ES401687A1 - Semiconductor device manufacture - Google Patents

Semiconductor device manufacture

Info

Publication number
ES401687A1
ES401687A1 ES401687A ES401687A ES401687A1 ES 401687 A1 ES401687 A1 ES 401687A1 ES 401687 A ES401687 A ES 401687A ES 401687 A ES401687 A ES 401687A ES 401687 A1 ES401687 A1 ES 401687A1
Authority
ES
Spain
Prior art keywords
region
layer
semiconductor
conductivity
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES401687A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES401687A1 publication Critical patent/ES401687A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76205—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76213—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose
    • H01L21/76216—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose introducing electrical active impurities in the local oxidation region for the sole purpose of creating channel stoppers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/082—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only
    • H01L27/0823—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only including vertical bipolar transistors only
    • H01L27/0826—Combination of vertical complementary transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/098—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being PN junction gate field-effect transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Element Separation (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)

Abstract

A semiconductor device comprising a semiconductor body having a region of a first type of conductivity, a semiconductor layer present on said region and contiguous to the body surface, at least a first buried layer of the second type of conductivity present locally between said layer semiconductor and the region of the first type of conductivity, and a path of an insulating material embedded at least partially in the semiconductor layer, a region of the semiconductor layer being separated from the region of the first type of conductivity and the remaining part of the layer by the first buried layer and by a part of the layout contiguous to the first buried layer and which substantially surrounds said region, a semiconductor circuit element being arranged at least partially in said region of the semiconductor layer, characterized in that between the first buried layer and the semiconductor layer is a second a buried layer of the first type of conductivity and because the mentioned semiconductor layer region is divided, by a part of the embedded path of insulating material that is separated from the first buried layer by at least a part of the thickness of the second buried layer, at least in a first island-shaped region in which the semiconductor circuit element is arranged at least partially, and in a second island-shaped region of the first type of conductivity, the regions of which are both contiguous to the second buried layer . (Machine-translation by Google Translate, not legally binding)
ES401687A 1971-04-14 1972-04-12 Semiconductor device manufacture Expired ES401687A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7105000A NL7105000A (en) 1971-04-14 1971-04-14

Publications (1)

Publication Number Publication Date
ES401687A1 true ES401687A1 (en) 1975-03-16

Family

ID=19812915

Family Applications (1)

Application Number Title Priority Date Filing Date
ES401687A Expired ES401687A1 (en) 1971-04-14 1972-04-12 Semiconductor device manufacture

Country Status (11)

Country Link
AU (1) AU470407B2 (en)
BE (1) BE782012A (en)
BR (1) BR7202251D0 (en)
CH (1) CH539952A (en)
DE (1) DE2216642C3 (en)
ES (1) ES401687A1 (en)
FR (1) FR2133692B1 (en)
GB (1) GB1387021A (en)
IT (1) IT951314B (en)
NL (1) NL7105000A (en)
SE (1) SE383582B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL161301C (en) * 1972-12-29 1980-01-15 Philips Nv SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURE THEREOF.
JPS5534619U (en) * 1978-08-25 1980-03-06

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE740938A (en) * 1967-12-05 1970-04-01

Also Published As

Publication number Publication date
FR2133692A1 (en) 1972-12-01
FR2133692B1 (en) 1977-08-19
DE2216642A1 (en) 1972-10-19
AU470407B2 (en) 1973-10-18
DE2216642B2 (en) 1979-04-12
AU4093672A (en) 1973-10-18
IT951314B (en) 1973-06-30
BR7202251D0 (en) 1973-06-07
BE782012A (en) 1972-10-13
GB1387021A (en) 1975-03-12
CH539952A (en) 1973-07-31
SE383582B (en) 1976-03-15
NL7105000A (en) 1972-10-17
DE2216642C3 (en) 1979-12-13

Similar Documents

Publication Publication Date Title
ES321208A1 (en) A method of producing a semiconductor device. (Machine-translation by Google Translate, not legally binding)
ES333917A1 (en) A semiconductor microcircuit device. (Machine-translation by Google Translate, not legally binding)
ES328172A1 (en) A composite semiconductor device. (Machine-translation by Google Translate, not legally binding)
ES401854A1 (en) Semiconductor device manufacture
ES404386A1 (en) Semiconductor devices
ES401687A1 (en) Semiconductor device manufacture
ES402165A1 (en) Monolithic semiconductor device
ES374056A1 (en) Barrier layer devices and methods for their manufacture
ES460687A1 (en) Planar semiconductor device
ES401405A1 (en) A semiconductor device. (Machine-translation by Google Translate, not legally binding)
ES294824A1 (en) Circuit for indicating readable, unreadable or missing characters
ES304286A1 (en) Method for providing at least two superficial layers one next to another on a support. (Machine-translation by Google Translate, not legally binding)
ES374491A1 (en) A flexible insulating lámina device on which a conductive track design is placed. (Machine-translation by Google Translate, not legally binding)
ES326615A1 (en) A semiconductor device. (Machine-translation by Google Translate, not legally binding)
ES393036A1 (en) Compact semiconductor device for monolithic integrated circuits
ES393039A2 (en) Manufacture of semiconductor devices
ES322410A1 (en) A semiconductor electrical device. (Machine-translation by Google Translate, not legally binding)
FR2172200B1 (en)
ES435585A1 (en) A method of manufacturing a semiconductor device. (Machine-translation by Google Translate, not legally binding)
ES392402A1 (en) Semiconductor device with isolated circuit elements
ES388379A2 (en) Integrated semiconductor device
ES393041A1 (en) Semiconductor integrated devices
ES372372A1 (en) Semiconductor devices
ES408908A1 (en) Methods of manufacturing semiconductor devices
ES377824A1 (en) A semiconductor device. (Machine-translation by Google Translate, not legally binding)