FI122616B - Förstärkt konstruktionsmodul och förfarande för tillverkning därav - Google Patents
Förstärkt konstruktionsmodul och förfarande för tillverkning därav Download PDFInfo
- Publication number
- FI122616B FI122616B FI20105096A FI20105096A FI122616B FI 122616 B FI122616 B FI 122616B FI 20105096 A FI20105096 A FI 20105096A FI 20105096 A FI20105096 A FI 20105096A FI 122616 B FI122616 B FI 122616B
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- module
- substrate
- coating
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- glass substrate
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- 238000000034 method Methods 0.000 title claims description 62
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims description 99
- 239000011521 glass Substances 0.000 claims description 59
- 239000002243 precursor Substances 0.000 claims description 59
- 238000006243 chemical reaction Methods 0.000 claims description 55
- 238000000576 coating method Methods 0.000 claims description 55
- 239000011248 coating agent Substances 0.000 claims description 46
- 125000006850 spacer group Chemical group 0.000 claims description 25
- 238000000231 atomic layer deposition Methods 0.000 claims description 19
- 239000010408 film Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 10
- 239000004973 liquid crystal related substance Substances 0.000 claims description 9
- 239000010409 thin film Substances 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000000806 elastomer Substances 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 230000004927 fusion Effects 0.000 claims 1
- 239000000156 glass melt Substances 0.000 claims 1
- PWPJGUXAGUPAHP-UHFFFAOYSA-N lufenuron Chemical compound C1=C(Cl)C(OC(F)(F)C(C(F)(F)F)F)=CC(Cl)=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F PWPJGUXAGUPAHP-UHFFFAOYSA-N 0.000 claims 1
- 239000000126 substance Substances 0.000 description 10
- 239000010410 layer Substances 0.000 description 9
- 239000012159 carrier gas Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 6
- 239000012528 membrane Substances 0.000 description 5
- 239000006227 byproduct Substances 0.000 description 4
- 238000010926 purge Methods 0.000 description 4
- 230000002787 reinforcement Effects 0.000 description 4
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 238000000746 purification Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000006557 surface reaction Methods 0.000 description 2
- 230000032900 absorption of visible light Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 description 1
- 238000000678 plasma activation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45555—Atomic layer deposition [ALD] applied in non-semiconductor technology
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/245—Oxides by deposition from the vapour phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133311—Environmental protection, e.g. against dust or humidity
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/21—Oxides
- C03C2217/214—Al2O3
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/50—Protective arrangements
- G02F2201/503—Arrangements improving the resistance to shock
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Geochemistry & Mineralogy (AREA)
- General Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Biodiversity & Conservation Biology (AREA)
- Ecology (AREA)
- Environmental & Geological Engineering (AREA)
- Environmental Sciences (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Claims (25)
1. Förstärkt konstruktionsmodul (2), inne-fattande ett väsentligt plant glassubstrat (1), ett väsentligt plant andra substrat (3) och ätminstone ett 5 mellanläggselement (5) mellan glassubstratet (1) och det andra substratet (3) i beröring med glassubstra-tets (1) plana yta och med det andra substratets (3) plana yta, vilket ätminstone ena mellanläggselement (5) halier glassubstratet (1) och det andra substratet 10 (3) skilt frän varandra vid dessa tvä substrats kanter och avgränsar ett utrymme (7) mellan dessa tvä substrat innanför modulen (2), kännetecknad av att modulen (2) innefattar en ytbeläggning (9), som omger modulen (2) omkring modulens (2) utsida, vilken 15 ytbeläggning (9) är anordnad längs ytan pä glassubstratet (1), det andra substratet (3) och det ät minstone ena mellanläggselementet (5) , pä ytorna rik-tade mot modulens (2) utsida, för att öka modulens (2) styrka. 20
2 . Modul (2) enligt patentkrav 1, kän netecknad av att utrymmet (7) mellan de tvä substraten är ett slutet utrymme.
