ES374491A1 - A flexible insulating lámina device on which a conductive track design is placed. (Machine-translation by Google Translate, not legally binding) - Google Patents
A flexible insulating lámina device on which a conductive track design is placed. (Machine-translation by Google Translate, not legally binding)Info
- Publication number
- ES374491A1 ES374491A1 ES374491A ES374491A ES374491A1 ES 374491 A1 ES374491 A1 ES 374491A1 ES 374491 A ES374491 A ES 374491A ES 374491 A ES374491 A ES 374491A ES 374491 A1 ES374491 A1 ES 374491A1
- Authority
- ES
- Spain
- Prior art keywords
- translation
- flexible insulating
- machine
- legally binding
- google translate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01061—Promethium [Pm]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
A flexible insulating sheet device on which is placed a pattern of conductive tracks to which at least one electrical component can be connected, for example a semiconductor circuit element, characterized in that the sheet and the layout of conductive tracks are covered with an insulating layer, the side of which opposite to the side adjacent to the path and to the flexible insulating sheet, is free of conductive tracks, the insulating layer not covering a plurality of parts, called contact places, of the path located on the sheet. (Machine-translation by Google Translate, not legally binding)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6818017A NL6818017A (en) | 1968-12-14 | 1968-12-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES374491A1 true ES374491A1 (en) | 1972-01-01 |
Family
ID=19805406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES374491A Expired ES374491A1 (en) | 1968-12-14 | 1969-12-12 | A flexible insulating lámina device on which a conductive track design is placed. (Machine-translation by Google Translate, not legally binding) |
Country Status (10)
Country | Link |
---|---|
AT (1) | AT301666B (en) |
BE (1) | BE743089A (en) |
BR (1) | BR6915013D0 (en) |
CH (1) | CH506230A (en) |
DE (1) | DE1958811A1 (en) |
DK (1) | DK121806B (en) |
ES (1) | ES374491A1 (en) |
FR (1) | FR2026186A1 (en) |
GB (1) | GB1303650A (en) |
NL (1) | NL6818017A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2633434C2 (en) * | 1976-07-24 | 1981-04-30 | Diehl GmbH & Co, 8500 Nürnberg | Lost stopper |
JPS566498A (en) * | 1979-06-26 | 1981-01-23 | Hitachi Chemical Co Ltd | Method of manufacturing flexible printed circuit board |
JPS60206639A (en) * | 1984-03-31 | 1985-10-18 | 日東電工株式会社 | Manufacture of polyimide-metallic foil composite film |
-
1968
- 1968-12-14 NL NL6818017A patent/NL6818017A/xx unknown
-
1969
- 1969-11-22 DE DE19691958811 patent/DE1958811A1/en active Pending
- 1969-12-11 AT AT1153769A patent/AT301666B/en not_active IP Right Cessation
- 1969-12-11 GB GB6055569A patent/GB1303650A/en not_active Expired
- 1969-12-11 BR BR215013/69A patent/BR6915013D0/en unknown
- 1969-12-11 DK DK656869AA patent/DK121806B/en unknown
- 1969-12-11 CH CH1844369A patent/CH506230A/en not_active IP Right Cessation
- 1969-12-12 ES ES374491A patent/ES374491A1/en not_active Expired
- 1969-12-12 BE BE743089D patent/BE743089A/xx unknown
- 1969-12-15 FR FR6943359A patent/FR2026186A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2026186A1 (en) | 1970-09-11 |
BE743089A (en) | 1970-06-12 |
CH506230A (en) | 1971-04-15 |
AT301666B (en) | 1972-09-11 |
NL6818017A (en) | 1970-06-16 |
BR6915013D0 (en) | 1973-01-02 |
GB1303650A (en) | 1973-01-17 |
DK121806B (en) | 1971-12-06 |
DE1958811A1 (en) | 1970-07-02 |
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