ES2168009T3 - Recintos de proteccion contra interferencias electromagneticas (emi). - Google Patents

Recintos de proteccion contra interferencias electromagneticas (emi).

Info

Publication number
ES2168009T3
ES2168009T3 ES99914309T ES99914309T ES2168009T3 ES 2168009 T3 ES2168009 T3 ES 2168009T3 ES 99914309 T ES99914309 T ES 99914309T ES 99914309 T ES99914309 T ES 99914309T ES 2168009 T3 ES2168009 T3 ES 2168009T3
Authority
ES
Spain
Prior art keywords
fibers
cover
mesh
carrier sheet
grounding plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES99914309T
Other languages
English (en)
Inventor
Donald M Yenni Jr
Souza Jose P De
Mark G Baker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Application granted granted Critical
Publication of ES2168009T3 publication Critical patent/ES2168009T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1043—Subsequent to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/10—Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]
    • Y10T442/102—Woven scrim
    • Y10T442/109—Metal or metal-coated fiber-containing scrim
    • Y10T442/126—Including a preformed film, foil, or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/10—Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]
    • Y10T442/102—Woven scrim
    • Y10T442/109—Metal or metal-coated fiber-containing scrim
    • Y10T442/131—Including a coating or impregnation of synthetic polymeric material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2475—Coating or impregnation is electrical insulation-providing, -improving, or -increasing, or conductivity-reducing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)

Abstract

Un recinto de blindaje contra EMI para una instalación electrónica, que comprende: un plano de conexión a tierra; y una cubierta de blindaje, realizada termoformando una lámina compuesta, comprendiendo dicha cubierta: una lámina portadora no porosa; una malla metálica fibrosa que tiene una superficie exterior y una superficie de contacto, estando dicha superficie de contacto adyacente a dicha lámina portadora, comprendiendo dicha malla metálica fibras metálicas de bajo punto de fusión, que se funden durante el termoformado de dicha cubierta de blindaje; un recubrimiento para fibras, con el fn de aislar dichas fibras metálicas, rodeando sustancialmente a dichas fibras, superponiéndose dicho recubrimiento para fibras sobre dichas fibras metálicas, en dicha superficie exterior de dicha malla, en menos de 0,15 mm, extendiéndose dicho recubrimiento para fibras sustancialmente a través de dicha malla hacia dicha lámina portadora no porosa; y un borde de contacto para formar una conexión eléctricacon dicho plano de conexión a tierra, efectuándose dicha conexión eléctrica por adherencia de dicho borde de contacto contra dicho plano de conexión a tierra, a temperaturas de hasta 200 C, careciendo esencialmente dicha cubierta de protuberancias esferoidales.
ES99914309T 1998-05-01 1999-03-31 Recintos de proteccion contra interferencias electromagneticas (emi). Expired - Lifetime ES2168009T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/070,994 US6090728A (en) 1998-05-01 1998-05-01 EMI shielding enclosures

Publications (1)

Publication Number Publication Date
ES2168009T3 true ES2168009T3 (es) 2002-05-16

Family

ID=22098624

Family Applications (1)

Application Number Title Priority Date Filing Date
ES99914309T Expired - Lifetime ES2168009T3 (es) 1998-05-01 1999-03-31 Recintos de proteccion contra interferencias electromagneticas (emi).

Country Status (8)

Country Link
US (2) US6090728A (es)
EP (1) EP1075781B1 (es)
JP (1) JP2002514830A (es)
KR (1) KR20010043185A (es)
CA (1) CA2328935A1 (es)
DE (1) DE69900848T2 (es)
ES (1) ES2168009T3 (es)
WO (1) WO1999057952A1 (es)

Families Citing this family (136)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811050A (en) * 1994-06-06 1998-09-22 Gabower; John F. Electromagnetic interference shield for electronic devices
SE511330C2 (sv) * 1997-12-29 1999-09-13 Ericsson Telefon Ab L M Förfarande för framställning av ett kretskort jämte skärmningselement för skärmning av komponenter på ett dylikt kretskort
US7066628B2 (en) 2001-03-29 2006-06-27 Fiber Optic Designs, Inc. Jacketed LED assemblies and light strings containing same
US7931390B2 (en) * 1999-02-12 2011-04-26 Fiber Optic Designs, Inc. Jacketed LED assemblies and light strings containing same
US6195267B1 (en) * 1999-06-23 2001-02-27 Ericsson Inc. Gel structure for combined EMI shielding and thermal control of microelectronic assemblies
JP4433519B2 (ja) * 1999-08-16 2010-03-17 株式会社ニコン 電子カメラ
CN1409942A (zh) * 1999-10-12 2003-04-09 电子设备屏蔽公司 Emi屏蔽设备
US6738265B1 (en) * 2000-04-19 2004-05-18 Nokia Mobile Phones Ltd. EMI shielding for portable electronic devices
US8527046B2 (en) 2000-04-20 2013-09-03 Medtronic, Inc. MRI-compatible implantable device
AU2001255522A1 (en) 2000-04-20 2001-11-07 Greatbio Technologies, Inc. Mri-resistant implantable device
US20010033478A1 (en) * 2000-04-21 2001-10-25 Shielding For Electronics, Inc. EMI and RFI shielding for printed circuit boards
JP2002094689A (ja) * 2000-06-07 2002-03-29 Sony Computer Entertainment Inc プログラム実行システム、プログラム実行装置、中継装置、および記録媒体
US6410847B1 (en) * 2000-07-25 2002-06-25 Trw Inc. Packaged electronic system having selectively plated microwave absorbing cover
US6768654B2 (en) * 2000-09-18 2004-07-27 Wavezero, Inc. Multi-layered structures and methods for manufacturing the multi-layered structures
DE10100421A1 (de) * 2001-01-08 2002-07-11 Bosch Gmbh Robert Abgedichtetes Gehäuse für eine elektronische Vorrichtung und zugehörige Dichtung
US6515222B2 (en) * 2001-02-05 2003-02-04 Motorola, Inc. Printed circuit board arrangement
US6697248B1 (en) 2001-02-06 2004-02-24 Daniel Luch Electromagnetic interference shields and methods of manufacture
US6829509B1 (en) 2001-02-20 2004-12-07 Biophan Technologies, Inc. Electromagnetic interference immune tissue invasive system
US20020116028A1 (en) 2001-02-20 2002-08-22 Wilson Greatbatch MRI-compatible pacemaker with pulse carrying photonic catheter providing VOO functionality
US6731979B2 (en) 2001-08-30 2004-05-04 Biophan Technologies Inc. Pulse width cardiac pacing apparatus
US6639144B1 (en) 2001-08-31 2003-10-28 Gateway, Inc. Electromagnetic interference reduction system
DE10147751C1 (de) 2001-09-27 2002-09-26 Siemens Ag Verfahren zur Herstellung einer Schirmung
US20030112710A1 (en) * 2001-12-18 2003-06-19 Eidson John C. Reducing thermal drift in electronic components
US6703128B2 (en) * 2002-02-15 2004-03-09 Delphi Technologies, Inc. Thermally-capacitive phase change encapsulant for electronic devices
US6711440B2 (en) 2002-04-11 2004-03-23 Biophan Technologies, Inc. MRI-compatible medical device with passive generation of optical sensing signals
US6725092B2 (en) 2002-04-25 2004-04-20 Biophan Technologies, Inc. Electromagnetic radiation immune medical assist device adapter
JP4024103B2 (ja) * 2002-05-29 2007-12-19 アルプス電気株式会社 高周波回路の接続構造
US20040119201A1 (en) * 2002-07-12 2004-06-24 Siegel-Robert, Inc. Apparatus and method for manufacturing plastic products with EMI/RFI/ESD shield
WO2004037447A1 (en) * 2002-10-21 2004-05-06 Laird Technologies, Inc. Thermally conductive emi shield
US6816372B2 (en) * 2003-01-08 2004-11-09 International Business Machines Corporation System, method and apparatus for noise and heat suppression, and for managing cables in a computer system
US6646892B1 (en) * 2003-02-05 2003-11-11 First International Computer, Inc. Fastening mechanism for cover
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7326862B2 (en) * 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
US7259969B2 (en) * 2003-02-26 2007-08-21 Wavezero, Inc. Methods and devices for connecting and grounding an EMI shield to a printed circuit board
