ES2158310T3 - Procedimiento y aparato para la termosoldadura de tramos de perfiles para juntas de estanqueidad. - Google Patents
Procedimiento y aparato para la termosoldadura de tramos de perfiles para juntas de estanqueidad.Info
- Publication number
- ES2158310T3 ES2158310T3 ES96914128T ES96914128T ES2158310T3 ES 2158310 T3 ES2158310 T3 ES 2158310T3 ES 96914128 T ES96914128 T ES 96914128T ES 96914128 T ES96914128 T ES 96914128T ES 2158310 T3 ES2158310 T3 ES 2158310T3
- Authority
- ES
- Spain
- Prior art keywords
- conductivity
- type
- conductive track
- thermosolding
- appliance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/535—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including internal interconnections, e.g. cross-under constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Abstract
SE EXPONE UN PROCEDIMIENTO PARA SOLDAR TERMICAMENTE TROZOS DE ESQUINA DE PERFILES (10, 11) PARA SELLAR GUARNICIONES, POR EJEMPLO, PARA FRIGORIFICOS O SIMILARES, DEL TIPO QUE COMPRENDE AL MENOS UNA CAMARA DE AIRE EXTENSIBLE O COMPRIMIBLE, EN FORMA DE FUELLE, PROCEDIMIENTO QUE COMPRENDE LOS PASOS DE COLOCAR DOS TROZOS DE PERFIL, CON SUS EXTREMOS OPUESTOS ENTRE SI, CALENTAR DICHOS EXTREMOS AL MISMO TIEMPO QUE SE APRIETAN SIMULTANEAMENTE (27, 28) CADA UNO DE DICHOS TROZOS DE PERFIL CERCA DE LOS CITADOS EXTREMOS, CON EL FIN DE OCLUIR TOTALMENTE LA CITADA CAMARA DE AIRE (13) A LO LARGO DE LA SECCION DE APRIETE, CERRAR EL MOLDE (19, 20) PARA CONSEGUIR QUE EL CITADO PAR DE TROZOS DE PERFIL SE PONGAN EN CONTACTO MUTUO COINCIDENTE EN SUS EXTREMOS CALIENTES, E INYECTAR AIRE EN EL INTERIOR DE LA CITADA CAMARA DE AIRE, EN LA ZONA COMPRENDIDA ENTRE LA SECCION DE APRIETE Y LOS EXTREMOS DE LOS CITADOS TROZOS DE PERFIL.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19604776A DE19604776A1 (de) | 1996-02-09 | 1996-02-09 | Auftrennbare Verbindungsbrücke (Fuse) und verbindbare Leitungsunterbrechung (Anti-Fuse), sowie Verfahren zur Herstellung und Aktivierung einer Fuse und einer Anti-Fuse |
PCT/DE1997/000235 WO1997029515A2 (de) | 1996-02-09 | 1997-02-06 | Auftrennbare verbindungsbrücke (fuse) und verbindbare leitungsunterbrechung (anti-fuse), sowie verfahren zur herstellung und aktivierung einer fuse und einer anti-fuse |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2158310T3 true ES2158310T3 (es) | 2001-09-01 |
Family
ID=7784979
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96914128T Expired - Lifetime ES2158310T3 (es) | 1996-02-09 | 1996-04-25 | Procedimiento y aparato para la termosoldadura de tramos de perfiles para juntas de estanqueidad. |
ES97914128T Expired - Lifetime ES2198559T3 (es) | 1996-02-09 | 1997-02-06 | Puente de conexion (fusible) separable e interrupcion de la linea (anti-fusible) conectable asi como procedimiento para la fabricacion y activacion de un fusible y de un anti-fusible. |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES97914128T Expired - Lifetime ES2198559T3 (es) | 1996-02-09 | 1997-02-06 | Puente de conexion (fusible) separable e interrupcion de la linea (anti-fusible) conectable asi como procedimiento para la fabricacion y activacion de un fusible y de un anti-fusible. |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP0879479B1 (es) |
JP (1) | JP3288385B2 (es) |
KR (1) | KR100414239B1 (es) |
CN (1) | CN1211856C (es) |
AT (1) | ATE239302T1 (es) |
DE (2) | DE19604776A1 (es) |
ES (2) | ES2158310T3 (es) |
IN (1) | IN191121B (es) |
UA (1) | UA50755C2 (es) |
