FI116265B - Painettu piirilevy - Google Patents

Painettu piirilevy Download PDF

Info

Publication number
FI116265B
FI116265B FI992062A FI19992062A FI116265B FI 116265 B FI116265 B FI 116265B FI 992062 A FI992062 A FI 992062A FI 19992062 A FI19992062 A FI 19992062A FI 116265 B FI116265 B FI 116265B
Authority
FI
Finland
Prior art keywords
circuit board
printed circuit
conductor patterns
electronic components
adjacent conductor
Prior art date
Application number
FI992062A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI19992062A (fi
Inventor
Yoshiaki Suzuki
Yosuke Kanemoto
Motokazu Sasa
Original Assignee
Smk Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smk Kk filed Critical Smk Kk
Publication of FI19992062A publication Critical patent/FI19992062A/fi
Application granted granted Critical
Publication of FI116265B publication Critical patent/FI116265B/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
FI992062A 1998-01-29 1999-09-27 Painettu piirilevy FI116265B (fi)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP3223698 1998-01-29
JP10032236A JPH11220234A (ja) 1998-01-29 1998-01-29 回路基板
PCT/JP1999/000348 WO1999039555A1 (fr) 1998-01-29 1999-01-28 Plaquette de circuit
JP9900348 1999-01-28

Publications (2)

Publication Number Publication Date
FI19992062A FI19992062A (fi) 1999-09-27
FI116265B true FI116265B (fi) 2005-10-14

Family

ID=12353358

Family Applications (1)

Application Number Title Priority Date Filing Date
FI992062A FI116265B (fi) 1998-01-29 1999-09-27 Painettu piirilevy

Country Status (8)

Country Link
US (1) US6334782B1 (fr)
JP (1) JPH11220234A (fr)
CN (1) CN1224299C (fr)
FI (1) FI116265B (fr)
GB (1) GB2337862B (fr)
MY (1) MY124598A (fr)
TW (1) TW425830B (fr)
WO (1) WO1999039555A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100531514C (zh) * 2004-07-12 2009-08-19 鸿富锦精密工业（深圳）有限公司 防止短路的印刷电路板结构
US7511228B2 (en) * 2005-09-14 2009-03-31 Schmartboard, Inc. Printed circuit board
CN100379321C (zh) * 2005-12-27 2008-04-02 友达光电股份有限公司 阵列基板及其制造方法
CN100377627C (zh) * 2006-02-28 2008-03-26 友达光电股份有限公司 可防止相邻焊垫短路的电路板
US20090260862A1 (en) * 2008-04-16 2009-10-22 Andrew Yaung Circuit modification device for printed circuit boards
JP5361839B2 (ja) * 2010-10-06 2013-12-04 日本発條株式会社 金属ベース回路基板
CN105828521B (zh) * 2015-01-08 2018-10-02 上海和辉光电有限公司 印刷电路板的布局方法及印刷电路板
EP3375264B1 (fr) * 2015-11-11 2020-08-05 Endress+Hauser SE+Co. KG Procédé pour stabiliser la résistance entre pistes conductrices
DE102016216137A1 (de) * 2016-08-29 2018-03-01 Robert Bosch Gmbh Steuermodul für ein Fahrzeug

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54158661A (en) * 1978-06-01 1979-12-14 Tokyo Purinto Kougiyou Kk Printed circuit board
JPS5834770Y2 (ja) * 1978-12-25 1983-08-04 松下電器産業株式会社 プリント基板装置
JPS5596675A (en) 1979-01-19 1980-07-23 Nec Corp Semiconductor device
US4303291A (en) * 1980-11-24 1981-12-01 Western Electric Company, Inc. Method of seating connector terminals on circuit board contact pads
JPS58153650U (ja) * 1982-04-09 1983-10-14 岡部株式会社 セパレ−タコ−ン
JPS6061754A (ja) 1983-09-16 1985-04-09 Toppan Printing Co Ltd レジスタ−マ−ク形成装置
JPS6061754U (ja) * 1983-10-03 1985-04-30 松下電器産業株式会社 プリント基板の表面構造
JPS62184785U (fr) * 1986-05-16 1987-11-24
JPS6450595A (en) * 1987-08-21 1989-02-27 Oki Electric Ind Co Ltd Connection of semiconductor device
JPH0473733U (fr) * 1990-10-16 1992-06-29
US6133534A (en) * 1991-11-29 2000-10-17 Hitachi Chemical Company, Ltd. Wiring board for electrical tests with bumps having polymeric coating
US5315070A (en) * 1991-12-02 1994-05-24 Siemens Aktiengesellschaft Printed wiring board to which solder has been applied
JP2571144Y2 (ja) * 1991-12-19 1998-05-13 タキロン株式会社 天窓開閉装置
JP2554542Y2 (ja) * 1992-02-17 1997-11-17 台灣杜邦股▲ふん▼有限公司 プリント回路基板
JPH0638272A (ja) 1992-07-16 1994-02-10 Nec Corp 通信装置管理方式
JPH0638272U (ja) * 1992-10-22 1994-05-20 エスエムケイ株式会社 表面実装部品の取付構造
DE9300868U1 (de) * 1993-01-22 1994-05-26 Siemens AG, 80333 München Einstückiges Isolierteil, insbesondere Spritzgießteil
JP2782655B2 (ja) 1993-06-30 1998-08-06 三菱自動車工業株式会社 化成処理方法
JP2592363Y2 (ja) * 1993-08-31 1999-03-17 日本精機株式会社 回路基板の短絡防止構造

Also Published As

Publication number Publication date
CN1256067A (zh) 2000-06-07
WO1999039555A9 (fr) 1999-12-02
WO1999039555A1 (fr) 1999-08-05
GB9922116D0 (en) 1999-11-17
US6334782B1 (en) 2002-01-01
MY124598A (en) 2006-06-30
TW425830B (en) 2001-03-11
GB2337862B (en) 2002-07-03
FI19992062A (fi) 1999-09-27
GB2337862A (en) 1999-12-01
CN1224299C (zh) 2005-10-19
JPH11220234A (ja) 1999-08-10

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