US20050011610A1 (en) * 2003-07-18 2005-01-20 Cobene Robert Louis Bookbinding adhesive forming device and method
JP2005051129A (ja) * 2003-07-30 2005-02-24 Sony Corp 電子機器
TWI333805B (en) * 2003-10-03 2010-11-21 Osram Sylvania Inc Housing for electronic ballast
CN1918330B (zh) 2004-02-13 2010-11-10 三菱丽阳株式会社 碳纤维前驱体纤维束、其制造方法及制造装置以及碳纤维及其制造方法
US8116076B2 (en) * 2004-03-19 2012-02-14 Stealthdrive, Inc. Vibration and shock control protective enclosures for hard disk drives and arrays thereof
US20050236171A1 (en) * 2004-04-23 2005-10-27 Garcia Jorge L Shield frame for a radio frequency shielding assembly
US7310242B2 (en) * 2004-05-21 2007-12-18 General Motors Corporation Self-shielding high voltage distribution box
US7498376B2 (en) * 2004-06-23 2009-03-03 Delphi Technologies, Inc. Thermal transient suppression material and method of production
KR100652389B1 (ko) * 2004-12-09 2006-12-01 삼성전자주식회사 하드 디스크 드라이브의 브래킷 구조
KR100673531B1 (ko) * 2005-01-31 2007-01-24 주식회사 에이엠아이 씨 박형 전자파 쉴드 테이프, 이를 이용한 전자파 차폐 구조 및 그 제조방법
US11295095B2 (en) 2005-02-07 2022-04-05 Mynette Technologies, Inc. Secure reading of passport RFID tags
US11170185B2 (en) 2005-02-07 2021-11-09 Steven Michael Colby State dependent passport reading
US11270182B2 (en) 2005-02-07 2022-03-08 Mynette Technologies, Inc. RFID financial device including mechanical switch
US11347949B2 (en) 2005-05-06 2022-05-31 Mynette Technologies, Inc. Cellular device including inductive antenna
WO2006128741A1 (en) * 2005-06-02 2006-12-07 Nv Bekaert Sa Polymer emi housing comprising conductive fibre
US20070167705A1 (en) * 2005-08-04 2007-07-19 Chiang Alice M Integrated ultrasound imaging system
US7968012B2 (en) * 2005-11-23 2011-06-28 Laird Technologies, Inc. Method and apparatus for EMI shielding
CN1972587B (zh) * 2005-11-25 2011-11-16 深圳富泰宏精密工业有限公司 电子装置的屏蔽构件及壳体组件
US20100203789A1 (en) * 2006-01-17 2010-08-12 Seiren Co., Ltd. Electrically conductive gasket material
US20090176074A1 (en) * 2006-05-05 2009-07-09 Meadwestvaco Corporation Conductive/absorbtive sheet materials with enhanced properties
US8305773B2 (en) * 2006-08-18 2012-11-06 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
EP2136613B1 (en) * 2007-04-11 2016-02-17 Toda Kogyo Corporation Sheet for prevention of electromagnetic wave interference, flat cable for high-frequency signal, flexible print substrate, and method for production of sheet for prevention of electromagnetic wave interference
US8198979B2 (en) * 2007-04-20 2012-06-12 Ink-Logix, Llc In-molded resistive and shielding elements
WO2008131305A1 (en) * 2007-04-20 2008-10-30 Ink-Logix, Llc In-molded capacitive switch
US7687790B2 (en) * 2007-06-07 2010-03-30 General Electric Company EMI shielding of digital x-ray detectors with non-metallic enclosures
US20090078590A1 (en) 2008-01-21 2009-03-26 Smith Dennis R Ultrasecure card package
US8263872B2 (en) * 2008-02-21 2012-09-11 Apple Inc. Method and apparatus for attaching a flex circuit to a printed circuit board
US7633015B2 (en) * 2008-03-31 2009-12-15 Apple Inc. Conforming, electro-magnetic interference reducing cover for circuit components
US7928326B2 (en) * 2009-02-27 2011-04-19 Hewlett-Packard Development Company, L.P. Thermoformed EMI shield
WO2010102280A2 (en) * 2009-03-06 2010-09-10 Saint-Gobain Performance Plastics Corporation Overlap helical conductive spring
JP2011018873A (ja) 2009-05-22 2011-01-27 Sony Ericsson Mobilecommunications Japan Inc 電磁シールド方法および電磁シールド用フィルム
WO2011047376A2 (en) * 2009-10-16 2011-04-21 Emprimus, Inc. Modular electromagnetically shielded enclosure
US8547710B2 (en) 2009-10-16 2013-10-01 Emprimus, Llc Electromagnetically shielded power module
TWI497679B (zh) * 2009-11-27 2015-08-21 Advanced Semiconductor Eng 半導體封裝件及其製造方法
CN102118925A (zh) * 2009-12-30 2011-07-06 深圳富泰宏精密工业有限公司 电子装置外壳及其制作方法
US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
JP2011154642A (ja) * 2010-01-28 2011-08-11 Sony Corp カード型装置
TWI411075B (zh) 2010-03-22 2013-10-01 Advanced Semiconductor Eng 半導體封裝件及其製造方法
US8760859B2 (en) 2010-05-03 2014-06-24 Emprimus, Llc Electromagnetically-shielded portable storage device
