ES443389A1 - Unos perfeccionamientos en la fabricacion de semiconducto- res. - Google Patents

Unos perfeccionamientos en la fabricacion de semiconducto- res.

Info

Publication number
ES443389A1
ES443389A1 ES443389A ES443389A ES443389A1 ES 443389 A1 ES443389 A1 ES 443389A1 ES 443389 A ES443389 A ES 443389A ES 443389 A ES443389 A ES 443389A ES 443389 A1 ES443389 A1 ES 443389A1
Authority
ES
Spain
Prior art keywords
gold
production
semiconductor devices
electrodepositing
alkali metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES443389A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Catalysts UK Holdings Ltd
Original Assignee
Engelhard Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Industries Ltd filed Critical Engelhard Industries Ltd
Publication of ES443389A1 publication Critical patent/ES443389A1/es
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27Manufacturing methods
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • H01L2224/83801Soldering or alloying
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01011Sodium [Na]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01032Germanium [Ge]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01057Lanthanum [La]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01084Polonium [Po]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/0132Binary Alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/0132Binary Alloys
    • H01L2924/01322Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/10251Elemental semiconductors, i.e. Group IV
    • H01L2924/10253Silicon [Si]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
ES443389A 1974-12-04 1975-12-03 Unos perfeccionamientos en la fabricacion de semiconducto- res. Expired ES443389A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB52520/74A GB1506380A (en) 1974-12-04 1974-12-04 Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices

Publications (1)

Publication Number Publication Date
ES443389A1 true ES443389A1 (es) 1977-05-01

Family

ID=10464233

Family Applications (1)

Application Number Title Priority Date Filing Date
ES443389A Expired ES443389A1 (es) 1974-12-04 1975-12-03 Unos perfeccionamientos en la fabricacion de semiconducto- res.

Country Status (14)

Country Link
JP (1) JPS5198639A (forum.php)
AT (1) ATA908275A (forum.php)
BE (1) BE836293A (forum.php)
CH (1) CH606505A5 (forum.php)
DE (1) DE2554583A1 (forum.php)
DK (1) DK545375A (forum.php)
ES (1) ES443389A1 (forum.php)
FR (1) FR2293500A1 (forum.php)
GB (1) GB1506380A (forum.php)
HK (1) HK73378A (forum.php)
IT (1) IT1052476B (forum.php)
MY (1) MY7900005A (forum.php)
NL (1) NL7513699A (forum.php)
SE (1) SE7513620L (forum.php)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4465564A (en) * 1983-06-27 1984-08-14 American Chemical & Refining Company, Inc. Gold plating bath containing tartrate and carbonate salts

Also Published As

Publication number Publication date
BE836293A (fr) 1976-06-04
JPS5198639A (en) 1976-08-31
CH606505A5 (forum.php) 1978-10-31
DK545375A (da) 1976-06-05
GB1506380A (en) 1978-04-05
FR2293500A1 (fr) 1976-07-02
FR2293500B1 (forum.php) 1980-08-01
SE7513620L (sv) 1976-06-08
MY7900005A (en) 1979-12-31
DE2554583A1 (de) 1976-06-10
ATA908275A (de) 1978-10-15
HK73378A (en) 1978-12-22
IT1052476B (it) 1981-06-20
AU8674075A (en) 1977-05-26
NL7513699A (nl) 1976-06-09

Similar Documents

Publication Publication Date Title
JPS5113734B1 (forum.php)
ES443389A1 (es) Unos perfeccionamientos en la fabricacion de semiconducto- res.
ES323939A1 (es) Un procedimiento para producir un contacto electrico que tiene un recubrimiento de paladio ductil.
ES375824A1 (es) Mejoras en la deposicion electrolitica del cobre.
GB1304424A (forum.php)
ES315147A1 (es) Metodo de depositar electroliticamente un chapeado de una aleacion de estaño y bismuto.
GB575309A (en) Improvements in or relating to electro-plating
GB1452563A (en) Additive process for the production of printed circuit boards
JPS5322365A (en) Resin mold type semiconductor device and its production
GB1338414A (en) High purity copper wire and the process of making it
ES388292A1 (es) Un procedimiento para la deposicion electrolitica de oro.
GB2016049A (en) A method of producing large area semiconductor components by electrolytic deposition
ES314621A1 (es) Procedimiento para la reduccion de iones cupricos.
JPS54116686A (en) Preparation of waveguide
Egeberg et al. Brighteners in Silver Plating Solutions: A Preliminary Study
GB1156186A (en) Gold Plating
ES377294A1 (es) Un metodo de recubrimiento electrolitico con oro.
GB850468A (en) Improvements in or relating to electro-deposition
ES416493A1 (es) Un procedimiento para preparar un bano acuoso de deposicionelectrolitica.
GB512484A (en) Process for plating nickel on electro-positive metals especially zinc and zinc alloys
GB1199421A (en) Method of Producing Thin Ferromagnetic Layers.
GB902495A (en) Improvements in or relating to processes for the production of solderable coatings on bodies of semi-conducting material
GB661346A (en) Silvering of glass and other electrical non-conductors
GB1253225A (forum.php)
ES290234A1 (es) Procedimiento electrolítico para depositar aleaciones brillantes de plata-oro

Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19971103