3. Modul (2) enligt nägot av patentkraven 1-2, kännetecknad av att ytbeläggningen (9) är 25 en enhetlig tunnfilm.
^ 4. Modul (2) enligt nägot av patentkraven 1 o -3, kännetecknad av att det andra substra- c\j ^ tet (3) bestär av glas. o co
5. Modul (2) enligt nägot av patentkraven 1 o x 30 - 4, kännetecknad av att modulen (2) är en cc modul (2) i en flat panelskärm. co
6. Modul (2) enligt nägot av patentkraven 1 io ° -5, kännetecknad av att utrymmet (7) mellan ^ tvä substrat innefattar flytkristaller, som lämpar sig 35 för en flytkristallskärm.
7. Modul (2) enligt nägot av patentkraven 1 - 6, kännetecknad av att ätminstone ett mel-lanläggselement (5) sluter ett utrymme (7) för att förhindra ett gasflöde frän modulens (2) utsida tili 5 modulens (2) insida.
8. Modul (2) enligt nägot av patentkraven 1 - 7, kännetecknad av att mellanläggselementets (5) material valts i gruppen bestäende av epoxyhart-ser, elastomerer och glassmältor.
9. Modul (2) enligt nägot av patentkraven 1 - 8, kännetecknad av att det väsentligt plana glassubstratet (1) är i genomsnitt tunnare an 1,5 millimeter .
10. Modul (2) enligt nägot av patentkraven 1 15 -9, kännetecknad av att ytbeläggningens (9) tjocklek är under 50 nanometer.
11. Förfarande för att tillverka en förstärkt konstruktionsmodul (2), vilken modul innefattar ett väsentligt plant glassubstrat (1), ett väsentligt 20 plant andra substrat (3) och ätminstone ett mellan-läggselement (5) , vilket förfarande innefattar anord-nandet av det ätminstone ena mellanläggselementet (5) mellan det väsentligt plana glassubstratet (1) och det väsentligt plana andra substratet (3) i beröring med 25 glassubstratets (1) plana yta och det andra substra-tets (3) plana yta, vilket ätminstone ena mellanlägg-o selement (5) häller glassubstratet (1) och det andra CVJ ^ substratet skilt frän varandra vid dessa tvä substrats o ^ kanter och avgränsar ett utrymme (7) mellan dessa tva ° 30 substrat innanför modulen (2) , kännetecknat X £ av att förfarandet innefattar - utformning av en ytbeläggning (9), som om-o g ger modulen (2) omkring modulens (2) utsida, δ längs ytan pä glassubstratet (1) , det andra CM 35 substratet (3) och det ätminstone ena mellan- läggselementet (5), pä ytorna riktade mot mo-dulens utsida, för att öka modulens styrka.
12. Förfarande enligt patentkrav 11, k ä n -netecknat av att utrymmet (7) mellan de tvä 5 substraten är ett slutet utryirane.
13. Förfarande enligt nägot av patentkraven 11 - 12, kännetecknad av att ytbeläggningen (9) är en enhetlig tunnfilm.
14. Förfarande enligt nägot av patentkraven 10 11 - 13, kännetecknat av att utformningen av ytbeläggningen (9) innefattar att deponera en enhetlig film längs ytan pä ytorna riktade mot modulens utsida.
15. Förfarande enligt nägot av patentkraven 15 11 - 14, kännetecknat av att utformningen av ytbeläggningen (9) innefattar - att föra en första prekursor tili ett re- aktionsrum, sä att ätminstone en del av den första prekursorn adsorberas i ytorna riktade mot modulens 20 utsida, och att därefter rengöra reaktionsrummet, och - att föra en andra prekursor tili ett reakt-ionsrum, sä att ätminstone en del av den andra prekursorn reagerar med den adsorberade delen av den första prekursorn, och att därefter rengöra reakt- 25 ionsrummet. OJ o
16· Förfarande enligt nägot av patentkraven CVJ 11 - 15, kännetecknat av att utformningen av ytbeläggningen innefattar att deponera en ytbe-oo ° läggning (9) med en process av typ atomskiktsbelägg- ί 30 ning (Atomic Layer Deposition, ALD).
^ 17. Förfarande enligt nägot av patentkraven S 11 - 16, kännetecknat av att det andra sub- O o stratet (3) bestär av glas. CM
18. Förfarande enligt nägot av patentkraven 11 - 17, kännetecknat av att modulen (2) är en modul i en flat panelskärm.
19. Förfarande enligt nägot av patentkraven 5 11 - 18, kännetecknat av att utrymmet (7) mellan tvä substrat innefattar flytkristaller, som lämpar sig för en flytkristallskärm.