US8283800B2 (en) 2010-05-27 2012-10-09 Ford Global Technologies, Llc Vehicle control system with proximity switch and method thereof
EP2427038A1 (de) * 2010-09-01 2012-03-07 LANXESS Deutschland GmbH EMF-abgeschirmtes Kunststoff-Organoblech-Hybrid-Strukturbauteil
US8599576B2 (en) 2010-10-29 2013-12-03 Emprimus, Llc Electromagnetically-protected electronic equipment
US8643772B2 (en) 2010-11-05 2014-02-04 Emprimus, Llc Electromagnetically shielded video camera and shielded enclosure for image capture devices
US8754980B2 (en) 2010-11-05 2014-06-17 Emprimus, Llc Electromagnetically shielded camera and shielded enclosure for image capture devices
US8941222B2 (en) 2010-11-11 2015-01-27 Advanced Semiconductor Engineering Inc. Wafer level semiconductor package and manufacturing methods thereof
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
WO2012088134A2 (en) 2010-12-20 2012-06-28 Emprimus, Inc. Low power localized distributed radio frequency transmitter
US9420219B2 (en) 2010-12-20 2016-08-16 Emprimus, Llc Integrated security video and electromagnetic pulse detector
US8513541B2 (en) 2011-01-21 2013-08-20 Remy Technologies, L.L.C. Method of blocking electro-magnetic interference (EMI) in an electric machine and apparatus
US8933393B2 (en) 2011-04-06 2015-01-13 Emprimus, Llc Electromagnetically-shielded optical system having a waveguide beyond cutoff extending through a shielding surface of an electromagnetically shielding enclosure
US8928336B2 (en) 2011-06-09 2015-01-06 Ford Global Technologies, Llc Proximity switch having sensitivity control and method therefor
US8975903B2 (en) 2011-06-09 2015-03-10 Ford Global Technologies, Llc Proximity switch having learned sensitivity and method therefor
US10004286B2 (en) 2011-08-08 2018-06-26 Ford Global Technologies, Llc Glove having conductive ink and method of interacting with proximity sensor
US9143126B2 (en) 2011-09-22 2015-09-22 Ford Global Technologies, Llc Proximity switch having lockout control for controlling movable panel
US10112556B2 (en) 2011-11-03 2018-10-30 Ford Global Technologies, Llc Proximity switch having wrong touch adaptive learning and method
US8994228B2 (en) 2011-11-03 2015-03-31 Ford Global Technologies, Llc Proximity switch having wrong touch feedback
US8878438B2 (en) 2011-11-04 2014-11-04 Ford Global Technologies, Llc Lamp and proximity switch assembly and method
US20130264735A1 (en) * 2012-04-05 2013-10-10 Liang Meng Plastic Share Co., Ltd. Mold-making method capable of shortening a procedure of manufacturing a product mold
US9531379B2 (en) 2012-04-11 2016-12-27 Ford Global Technologies, Llc Proximity switch assembly having groove between adjacent proximity sensors
US9944237B2 (en) 2012-04-11 2018-04-17 Ford Global Technologies, Llc Proximity switch assembly with signal drift rejection and method
US9197206B2 (en) 2012-04-11 2015-11-24 Ford Global Technologies, Llc Proximity switch having differential contact surface
US9568527B2 (en) 2012-04-11 2017-02-14 Ford Global Technologies, Llc Proximity switch assembly and activation method having virtual button mode
US9520875B2 (en) 2012-04-11 2016-12-13 Ford Global Technologies, Llc Pliable proximity switch assembly and activation method
US9184745B2 (en) 2012-04-11 2015-11-10 Ford Global Technologies, Llc Proximity switch assembly and method of sensing user input based on signal rate of change
US8933708B2 (en) 2012-04-11 2015-01-13 Ford Global Technologies, Llc Proximity switch assembly and activation method with exploration mode
US9287864B2 (en) 2012-04-11 2016-03-15 Ford Global Technologies, Llc Proximity switch assembly and calibration method therefor
US9065447B2 (en) 2012-04-11 2015-06-23 Ford Global Technologies, Llc Proximity switch assembly and method having adaptive time delay
US9219472B2 (en) 2012-04-11 2015-12-22 Ford Global Technologies, Llc Proximity switch assembly and activation method using rate monitoring
US9831870B2 (en) 2012-04-11 2017-11-28 Ford Global Technologies, Llc Proximity switch assembly and method of tuning same