WO (1) | WO1997029515A2 (es) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0992809A1 (de) | 1998-09-28 | 2000-04-12 | Siemens Aktiengesellschaft | Schaltungsanordnung mit deaktivierbarem Scanpfad |
DE10346460A1 (de) * | 2003-10-02 | 2005-05-19 | Infineon Technologies Ag | Anordnung und Verfahren zum Schutz von Fuses/Anti-Fuses |
DE10349749B3 (de) * | 2003-10-23 | 2005-05-25 | Infineon Technologies Ag | Anti-Fuse-Verbindung für integrierte Schaltungen sowie Verfahren zur Herstellung von Anti-Fuse-Verbindungen |
JP4701034B2 (ja) * | 2005-08-02 | 2011-06-15 | パナソニック株式会社 | 半導体装置 |
US7576407B2 (en) * | 2006-04-26 | 2009-08-18 | Samsung Electronics Co., Ltd. | Devices and methods for constructing electrically programmable integrated fuses for low power applications |
US8542517B2 (en) | 2011-06-13 | 2013-09-24 | International Business Machines Corporation | Low voltage programmable mosfet antifuse with body contact for diffusion heating |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1131790B (it) * | 1979-08-20 | 1986-06-25 | Rca Corp | Complesso universale di collegamento interno per circuiti integrati cmos/sos ad alta densita' |
EP0054102A3 (en) * | 1980-12-11 | 1983-07-27 | Rockwell International Corporation | Very high density cells comprising a rom and method of manufacturing same |
GB2100057A (en) * | 1981-05-27 | 1982-12-15 | Post Office | Method of forming conductive tracks in a semi-conductor body by annealing |
DE3377555D1 (en) * | 1982-05-12 | 1988-09-01 | Toshiba Kk | Semiconductor device capable of structural selection |
GB2215128B (en) * | 1988-02-23 | 1991-10-16 | Stc Plc | Improvements in integrated circuits |
JPH0320063A (ja) * | 1989-06-16 | 1991-01-29 | Matsushita Electron Corp | 電気ヒューズ |
FR2713398B1 (fr) * | 1993-11-30 | 1996-01-19 | Sgs Thomson Microelectronics | Fusible pour circuit intégré. |
-
1996
- 1996-02-09 DE DE19604776A patent/DE19604776A1/de not_active Withdrawn
- 1996-04-25 ES ES96914128T patent/ES2158310T3/es not_active Expired - Lifetime
-
1997
- 1997-02-06 WO PCT/DE1997/000235 patent/WO1997029515A2/de active IP Right Grant
- 1997-02-06 UA UA98084340A patent/UA50755C2/uk unknown
- 1997-02-06 JP JP52805297A patent/JP3288385B2/ja not_active Expired - Fee Related
- 1997-02-06 ES ES97914128T patent/ES2198559T3/es not_active Expired - Lifetime
- 1997-02-06 EP EP97914128A patent/EP0879479B1/de not_active Expired - Lifetime
- 1997-02-06 AT AT97914128T patent/ATE239302T1/de not_active IP Right Cessation
- 1997-02-06 CN CNB971921598A patent/CN1211856C/zh not_active Expired - Lifetime
- 1997-02-06 KR KR10-1998-0706091A patent/KR100414239B1/ko not_active IP Right Cessation
- 1997-02-06 DE DE59709973T patent/DE59709973D1/de not_active Expired - Lifetime
- 1997-02-10 IN IN229CA1997 patent/IN191121B/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR100414239B1 (ko) | 2004-02-18 |
EP0879479B1 (de) | 2003-05-02 |
KR19990082361A (ko) | 1999-11-25 |
WO1997029515A2 (de) | 1997-08-14 |
JPH11506874A (ja) | 1999-06-15 |
WO1997029515A3 (de) | 1997-09-18 |
UA50755C2 (uk) | 2002-11-15 |
CN1210623A (zh) | 1999-03-10 |
IN191121B (es) | 2003-09-27 |
JP3288385B2 (ja) | 2002-06-04 |
EP0879479A2 (de) | 1998-11-25 |
ES2198559T3 (es) | 2004-02-01 |
ATE239302T1 (de) | 2003-05-15 |
DE59709973D1 (de) | 2003-06-05 |
CN1211856C (zh) | 2005-07-20 |
DE19604776A1 (de) | 1997-08-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Grant refused |
Effective date: 19990706 |
|
FG2A | Definitive protection |
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