20. Förfarande enligt nägot av patentkraven 11 - 19, kännetecknat av att det ätminstone 10 ena mellanläggselementet (5) sluter ett utrymme (7) för att förhindra ett glasflöde frän modulens (2) ut-sida tili modulens (2) insida.
21. Förfarande enligt nägot av patentkraven 11 - 20, kännetecknat av att mellan- 15 läggselementets (5) material valts i gruppen bestä-ende av epoxyhartser, elastomerer och glassmältor.
22. Förfarande enligt nägot av patentkraven 11 - 21, kännetecknat av att det väsentligt plana glassubstratet (1) är i genomsnitt tunnare än 20 1,5 millimeter.
23. Förfarande enligt nägot av patentkraven 11 - 22, kännetecknat av att ytbeläggning-ens (9) tjocklek är under 50 nanometer.
24. Förfarande enligt patentkraven 11, 25 kännetecknat av att förfarandet används för cvj 1- att trllverka en modul (2) för en bildskärm. o (M ,1
25. Användning av en modul (2) enligt patent ee 1 krav 1 l en bildskräm. co o X en CL CD O) o m o δ (M
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20105096A FI122616B (sv) | 2010-02-02 | 2010-02-02 | Förstärkt konstruktionsmodul och förfarande för tillverkning därav |
| TW100102412A TW201213984A (en) | 2010-02-02 | 2011-01-24 | Strengthened structural module and method of fabrication |
| CN201180007993.XA CN102770801B (zh) | 2010-02-02 | 2011-01-31 | 强化结构模件和制造方法 |
| EA201290729A EA201290729A1 (ru) | 2010-02-02 | 2011-01-31 | Упрочненный конструкционный модуль и способ его изготовления |
| EP11739440.3A EP2531885A4 (en) | 2010-02-02 | 2011-01-31 | REINFORCED STRUCTURAL MODULE AND METHOD OF MANUFACTURE |
| KR1020127022924A KR20120115566A (ko) | 2010-02-02 | 2011-01-31 | 보강 구조 모듈 및 제조방법 |
| PCT/FI2011/050073 WO2011095681A1 (en) | 2010-02-02 | 2011-01-31 | Strengthened structural module and method of fabrication |
| US13/576,590 US8780314B2 (en) | 2010-02-02 | 2011-01-31 | Strengthened structural module and method of fabrication |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20105096 | 2010-02-02 | ||
| FI20105096A FI122616B (sv) | 2010-02-02 | 2010-02-02 | Förstärkt konstruktionsmodul och förfarande för tillverkning därav |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| FI20105096A0 FI20105096A0 (sv) | 2010-02-02 |
| FI20105096A FI20105096A (sv) | 2011-08-03 |
| FI122616B true FI122616B (sv) | 2012-04-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI20105096A FI122616B (sv) | 2010-02-02 | 2010-02-02 | Förstärkt konstruktionsmodul och förfarande för tillverkning därav |
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| US (1) | US8780314B2 (sv) |
| EP (1) | EP2531885A4 (sv) |
| KR (1) | KR20120115566A (sv) |
| CN (1) | CN102770801B (sv) |
| EA (1) | EA201290729A1 (sv) |
| FI (1) | FI122616B (sv) |
| TW (1) | TW201213984A (sv) |
| WO (1) | WO2011095681A1 (sv) |
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|---|---|---|---|---|
| CN102468307A (zh) * | 2010-11-15 | 2012-05-23 | 联建(中国)科技有限公司 | 基板模组、显示面板以及触控面板 |
| JP6361327B2 (ja) | 2014-07-02 | 2018-07-25 | セイコーエプソン株式会社 | 電気光学装置、及び電子機器 |
| US20160376705A1 (en) * | 2015-06-25 | 2016-12-29 | The Regents Of The University Of California | Method for optical coating of large scale substrates |
Family Cites Families (18)
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| FI57975C (fi) | 1979-02-28 | 1980-11-10 | Lohja Ab Oy | Foerfarande och anordning vid uppbyggande av tunna foereningshinnor |
