ATA908275A - Verfahren zum schnellen galvanischen ablagern von gold aus einem goldelektrolyten auf einer unterlage und waesseriger goldgalvanisieungselektrolyt zur durchfuehrung des verfahrens - Google Patents

Verfahren zum schnellen galvanischen ablagern von gold aus einem goldelektrolyten auf einer unterlage und waesseriger goldgalvanisieungselektrolyt zur durchfuehrung des verfahrens

Info

Publication number
ATA908275A
ATA908275A AT908275A AT908275A ATA908275A AT A908275 A ATA908275 A AT A908275A AT 908275 A AT908275 A AT 908275A AT 908275 A AT908275 A AT 908275A AT A908275 A ATA908275 A AT A908275A
Authority
AT
Austria
Prior art keywords
gold
electrolyte
aquatic
pad
quickly
Prior art date
Application number
AT908275A
Other languages
English (en)
Original Assignee
Engelhard Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Ind Ltd filed Critical Engelhard Ind Ltd
Publication of ATA908275A publication Critical patent/ATA908275A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01011—Sodium [Na]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01084—Polonium [Po]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
AT908275A 1974-12-04 1975-11-28 Verfahren zum schnellen galvanischen ablagern von gold aus einem goldelektrolyten auf einer unterlage und waesseriger goldgalvanisieungselektrolyt zur durchfuehrung des verfahrens ATA908275A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB52520/74A GB1506380A (en) 1974-12-04 1974-12-04 Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices

Publications (1)

Publication Number Publication Date
ATA908275A true ATA908275A (de) 1978-10-15

Family

ID=10464233

Family Applications (1)

Application Number Title Priority Date Filing Date
AT908275A ATA908275A (de) 1974-12-04 1975-11-28 Verfahren zum schnellen galvanischen ablagern von gold aus einem goldelektrolyten auf einer unterlage und waesseriger goldgalvanisieungselektrolyt zur durchfuehrung des verfahrens

Country Status (14)

Country Link
JP (1) JPS5198639A (de)
AT (1) ATA908275A (de)
BE (1) BE836293A (de)
CH (1) CH606505A5 (de)
DE (1) DE2554583A1 (de)
DK (1) DK545375A (de)
ES (1) ES443389A1 (de)
FR (1) FR2293500A1 (de)
GB (1) GB1506380A (de)
HK (1) HK73378A (de)
IT (1) IT1052476B (de)
MY (1) MY7900005A (de)
NL (1) NL7513699A (de)
SE (1) SE7513620L (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4465564A (en) * 1983-06-27 1984-08-14 American Chemical & Refining Company, Inc. Gold plating bath containing tartrate and carbonate salts

Also Published As

Publication number Publication date
DK545375A (da) 1976-06-05
ES443389A1 (es) 1977-05-01
GB1506380A (en) 1978-04-05
BE836293A (fr) 1976-06-04
FR2293500B1 (de) 1980-08-01
FR2293500A1 (fr) 1976-07-02
JPS5198639A (en) 1976-08-31
AU8674075A (en) 1977-05-26
NL7513699A (nl) 1976-06-09
MY7900005A (en) 1979-12-31
DE2554583A1 (de) 1976-06-10
IT1052476B (it) 1981-06-20
SE7513620L (sv) 1976-06-08
CH606505A5 (de) 1978-10-31
HK73378A (en) 1978-12-22

Similar Documents

Publication Publication Date Title
AT378009B (de) Verfahren zum elektroplattieren und vorrichtung zur durchfuehrung des verfahrens
AT347907B (de) Verfahren zum betrieb einer elektrochemischen zelle und elektrochemische zelle zur durchfuehrung des verfahrens
ATA773473A (de) Verfahren zum steuern der kuhlung eines aus einer durchlaufkokille austretenden stranges und vorrichtung zur durchfuhrung dieses verfahrens
AT370662B (de) Verfahren zum plattieren eines metallischen werkstueckes und vorrichtung zur durchfuehrung des verfahrens
DE2401327B2 (de) Verfahren zum verteilen der in einen brunnen eingezogenen wassermenge und vorrichtung zur durchfuehrung des verfahrens
ATA536078A (de) Verfahren zur verhinderung der bildung von ablage-rungen bei zyklischen zellstoffherstellungs- und zellstoffbehandlungsprozessen
CH527632A (de) Verfahren zum Filtrieren einer Flüssigkeit und Vorrichtung zur Durchführung des Verfahrens
AT380759B (de) Verfahren zum positionieren von wiedergabeelementen und vorrichtung zur durchfuehrung dieses verfahrens
AT361868B (de) Verfahren zum auspressen von klaerschlaemmen und vorrichtung zur durchfuehrung des verfahrens
AT364214B (de) Verfahren und vorrichtung zur kontinuierlichen elektroplattierung, insbesondere zum verzinken oder verzinnen
ATA910481A (de) Verfahren zum züchten von pflanzen und zuchtbeutel zur durchführung des verfahrens
AT356485B (de) Verfahren zum herstellen einer statischen mischeinrichtung und schweisselektroden- anordnung zur durchfuehrung des verfahrens
AT384122B (de) Verfahren zum verbinden von akkumulatorplatten mit einer metallpolbruecke und vorrichtung zum durchfuehren des verfahrens
PT71505A (de) Verfahren zum biegen von blechen und vorrichtung zur durchfuhrung des verfahrens
DD130056A1 (de) Seil aus metalldraehten zum verstaerken von plast-und elastartikeln und verfahren und vorrichtung zu seiner herstellung
AT359799B (de) Verfahren und vorrichtung zum verzinken von draht
ATA908275A (de) Verfahren zum schnellen galvanischen ablagern von gold aus einem goldelektrolyten auf einer unterlage und waesseriger goldgalvanisieungselektrolyt zur durchfuehrung des verfahrens
AT344195B (de) Vorrichtung zur durchfuehrung des verfahrens zum herbeifuehren von partikelwachstum in einer stroemenden fluessigkeitssuspension
AT344109B (de) Verfahren zur herstellung einer leiste an einem gewebe und einrichtung zum durchfuhren des verfahrens
AT356726B (de) Verfahren zum abdecken eines grundkoerpers sowie abdeckelement bzw. einlage zur durch- fuehrung dieses verfahrens
ATA410984A (de) Verfahren zum beimengen von beigaben zu einem futtermittel und vorrichtung zur durchfuehrung des verfahrens
CH517502A (de) Verfahren zum Konzentrieren einer Lösung oder Suspension und Vorrichtung zur Durchführung des Verfahrens
AT368918B (de) Verfahren zum herstellen von dosenruempfen aus stahlblech und vorrichtung zur durchfuehrung dieses verfahrens
AT330109B (de) Verfahren zum abscheiden einer flussigkeit aus einer suspension und vorrichtung zur durchfuhrung des verfahrens
AT358350B (de) Verfahren zum elektroplattieren von nicht- leitendem material

Legal Events

Date Code Title Description
A1V Refusal