FI121157B - Elanslutningskomponent - Google Patents
Elanslutningskomponent Download PDFInfo
- Publication number
- FI121157B FI121157B FI20050976A FI20050976A FI121157B FI 121157 B FI121157 B FI 121157B FI 20050976 A FI20050976 A FI 20050976A FI 20050976 A FI20050976 A FI 20050976A FI 121157 B FI121157 B FI 121157B
- Authority
- FI
- Finland
- Prior art keywords
- conductive pattern
- electrical connection
- connection component
- bending
- gel
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2938—Coating on discrete and individual rods, strands or filaments
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer
Claims (5)
1. Elanslutningskomponent, innefattande skivaktiga, elastiska ledande mönster-delar (11), en skivaktig geldel (13), i vilken nämnda ledande mönsterdelar är in-25 sänkta, och elastiska bottenmaterialskivor (15a, 15b), som häller nämnda geldel emellan sig, kännetecknad av att elkomponenten dessutom innefattar ett tunt ledande filmskikt (17) som beläggning pä vaqe ledande mönsterdels yttre yta och en elastisk extra bottenmaterialskiva (15c), som delar nämnda geldel i tjockleksrikt-ningen i tvä delar, varvid nämnda ledande mönsterdelar är placerade i nämnda de-30 lar.
2. Elanslutningskomponent enligt patentkrav 1, varvid de ledande mönsterdelar-na är anpassade i forhällande till en implicit mittlinje, som halverar nämnda geldel i dess tjockleksriktning.
3. Elanslutningskomponent enligt patentkrav 1, varvid de ledande mönsterdelar-5 na är anpassade altemerande ovanför och nedanför i forhällande till den implicita mittlinjen, som halverar nämnda geldel i dess tjockleksriktning.
4. Elanslutningskomponent enligt patentkrav 1, varvid de ledande mönsterdelar-na är anpassade i forhällande till implicita mittlinjer, som halverar nämnda geldels tvä delar i deras tjockleksriktning sä att mönsterdelama är riktade snett tvärs over 10 mittlinjen.
5. Elanslutningskomponent enligt nägot av patentkraven 1 eller 4, varvid det tunna ledande filmskiktet är ett metallbeläggningsskikt, som har högre konduktivitet än nämnda ledande mönsterdel.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003093835A JP3610400B2 (ja) | 2003-03-31 | 2003-03-31 | 電気接続部品 |
JP2003093835 | 2003-03-31 | ||
JP2004003721 | 2004-03-19 | ||
PCT/JP2004/003721 WO2004089047A1 (ja) | 2003-03-31 | 2004-03-19 | 電気接続部品 |
Publications (3)
Publication Number | Publication Date |
---|---|
FI20050976A0 FI20050976A0 (sv) | 2005-09-29 |
FI20050976A FI20050976A (sv) | 2005-11-28 |
FI121157B true FI121157B (sv) | 2010-07-30 |
Family
ID=33127371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20050976A FI121157B (sv) | 2003-03-31 | 2005-09-29 | Elanslutningskomponent |
Country Status (5)
Country | Link |
---|---|
US (1) | US7323245B2 (sv) |
JP (1) | JP3610400B2 (sv) |
CN (1) | CN100391317C (sv) |
FI (1) | FI121157B (sv) |
WO (1) | WO2004089047A1 (sv) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009047329A1 (de) * | 2009-12-01 | 2011-06-09 | Robert Bosch Gmbh | Flexible Leiterplatte sowie elektrische Vorrichtung |
US20140218637A1 (en) * | 2013-02-06 | 2014-08-07 | Nanchang O-Film Tech. Co., Ltd. | Conductive film, manufacturing method thereof, and touch screen including the conducting film |
KR101473312B1 (ko) * | 2013-05-31 | 2014-12-16 | 삼성디스플레이 주식회사 | 플렉시블 터치스크린패널과 그것을 구비한 플렉시블 디스플레이 장치 |
KR20150008764A (ko) * | 2013-07-15 | 2015-01-23 | 지미숙 | 저전압차동신호용 플렉시블 플랫 케이블 |
KR102152101B1 (ko) * | 2018-11-02 | 2020-09-07 | 진영글로벌 주식회사 | 차량 전장용 디바이스 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3057952A (en) * | 1960-10-31 | 1962-10-09 | Sanders Associates Inc | Multi-ply flexible wiring unit |
US3215574A (en) * | 1963-03-25 | 1965-11-02 | Hughes Aircraft Co | Method of making thin flexible plasticsealed printed circuits |