US9660644B2 (en) 2012-04-11 2017-05-23 Ford Global Technologies, Llc Proximity switch assembly and activation method
US9559688B2 (en) 2012-04-11 2017-01-31 Ford Global Technologies, Llc Proximity switch assembly having pliable surface and depression
US9136840B2 (en) 2012-05-17 2015-09-15 Ford Global Technologies, Llc Proximity switch assembly having dynamic tuned threshold
US8981602B2 (en) 2012-05-29 2015-03-17 Ford Global Technologies, Llc Proximity switch assembly having non-switch contact and method
US9337832B2 (en) 2012-06-06 2016-05-10 Ford Global Technologies, Llc Proximity switch and method of adjusting sensitivity therefor
US9641172B2 (en) 2012-06-27 2017-05-02 Ford Global Technologies, Llc Proximity switch assembly having varying size electrode fingers
US8922340B2 (en) 2012-09-11 2014-12-30 Ford Global Technologies, Llc Proximity switch based door latch release
US8796575B2 (en) 2012-10-31 2014-08-05 Ford Global Technologies, Llc Proximity switch assembly having ground layer
US9311204B2 (en) 2013-03-13 2016-04-12 Ford Global Technologies, Llc Proximity interface development system having replicator and method
WO2014151978A2 (en) 2013-03-14 2014-09-25 Emprimus, Llc Electromagnetically protected electronic enclosure
EP3011369B1 (en) 2013-06-20 2019-12-11 Aspect International (2015) Private Limited An nmr/mri-based integrated system for analyzing and treating of a drilling mud for drilling mud recycling process and methods thereof
US9167734B2 (en) 2013-08-02 2015-10-20 Raytheon Company Circuit board and connector shielding apparatus
US9245853B2 (en) * 2013-08-13 2016-01-26 Kabushiki Kaisha Toshiba Memory module
US9494503B2 (en) 2013-11-06 2016-11-15 Aspect Imaging Ltd. Inline rheology/viscosity, density, and flow rate measurement
US10038443B2 (en) 2014-10-20 2018-07-31 Ford Global Technologies, Llc Directional proximity switch assembly
EP3247881A4 (en) 2015-01-19 2019-06-12 Aspect International (2015) Private Limited NMR SYSTEMS FOR RAW PETROLEUM IMPROVEMENT AND ASSOCIATED METHODS
US9654103B2 (en) 2015-03-18 2017-05-16 Ford Global Technologies, Llc Proximity switch assembly having haptic feedback and method
CN106053299B (zh) 2015-04-12 2020-10-30 艾斯拜克特Ai有限公司 非圆形横截面管道中的流体的nmr成像
US9548733B2 (en) 2015-05-20 2017-01-17 Ford Global Technologies, Llc Proximity sensor assembly having interleaved electrode configuration
CN106324010A (zh) 2015-07-02 2017-01-11 艾斯拜克特Ai有限公司 使用mr设备对在管道中流动的流体的分析
US10655996B2 (en) 2016-04-12 2020-05-19 Aspect Imaging Ltd. System and method for measuring velocity profiles
JP6729873B2 (ja) 2016-07-04 2020-07-29 トヨタ紡織株式会社 ウレタン発泡成形用補強用布状物およびこれを利用したウレタン発泡成形体の製造方法
WO2018147426A1 (ja) * 2017-02-13 2018-08-16 タツタ電線株式会社 シールドフィルム、シールドプリント配線板及びシールドプリント配線板の製造方法
US10477738B2 (en) 2017-03-06 2019-11-12 Laird Technologies, Inc. Board level shields and systems and methods of applying board level shielding
US10807300B2 (en) * 2017-11-08 2020-10-20 Hytech Worldwide, Inc. Three dimensional thermoforming of plastics with electronic components
US11685102B2 (en) 2017-11-08 2023-06-27 Hytech Worldwide, Inc. Three dimensional thermoforming and lamination
US11612538B2 (en) 2018-05-14 2023-03-28 Brandbumps, Llc Tactile warning panel system with geothermal system
US11114715B2 (en) 2018-12-06 2021-09-07 Ford Global Technologies, Llc Enclosure assemblies with improved electromagnetic compatibility
KR102389669B1 (ko) 2020-02-24 2022-04-21 신현호 이엠아이 차폐용 조립식 구조물
US11297718B2 (en) * 2020-06-30 2022-04-05 Gentherm Gmbh Methods of manufacturing flex circuits with mechanically formed conductive traces
EP4016364A1 (en) 2020-12-16 2022-06-22 The Boeing Company Computing device and method for developing a system model utilizing a simulation assessment module
CN114650648A (zh) * 2020-12-21 2022-06-21 3M创新有限公司 贴附了3d成型的电磁屏蔽膜的电路板、可3d成型的电磁屏蔽膜和3d成型的电磁屏蔽膜
WO2024092012A1 (en) * 2022-10-25 2024-05-02 International Automotive Components Group Na, Inc. Composite article with electromagnetic interference shielding and method of forming

