HK73378A - Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices - Google Patents
Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devicesInfo
- Publication number
- HK73378A HK73378A HK733/78A HK73378A HK73378A HK 73378 A HK73378 A HK 73378A HK 733/78 A HK733/78 A HK 733/78A HK 73378 A HK73378 A HK 73378A HK 73378 A HK73378 A HK 73378A
- Authority
- HK
- Hong Kong
- Prior art keywords
- plating
- gold
- substrates
- alkali metal
- production
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01011—Sodium [Na]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
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- H01L2924/01033—Arsenic [As]
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- H01L2924/01057—Lanthanum [La]
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- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H01L2924/01082—Lead [Pb]
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- H01L2924/01084—Polonium [Po]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
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- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
1506380 Gold electro-plating ENGELHARD INDUSTRIES Ltd 21 Nov 1975 [4 Dec 1974] 52520/74 Heading C7B An aqueous gold plating electrolyte solution, for plating Ni-Fe substrates, e.g. transistor headers or integrated circuit flat pack lead frames employed in producing semi-conductor devices, to permit bonding of Ge or Si chips or slices to the substrates, consists of water, Au e.g. 1 to 100 g/l as an alkali metal (preferably K) Au(CN) 2 , at least one conducting compound e.g. in total 1 to 200 g/l selected from alkali metal (e.g. Na or K) acetate, (tetra or meta) borate, orthophosphate, nitrate sulphamate, sulphate, tartrate, thiocyanate, thiosulphate and boric acid, and if required a buffer salt e.g. 1 to 200 g/l K or ammonium H 2 PO 4 . Preferably the solution has a pH 4 to 8 and density 2 to 12 degrees BÚ. Plating may be effected at a cathode CD of 1 to 2000 ASF and at 20 to 90‹C with vigorous agitation. The electrolyte may be applied only to selected areas of the substrate as a high velocity jet.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB52520/74A GB1506380A (en) | 1974-12-04 | 1974-12-04 | Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
HK73378A true HK73378A (en) | 1978-12-22 |
Family
ID=10464233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK733/78A HK73378A (en) | 1974-12-04 | 1978-12-14 | Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices |
Country Status (14)
Country | Link |
---|---|
JP (1) | JPS5198639A (en) |
AT (1) | ATA908275A (en) |
BE (1) | BE836293A (en) |
CH (1) | CH606505A5 (en) |
DE (1) | DE2554583A1 (en) |
DK (1) | DK545375A (en) |
ES (1) | ES443389A1 (en) |
FR (1) | FR2293500A1 (en) |
GB (1) | GB1506380A (en) |
HK (1) | HK73378A (en) |
IT (1) | IT1052476B (en) |
MY (1) | MY7900005A (en) |
NL (1) | NL7513699A (en) |
SE (1) | SE7513620L (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4465564A (en) * | 1983-06-27 | 1984-08-14 | American Chemical & Refining Company, Inc. | Gold plating bath containing tartrate and carbonate salts |
-
1974
- 1974-12-04 GB GBGB52520/74A patent/GB1506380A/en not_active Expired
-
1975
- 1975-11-24 NL NL7513699A patent/NL7513699A/en not_active Application Discontinuation
- 1975-11-28 AT AT908275A patent/ATA908275A/en not_active Application Discontinuation
- 1975-12-02 FR FR7536819A patent/FR2293500A1/en active Granted
- 1975-12-02 IT IT52492/75A patent/IT1052476B/en active
- 1975-12-02 CH CH1566675A patent/CH606505A5/xx not_active IP Right Cessation
- 1975-12-03 SE SE7513620A patent/SE7513620L/en not_active Application Discontinuation
- 1975-12-03 DK DK545375A patent/DK545375A/en unknown
- 1975-12-03 ES ES443389A patent/ES443389A1/en not_active Expired
- 1975-12-04 BE BE162465A patent/BE836293A/en not_active IP Right Cessation
- 1975-12-04 JP JP50143410A patent/JPS5198639A/en active Pending
- 1975-12-04 DE DE19752554583 patent/DE2554583A1/en not_active Withdrawn
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1978
- 1978-12-14 HK HK733/78A patent/HK73378A/en unknown
-
1979
- 1979-12-31 MY MY19795A patent/MY7900005A/en unknown
Also Published As
Publication number | Publication date |
---|---|
DK545375A (en) | 1976-06-05 |
ES443389A1 (en) | 1977-05-01 |
GB1506380A (en) | 1978-04-05 |
BE836293A (en) | 1976-06-04 |
FR2293500B1 (en) | 1980-08-01 |
FR2293500A1 (en) | 1976-07-02 |
JPS5198639A (en) | 1976-08-31 |
ATA908275A (en) | 1978-10-15 |
AU8674075A (en) | 1977-05-26 |
NL7513699A (en) | 1976-06-09 |
MY7900005A (en) | 1979-12-31 |
DE2554583A1 (en) | 1976-06-10 |
IT1052476B (en) | 1981-06-20 |
SE7513620L (en) | 1976-06-08 |
CH606505A5 (en) | 1978-10-31 |
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