibm Method of forming an interconnecting multilayer circuitry
US4591220A (en) * 1984-10-12 1986-05-27 Rollin Mettler Injection molded multi-layer circuit board and method of making same
US5219292A (en) * 1992-04-03 1993-06-15 Motorola, Inc. Printed circuit board interconnection
JPH0936505A (ja) * 1995-07-20 1997-02-07 Canon Inc フレキシブルプリント基板原板
DE19600928A1 (de) * 1996-01-12 1997-07-24 Ibm Vorrichtung zur Handhabung von Leiterplatten und deren Herstellung
US5938455A (en) * 1996-05-15 1999-08-17 Ford Motor Company Three-dimensional molded circuit board having interlocking connections
JPH1168290A (ja) * 1997-08-26 1999-03-09 Matsushita Electric Ind Co Ltd 回路基板用成形体及びその製造方法
JP3833425B2 (ja) * 1999-10-27 2006-10-11 富士通株式会社 プリント配線板どうしの接続方法およびプリント基板
JP2001203482A (ja) * 2000-01-21 2001-07-27 Hitachi Kokusai Electric Inc 着脱可能なプリント基板取り付けフレーム
JP4249910B2 (ja) * 2001-03-26 2009-04-08 イビデン株式会社 多ピース基板およびその製造方法
US20030029034A1 (en) * 2001-08-08 2003-02-13 Unitech Printed Circuit Board Corp. Method of removing and replacing defective piece of printed circuit board formed on a panel
JP4177814B2 (ja) * 2002-09-03 2008-11-05 ピーシービー プラス インコーポレーテッド Ｐｃｂパネルの不良ｐｃｂ単品の交換装置
JP2005322878A (ja) * 2004-04-09 2005-11-17 Dainippon Printing Co Ltd 印刷配線基板の組付パネル、印刷配線基板の実装用単位シート、リジッド−フレキシブル基板及びこれらの製造方法
EP1862040A4 (fr) * 2005-03-15 2009-11-04 Stablcore Inc Procede de fabrication permettant d'incorporer un materiau d'ame integree dans des cartes imprimees
TW200717208A (en) * 2005-10-18 2007-05-01 Sheng-San Gu Defective connected piece of PCB reset method and system thereof
CN1993016B (zh) * 2005-12-26 2010-09-29 宏达国际电子股份有限公司 组合板对准结构及其方法
US7231701B1 (en) * 2006-01-06 2007-06-19 Ho-Ching Yang Modular PCB and method of replacing a malfunctioned module of the PCB

Also Published As

Publication number Publication date
CN101940076A (zh) 2011-01-05
KR20100082032A (ko) 2010-07-15
JP2011505075A (ja) 2011-02-17
TW200934321A (en) 2009-08-01
EP2223580A4 (fr) 2011-02-02
WO2009068741A1 (fr) 2009-06-04
EP2223580A1 (fr) 2010-09-01
US20100263207A1 (en) 2010-10-21

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Legal Events

Date Code Title Description
FD Application lapsed