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3727292A (en) * 1969-12-09 1973-04-17 Monsanto Co Method of fabricating a non-woven sheet from extruded metal filaments
US4678699A (en) * 1982-10-25 1987-07-07 Allied Corporation Stampable polymeric composite containing an EMI/RFI shielding layer
US4661888A (en) * 1984-07-03 1987-04-28 Hewlett-Packard Company Removable modular housing for RF circuits
US4689089A (en) * 1984-09-21 1987-08-25 Hobart Corporation Heat control for a dishwashing machine
US4689098A (en) * 1985-10-11 1987-08-25 Phillips Petroleum Company Molding composition
MY105757A (en) * 1989-01-23 1995-01-30 Minnesota Mining & Mfg Metal fiber mat/polymer composite
US5226210A (en) * 1989-01-23 1993-07-13 Minnesota Mining And Manufacturing Company Method of forming metal fiber mat/polymer composite
JP2741400B2 (ja) * 1989-04-18 1998-04-15 鈴木総業株式会社 電磁波シールド用シート成形体の製造方法
US5869412A (en) * 1991-08-22 1999-02-09 Minnesota Mining & Manufacturing Co. Metal fibermat/polymer composite
US5294826A (en) * 1993-04-16 1994-03-15 Northern Telecom Limited Integrated circuit package and assembly thereof for thermal and EMI management
DE19617656A1 (de) * 1996-05-03 1997-11-06 Siegfried Schaal Metallveredel Abschirm-Formteil für elektronische Bauelemente
EP0806891B1 (en) * 1996-05-08 1999-03-10 W.L. GORE & ASSOCIATES, INC. A lid assembly for shielding electronic components from EMI/RFI interferences
US6013376A (en) * 1997-12-09 2000-01-11 3M Innovative Properties Company Metal fibermat/polymer composite

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WO1999057952A1 (en) 1999-11-11
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DE69900848T2 (de) 2002-10-24
EP1075781A1 (en) 2001-02-14
US6485595B1 (en) 2002-11-26
US6090728A (en) 2000-07-18
EP1075781B1 (en) 2002-01-30
KR20010043185A (ko) 2001-05-25
WO1999057952A9 (en) 2001-11-01
CA2328935A1 (en) 1999-11-11

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