| US4389973A (en) | 1980-03-18 | 1983-06-28 | Oy Lohja Ab | Apparatus for performing growth of compound thin films |
| US6174377B1 (en) | 1997-03-03 | 2001-01-16 | Genus, Inc. | Processing chamber for atomic layer deposition processes |
| US6689626B2 (en) | 1998-07-20 | 2004-02-10 | Koninklijke Philips Electronics N.V. | Flexible substrate |
| TW548239B (en) | 2000-10-23 | 2003-08-21 | Asm Microchemistry Oy | Process for producing aluminium oxide films at low temperatures |
| US6926572B2 (en) * | 2002-01-25 | 2005-08-09 | Electronics And Telecommunications Research Institute | Flat panel display device and method of forming passivation film in the flat panel display device |
| US6887521B2 (en) * | 2002-08-15 | 2005-05-03 | Micron Technology, Inc. | Gas delivery system for pulsed-type deposition processes used in the manufacturing of micro-devices |
| KR100641793B1 (ko) | 2002-12-26 | 2006-11-02 | 샤프 가부시키가이샤 | 표시패널 및 그 제조방법 |
| US20110043742A1 (en) * | 2003-02-21 | 2011-02-24 | Cavanaugh Shanti A | Contamination prevention in liquid crystal cells |
| KR20120061906A (ko) | 2003-05-16 | 2012-06-13 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 원자층 증착에 의해 제작된 플라스틱 기판용 배리어 필름 |
| US20060284556A1 (en) * | 2003-11-12 | 2006-12-21 | Tremel James D | Electronic devices and a method for encapsulating electronic devices |
| KR100700000B1 (ko) * | 2004-10-19 | 2007-03-26 | 삼성에스디아이 주식회사 | 표시장치와 그 제조방법 |
| US20080259268A1 (en) * | 2007-04-12 | 2008-10-23 | Fujifilm Corporation | Process of producing substrate for liquid crystal display device |
| US7990060B2 (en) * | 2007-05-31 | 2011-08-02 | Lg Display Co., Ltd. | Organic light emitting display device and method of manufacturing the same |
| US20090079328A1 (en) | 2007-09-26 | 2009-03-26 | Fedorovskaya Elena A | Thin film encapsulation containing zinc oxide |
| FI120832B (sv) | 2007-12-03 | 2010-03-31 | Beneq Oy | Förfarande för att förbättra hållfastheten hos en tunn glas |
| JP2010055918A (ja) * | 2008-08-28 | 2010-03-11 | Seiko Epson Corp | 電気光学装置、電気光学装置の製造方法、及び電子機器 |
| WO2011112587A1 (en) * | 2010-03-09 | 2011-09-15 | First Solar, Inc. | Deposition chamber cleaning system and method |
-
2010
- 2010-02-02 FI FI20105096A patent/FI122616B/sv not_active IP Right Cessation
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2011
- 2011-01-24 TW TW100102412A patent/TW201213984A/zh unknown
- 2011-01-31 KR KR1020127022924A patent/KR20120115566A/ko not_active Application Discontinuation
- 2011-01-31 WO PCT/FI2011/050073 patent/WO2011095681A1/en active Application Filing
- 2011-01-31 EA EA201290729A patent/EA201290729A1/ru unknown
- 2011-01-31 EP EP11739440.3A patent/EP2531885A4/en not_active Withdrawn
- 2011-01-31 US US13/576,590 patent/US8780314B2/en active Active
- 2011-01-31 CN CN201180007993.XA patent/CN102770801B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102770801B (zh) | 2015-11-25 |
| FI20105096A (sv) | 2011-08-03 |
| EP2531885A4 (en) | 2014-08-06 |
| EP2531885A1 (en) | 2012-12-12 |
| US8780314B2 (en) | 2014-07-15 |
| CN102770801A (zh) | 2012-11-07 |
| TW201213984A (en) | 2012-04-01 |
| FI20105096A0 (sv) | 2010-02-02 |
| US20120307193A1 (en) | 2012-12-06 |
| KR20120115566A (ko) | 2012-10-18 |
| EA201290729A1 (ru) | 2013-03-29 |
| WO2011095681A1 (en) | 2011-08-11 |
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