US4306925A (en) * | 1977-01-11 | 1981-12-22 | Pactel Corporation | Method of manufacturing high density printed circuit |
US4824511A (en) * | 1987-10-19 | 1989-04-25 | E. I. Du Pont De Nemours And Company | Multilayer circuit board with fluoropolymer interlayers |
US5219640A (en) * | 1991-02-08 | 1993-06-15 | Rogers Corporation | Flexible circuit having flexing section of reduced stiffness, and method of manufacture thereof |
JPH07336026A (ja) * | 1994-06-09 | 1995-12-22 | Hitachi Chem Co Ltd | カバーレイフィルム付フレキシブル印刷配線板の製造法 |
US5972152A (en) * | 1997-05-16 | 1999-10-26 | Micron Communications, Inc. | Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier |
JPH10341065A (ja) * | 1997-06-06 | 1998-12-22 | Sony Corp | 補強板付きプリント配線板 |
DE19812880A1 (de) * | 1998-03-24 | 1999-09-30 | Bayer Ag | Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung |
JP3110408B2 (ja) | 1998-12-25 | 2000-11-20 | 静岡日本電気株式会社 | 携帯機器の液晶表示デバイス保持構造 |
JP2000223835A (ja) | 1999-01-29 | 2000-08-11 | Canon Inc | 多層配線板 |
KR100396925B1 (ko) | 1999-03-11 | 2003-09-03 | 세이코 엡슨 가부시키가이샤 | 가요성 배선 기판, 필름 캐리어, 테이프형 반도체장치,반도체장치 및 그 제조방법, 회로기판 및 전자기기 |
JP3694825B2 (ja) * | 1999-11-18 | 2005-09-14 | 日本航空電子工業株式会社 | 導体パターンの形成方法及びコネクタ、フレキシブルプリント配線板、異方導電性部材 |
JP2002124741A (ja) * | 2000-10-16 | 2002-04-26 | Nec Saitama Ltd | フレキシブルプリント基板 |
KR100520145B1 (ko) * | 2001-06-08 | 2005-10-10 | 나녹스 가부시키가이샤 | 액정표시장치의 제조방법 |
US6815126B2 (en) * | 2002-04-09 | 2004-11-09 | International Business Machines Corporation | Printed wiring board with conformally plated circuit traces |
JP2004039543A (ja) * | 2002-07-05 | 2004-02-05 | Matsushita Electric Ind Co Ltd | 平板状配線ケーブル及び磁気記録装置 |
-
2003
- 2003-03-31 JP JP2003093835A patent/JP3610400B2/ja not_active Expired - Fee Related
-
2004
- 2004-03-19 WO PCT/JP2004/003721 patent/WO2004089047A1/ja active Application Filing
- 2004-03-19 CN CNB2004800072076A patent/CN100391317C/zh not_active Expired - Fee Related
- 2004-03-19 US US10/551,067 patent/US7323245B2/en not_active Expired - Fee Related
-
2005
- 2005-09-29 FI FI20050976A patent/FI121157B/sv not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1765159A (zh) | 2006-04-26 |
US7323245B2 (en) | 2008-01-29 |
CN100391317C (zh) | 2008-05-28 |
US20060180338A1 (en) | 2006-08-17 |
JP3610400B2 (ja) | 2005-01-12 |
FI20050976A (sv) | 2005-11-28 |
FI20050976A0 (sv) | 2005-09-29 |
JP2004303888A (ja) | 2004-10-28 |
WO2004089047A1 (ja) | 2004-10-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100868010B1 (ko) | 리지드 기판의 접속 구조 | |
FI121157B (sv) | Elanslutningskomponent | |
KR20070078775A (ko) | 다층 구조의 프린트 배선 기판 및 프린트 배선 기판의 제조방법 | |
WO2009038950A2 (en) | Flexible circuit board, manufacturing method thereof, and electronic device using the same | |
US8222530B2 (en) | Wired circuit board assembly sheet | |
JP7241622B2 (ja) | 電気機器、表示装置及びそれらの製造方法 | |
US7234965B2 (en) | Wiring structure using flexible printed circuit board and optical module using the same | |
WO2017111125A1 (ja) | プリント配線板、及びカメラモジュール | |
US20060220191A1 (en) | Electronic package with a stepped-pitch leadframe | |
JP2004031555A (ja) | 回路基板装置および基板間の接続方法 | |
JPWO2010021286A1 (ja) | 接続端子、コネクタ、ソケットおよび半導体パッケージ | |
KR20090084710A (ko) | 배선 회로 기판 및 그 제조 방법 | |
US20110090664A1 (en) | Shield case mounting substrate | |
JP2000196205A (ja) | フレキシブルプリント基板 | |
KR20180116116A (ko) | 칩 온 필름, 이를 갖는 플렉시블 디스플레이 장치, 및 그 제조 방법 | |
JPH11317568A (ja) | 配線基板の補強方法 | |
JP2009141129A (ja) | フレキシブルプリント配線板およびその製造方法 | |
KR101091889B1 (ko) | 연성회로기판 | |
JP2011119403A (ja) | フレキシブルプリント基板 | |
JP5107024B2 (ja) | 両面フレキシブルプリント基板 | |
CN105976836B (zh) | 带电路的悬挂基板及其制造方法 | |
CN215581917U (zh) | 电路板和马达 | |
CN106852009B (zh) | 带电路的悬挂基板和带电路的悬挂基板的制造方法 | |
JP4107598B2 (ja) | コネクタ | |
JPH10294332A (ja) | テープキャリアパッケージ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Patent granted |
Ref document number: 121157 Country of ref document: FI |
|
MM | Patent lapsed |