GB1506380A - Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices - Google Patents

Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices

Info

Publication number
GB1506380A
GB1506380A GBGB52520/74A GB5252074A GB1506380A GB 1506380 A GB1506380 A GB 1506380A GB 5252074 A GB5252074 A GB 5252074A GB 1506380 A GB1506380 A GB 1506380A
Authority
GB
United Kingdom
Prior art keywords
plating
gold
substrates
alkali metal
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GBGB52520/74A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Catalysts UK Holdings Ltd
Original Assignee
Engelhard Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Industries Ltd filed Critical Engelhard Industries Ltd
Priority to GBGB52520/74A priority Critical patent/GB1506380A/en
Priority to AU86740/75A priority patent/AU494806B2/en
Priority to NL7513699A priority patent/NL7513699A/en
Priority to AT908275A priority patent/ATA908275A/en
Priority to CH1566675A priority patent/CH606505A5/xx
Priority to IT52492/75A priority patent/IT1052476B/en
Priority to FR7536819A priority patent/FR2293500A1/en
Priority to DK545375A priority patent/DK545375A/en
Priority to ES443389A priority patent/ES443389A1/en
Priority to SE7513620A priority patent/SE7513620L/en
Priority to DE19752554583 priority patent/DE2554583A1/en
Priority to JP50143410A priority patent/JPS5198639A/en
Priority to BE162465A priority patent/BE836293A/en
Publication of GB1506380A publication Critical patent/GB1506380A/en
Priority to US05/931,643 priority patent/US4207149A/en
Priority to HK733/78A priority patent/HK73378A/en
Priority to MY19795A priority patent/MY7900005A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01011—Sodium [Na]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01084—Polonium [Po]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

1506380 Gold electro-plating ENGELHARD INDUSTRIES Ltd 21 Nov 1975 [4 Dec 1974] 52520/74 Heading C7B An aqueous gold plating electrolyte solution, for plating Ni-Fe substrates, e.g. transistor headers or integrated circuit flat pack lead frames employed in producing semi-conductor devices, to permit bonding of Ge or Si chips or slices to the substrates, consists of water, Au e.g. 1 to 100 g/l as an alkali metal (preferably K) Au(CN) 2 , at least one conducting compound e.g. in total 1 to 200 g/l selected from alkali metal (e.g. Na or K) acetate, (tetra or meta) borate, orthophosphate, nitrate sulphamate, sulphate, tartrate, thiocyanate, thiosulphate and boric acid, and if required a buffer salt e.g. 1 to 200 g/l K or ammonium H 2 PO 4 . Preferably the solution has a pH 4 to 8 and density 2 to 12 degrees BÚ. Plating may be effected at a cathode CD of 1 to 2000 ASF and at 20 to 90‹C with vigorous agitation. The electrolyte may be applied only to selected areas of the substrate as a high velocity jet.
GBGB52520/74A 1974-12-04 1974-12-04 Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices Expired GB1506380A (en)

Priority Applications (16)

Application Number Priority Date Filing Date Title
GBGB52520/74A GB1506380A (en) 1974-12-04 1974-12-04 Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices
AU86740/75A AU494806B2 (en) 1974-12-04 1975-11-19 Gold plating electrolyte and method of electrodepositing goldin the production of semiconductor devices
NL7513699A NL7513699A (en) 1974-12-04 1975-11-24 IMPROVEMENTS IN AND WITH REGARD TO THE MANUFACTURE OF SEMICONDUCTOR DEVICES.
AT908275A ATA908275A (en) 1974-12-04 1975-11-28 METHOD FOR QUICKLY GALVANIC DEPOSITING GOLD FROM A GOLD ELECTROLYTE ON A PAD AND AQUATIC GOLD GALVANIZING ELECTROLYTE FOR CARRYING OUT THE PROCEDURE
CH1566675A CH606505A5 (en) 1974-12-04 1975-12-02
IT52492/75A IT1052476B (en) 1974-12-04 1975-12-02 ELECTROLYTE AND METHOD TO PRODUCE SEMICONDUCTIVE DEVICES AS WELL AS OBTAINED PRODUCTS
FR7536819A FR2293500A1 (en) 1974-12-04 1975-12-02 IMPROVEMENTS IN THE MANUFACTURING OF SEMICONDUCTOR DEVICES
DK545375A DK545375A (en) 1974-12-04 1975-12-03 METHODS OF MANUFACTURING SEMICONDUCTORS
ES443389A ES443389A1 (en) 1974-12-04 1975-12-03 Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices
SE7513620A SE7513620L (en) 1974-12-04 1975-12-03 GOLD ELECTROLYTE
DE19752554583 DE2554583A1 (en) 1974-12-04 1975-12-04 GOLD ELECTROLYTE AND ITS USES
JP50143410A JPS5198639A (en) 1974-12-04 1975-12-04 Kindenkimetsukiho narabini sonodenkaieki
BE162465A BE836293A (en) 1974-12-04 1975-12-04 GOLD ELECTROLYTE
US05/931,643 US4207149A (en) 1974-12-04 1978-08-07 Gold electroplating solutions and processes
HK733/78A HK73378A (en) 1974-12-04 1978-12-14 Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices
MY19795A MY7900005A (en) 1974-12-04 1979-12-31 Gold plating electrolyte and method of electrodepositing gold in the production of semi conductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB52520/74A GB1506380A (en) 1974-12-04 1974-12-04 Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices

Publications (1)

Publication Number Publication Date
GB1506380A true GB1506380A (en) 1978-04-05

Family

ID=10464233

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB52520/74A Expired GB1506380A (en) 1974-12-04 1974-12-04 Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices

Country Status (14)

Country Link
JP (1) JPS5198639A (en)
AT (1) ATA908275A (en)
BE (1) BE836293A (en)
CH (1) CH606505A5 (en)
DE (1) DE2554583A1 (en)
DK (1) DK545375A (en)
ES (1) ES443389A1 (en)
FR (1) FR2293500A1 (en)
GB (1) GB1506380A (en)
HK (1) HK73378A (en)
IT (1) IT1052476B (en)
MY (1) MY7900005A (en)
NL (1) NL7513699A (en)
SE (1) SE7513620L (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4465564A (en) * 1983-06-27 1984-08-14 American Chemical & Refining Company, Inc. Gold plating bath containing tartrate and carbonate salts

Also Published As

Publication number Publication date
DK545375A (en) 1976-06-05
ES443389A1 (en) 1977-05-01
BE836293A (en) 1976-06-04
FR2293500B1 (en) 1980-08-01
FR2293500A1 (en) 1976-07-02
JPS5198639A (en) 1976-08-31
ATA908275A (en) 1978-10-15
AU8674075A (en) 1977-05-26
NL7513699A (en) 1976-06-09
MY7900005A (en) 1979-12-31
DE2554583A1 (en) 1976-06-10
IT1052476B (en) 1981-06-20
SE7513620L (en) 1976-06-08
CH606505A5 (en) 1978-10-31
HK73378A (en) 1978-12-22

Similar Documents

Publication Publication Date Title
Green Gold electrodeposition for microelectronic, optoelectronic and microsystem applications
GB1370387A (en) Electrochemical solutions and process
US5635253A (en) Method of replenishing electroless gold plating baths
US4681670A (en) Bath and process for plating tin-lead alloys
EP0198038B1 (en) Bath and process for plating tin/lead alloys on composite substrates
GB1453386A (en) Gold plating solutions and method
US4435253A (en) Gold sulphite electroplating solutions and methods
HK73378A (en) Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices
SE8002598L (en) SILVER AND SILVER / GOLD PLATING BATH
US5320667A (en) Combination of aqueous baths for electroless gold deposition
US3506462A (en) Electroless gold plating solutions
GB1304424A (en)
GB1051383A (en)
US4207149A (en) Gold electroplating solutions and processes
US4309256A (en) Process for the galvanoplastic deposition of a gold alloy
US2783194A (en) Iodate-containing plating baths
JP2539394B2 (en) Palladium electroplating solution
US4717459A (en) Electrolytic gold plating solution
JPH01239856A (en) Gold plating of electronic component of semiconductor integrated circuit
US3879269A (en) Methods for high current density gold electroplating
GB1506496A (en) Gold plating baths
JPS62174384A (en) Electroless gold plating solution
JPH024978A (en) Electroless indium plating bath
GB1375611A (en)
JP2954214B2 (en) Manufacturing method of gold plated conductor

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee