GB1375611A - - Google Patents
Info
- Publication number
- GB1375611A GB1375611A GB1457972A GB1457972A GB1375611A GB 1375611 A GB1375611 A GB 1375611A GB 1457972 A GB1457972 A GB 1457972A GB 1457972 A GB1457972 A GB 1457972A GB 1375611 A GB1375611 A GB 1375611A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electro
- salts
- added
- many examples
- chelating agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
Abstract
1375611 Electro-depositing gold-coppercadmium alloys LEA-RONAL Inc 28 March 1972 14579/72 Heading C7B Au-Cu-Cd alloy is electro-deposited from an aqueous alkaline bath containing a gold cyanide complex e.g. K Au (CN) 2 , a copper cyanide complex e.g. K Cu (CN) 2 , free cyanide e.g. KCN, a cadmium compound e.g. K Cd (CN) 2 or added as sulphate or nitrate, and a chelating agent for Cd. Many examples of chelating agent are specified including organo (e.g. amine) phosphonic acids and their salts, and amino (poly) carboxylic acids, e.g. nitrilo triacetic acid, EDTA and diethylenetriaminepentaacetic acid, and their salts. The bath may also include a polyoxyalkylene brightening agent, with or without a soluble Se (e.g. sodium selinite) or Te (e.g. oxide) compound. Many examples of brightening agents are specified. Potassium carbonate or phosphate buffer may be added. Specification 1375612 is referred to.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1457972A GB1375611A (en) | 1972-03-28 | 1972-03-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1457972A GB1375611A (en) | 1972-03-28 | 1972-03-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1375611A true GB1375611A (en) | 1974-11-27 |
Family
ID=10043770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1457972A Expired GB1375611A (en) | 1972-03-28 | 1972-03-28 |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1375611A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6576114B1 (en) | 1995-11-03 | 2003-06-10 | Enthone Inc. | Electroplating composition bath |
EP1983077A1 (en) * | 2007-04-19 | 2008-10-22 | Enthone, Inc. | Electrolyte and method for electrolytic deposition of gold-copper alloys |
-
1972
- 1972-03-28 GB GB1457972A patent/GB1375611A/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6576114B1 (en) | 1995-11-03 | 2003-06-10 | Enthone Inc. | Electroplating composition bath |
EP1983077A1 (en) * | 2007-04-19 | 2008-10-22 | Enthone, Inc. | Electrolyte and method for electrolytic deposition of gold-copper alloys |
CN101289756B (en) * | 2007-04-19 | 2012-06-20 | 恩索恩公司 | Electrolyte composition and method for electrolytic deposition of gold-copper alloys |
EP1983077B1 (en) | 2007-04-19 | 2016-12-28 | Enthone, Inc. | Electrolyte and method for electrolytic deposition of gold-copper alloys |
EP3170924A1 (en) * | 2007-04-19 | 2017-05-24 | Enthone, Inc. | Electrolyte and method for electrolytic deposition of gold-copper alloys |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |