ES2142338T3 - Procedimiento para marcar una tarjeta de chip. - Google Patents

Procedimiento para marcar una tarjeta de chip.

Info

Publication number
ES2142338T3
ES2142338T3 ES93402058T ES93402058T ES2142338T3 ES 2142338 T3 ES2142338 T3 ES 2142338T3 ES 93402058 T ES93402058 T ES 93402058T ES 93402058 T ES93402058 T ES 93402058T ES 2142338 T3 ES2142338 T3 ES 2142338T3
Authority
ES
Spain
Prior art keywords
mark
procedure
connector
recording
chip card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93402058T
Other languages
English (en)
Inventor
Pierre Merlin
Gerard Coiton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA filed Critical Gemplus Card International SA
Application granted granted Critical
Publication of ES2142338T3 publication Critical patent/ES2142338T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K1/00—Methods or arrangements for marking the record carrier in digital fashion
    • G06K1/12—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
    • G06K1/126—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching by photographic or thermographic registration
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

PROCESO DE GRABACION DE INDICACIONES (20) SOBRE UN CONECTOR DE UNA TARJETA LLAMADA ELECTRONICA, DICHO CONECTOR PRESENTA UNOS CONTACTOS METALICOS (12) DE ESPESOR DADO. ACERCA DE LA INVENCION, DICHO PROCESO COMPORTA UNA ETAPA QUE CONSISTE EN GRABAR CON UN HAZ LASER DICHAS INDICACIONES EN EL ESPESOR DE LOS CONTACTOS METALICOS (12) DEL CONECTOR (11). APLICACION PARA LA GRABACION DE LAS TARJETAS ELECTRONICAS, TARJETAS BANCARIAS, TELETARJETAS, ETC..
ES93402058T 1992-08-26 1993-08-13 Procedimiento para marcar una tarjeta de chip. Expired - Lifetime ES2142338T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9210296A FR2695234B1 (fr) 1992-08-26 1992-08-26 Procédé de marquage d'une carte à puce.

Publications (1)

Publication Number Publication Date
ES2142338T3 true ES2142338T3 (es) 2000-04-16

Family

ID=9433034

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93402058T Expired - Lifetime ES2142338T3 (es) 1992-08-26 1993-08-13 Procedimiento para marcar una tarjeta de chip.

Country Status (6)

Country Link
US (2) US5552574A (es)
EP (1) EP0589732B1 (es)
JP (1) JP3346614B2 (es)
DE (1) DE69327216T2 (es)
ES (1) ES2142338T3 (es)
FR (1) FR2695234B1 (es)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0681252A1 (en) * 1994-05-06 1995-11-08 Takaharu Honda Code mark marking method for surgical instrument and surgical instrument with code mark
EP0835497B1 (de) * 1995-06-27 2013-03-27 Morpho Cards GmbH Chipkarte
DE19539355A1 (de) * 1995-10-23 1997-04-24 Giesecke & Devrient Gmbh Verfahren zur Echtheitsprüfung eines Datenträgers
DE19606782C1 (de) * 1996-02-23 1998-01-08 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte und damit hergestellte Chipkarte
DE19630049A1 (de) * 1996-07-25 1998-01-29 Siemens Ag Chipkarte mit einer Kontaktzone und Verfahren zum Herstellen einer solchen Kontaktzone
DE19632113C1 (de) * 1996-08-08 1998-02-19 Siemens Ag Chipkarte, Verfahren zur Herstellung einer Chipkarte und Halbleiterchip zur Verwendung in einer Chipkarte
FR2755902B1 (fr) * 1996-11-20 1999-02-12 Sarl Ind Laser Partner Procede de realisation, sur un produit, d'un marquage invisible, pouvant etre revele
JPH1126333A (ja) * 1997-06-27 1999-01-29 Oki Electric Ind Co Ltd 半導体装置及びその情報管理システム
US6214523B1 (en) 1998-01-09 2001-04-10 International Business Machines Corporation Pattern formation by removal of paste material
FR2777506B1 (fr) * 1998-04-17 2000-06-30 Gemplus Card Int Procede de realisation d'une entite decorative sur une carte du type a circuit integre
US6926487B1 (en) 1998-04-28 2005-08-09 Rexam Ab Method and apparatus for manufacturing marked articles to be included in cans
FR2786317B1 (fr) * 1998-11-24 2002-12-27 Gemplus Card Int Procede de fabrication de carte a puce a contact affleurant utilisant une etape de gravure au laser et carte a puce obtenue par le procede
US6479787B1 (en) * 1999-10-05 2002-11-12 Rexam Ab Laser unit and method for engraving articles to be included in cans
US6653593B2 (en) 1999-10-08 2003-11-25 Nanovia, Lp Control system for ablating high-density array of vias or indentation in surface of object
US6833911B2 (en) 1999-10-08 2004-12-21 Identification Dynamics, Inc. Method and apparatus for reading firearm microstamping
US6886284B2 (en) * 1999-10-08 2005-05-03 Identification Dynamics, Llc Firearm microstamping and micromarking insert for stamping a firearm identification code and serial number into cartridge shell casings and projectiles
US6310701B1 (en) * 1999-10-08 2001-10-30 Nanovia Lp Method and apparatus for ablating high-density array of vias or indentation in surface of object
US6256121B1 (en) * 1999-10-08 2001-07-03 Nanovia, Lp Apparatus for ablating high-density array of vias or indentation in surface of object
AU1331001A (en) * 1999-10-08 2001-04-23 Nanovia, Lp Method control system and apparatus for ablating high-density array of vias or indentation in surface of object
US7111423B2 (en) * 1999-10-08 2006-09-26 Identification Dynamics, Llc Method and apparatus for reading firearm microstamping
US6872913B1 (en) 2000-01-14 2005-03-29 Rexam Ab Marking of articles to be included in cans
US6455806B1 (en) 2000-01-14 2002-09-24 Rexam Ab Arrangement for shaping and marking a target
US6926456B1 (en) 2000-01-20 2005-08-09 Rexam Ab Guiding device for a marking arrangement
US6576871B1 (en) 2000-04-03 2003-06-10 Rexam Ab Method and device for dust protection in a laser processing apparatus
JP4817351B2 (ja) * 2001-07-31 2011-11-16 トッパン・フォームズ株式会社 記録媒体
US7204419B2 (en) * 2003-05-01 2007-04-17 Identifcation Dynamics, Llc Method and apparatus for reading firearm microstamping
US20040058238A1 (en) * 2002-09-24 2004-03-25 Robert Miller Implantable current collector ID matrix identifier
US20050241203A1 (en) * 2003-05-01 2005-11-03 Lizotte Todd E Method and apparatus for cartridge identification imprinting in difficult contexts by recess protected indicia
FR2859870A1 (fr) * 2003-09-12 2005-03-18 Framatome Connectors Int Connecteur electrique et procede de marquage
DE10345257B4 (de) * 2003-09-29 2008-10-02 Infineon Technologies Ag Chipkarte mit Kontaktfelder und Verfahren zum Herstellen solcher Kontaktfelder
EP1434168A1 (fr) * 2003-12-03 2004-06-30 Nagracard S.A. Procédé de fabrication de cartes personnalisées
DE102004021872B3 (de) 2004-05-04 2005-12-22 Infineon Technologies Ag Chipkarte, Verfahren zum Herstellen einer Chipkarte und elektrisch leitfähiges Kontaktierungselement
EP1617353A1 (en) * 2004-07-13 2006-01-18 Axalto SA Mini-plug SIM card with improved positioning capability
WO2006043848A1 (fr) * 2004-10-15 2006-04-27 Yuri Konstantinovich Nizienko Procede de modification des regions d'une couche en surface d'un article et dispositif correspondant
FR2932910B1 (fr) * 2008-06-20 2011-02-11 Smart Packaging Solutions Sps Carte sans contact avec logo securitaire
FR2939221B1 (fr) * 2008-11-28 2010-11-26 Sagem Securite Carte a puce comportant un module electronique porte par un corps de carte pourvue de moyens d'authentification de l'appairage du module avec le corps
EP2339511A1 (fr) * 2009-12-17 2011-06-29 Gemalto SA Objet communicant avec sécurisation d'une interface de communication par contact
DE102010036057A1 (de) * 2010-09-01 2012-03-01 Giesecke & Devrient Gmbh Chipmodul mit Kennzeichnung
FR2989491B1 (fr) * 2012-04-17 2014-12-26 Microconnections Sas Procede de marquage de module de carte a puce par gravure
FR2989492B1 (fr) 2012-04-17 2014-12-26 Microconnections Sas Procede de marquage de module de carte a puce par electrodeposition
DE102012219249A1 (de) * 2012-10-22 2014-02-13 Bundesdruckerei Gmbh Vorrichtung zur Laserpersonalisierung von Sicherheitselementen
FR3000583B1 (fr) 2012-12-31 2016-02-05 Smart Packaging Solutions Carte a puce avec element securitaire reparti entre corps de carte et module
DE102015015201A1 (de) * 2015-11-24 2017-05-24 Giesecke & Devrient Gmbh Verfahren zur Individualisierung eines Chipmoduls mitsamt individualisiertem Chipmodul
CN105855719B (zh) * 2016-03-30 2018-01-26 深圳市创鑫激光股份有限公司 一种激光打标机打标方法和装置
EP3726432B1 (en) * 2019-04-18 2023-06-07 MK Smart JSC Patterned smart card module
JP7278196B2 (ja) * 2019-04-18 2023-05-19 エムケー スマート ジョイントストックカンパニー パターン付きスマートカードモジュール、パターン付きスマートカードモジュールを含むスマートカード、パターン付きスマートカードモジュールを製造する方法、及びパターン付きスマートカードモジュールの認証を検証する方法
EP3889839A1 (fr) 2020-03-31 2021-10-06 Thales Dis France Sa Procédé de personnalisation graphique optimisé de modules de carte à puce et module obtenu
FR3110734B1 (fr) 2020-05-20 2022-07-29 Smart Packaging Solutions Module électronique pour carte à puce avec motifs de sécurité

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4675498A (en) * 1967-09-05 1987-06-23 Lemelson Jerome H Apparatus and method for coding objects
DE1263091B (de) * 1965-03-20 1968-03-14 Bosch Gmbh Robert Vorrichtung zum Aufzeichnen von Informationen
US3803637A (en) * 1972-11-17 1974-04-09 Ibm Laser printer
DE3048735C2 (de) * 1980-12-23 1984-10-18 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit durch einen Laserschreiber aufgebrachten Informationen und Verfahren zur Herstellung derselben
JPS5853444A (ja) * 1981-09-25 1983-03-30 Nec Corp レ−ザマ−キング装置
JPS59207246A (ja) * 1983-05-11 1984-11-24 Hitachi Ltd レ−ザ・マ−キング装置
DE3333386A1 (de) * 1983-09-15 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Verfahren und einrichtung zum beschriften von teilen, insbesondere von elektronischen bauelementen
US4701591A (en) * 1983-11-07 1987-10-20 Matsushita Electric Industrial Co., Ltd Apparatus for processing multiple workpieces utilizing a single laser beam source
US4652722A (en) * 1984-04-05 1987-03-24 Videojet Systems International, Inc. Laser marking apparatus
US4639584A (en) * 1985-07-25 1987-01-27 Adams Robert T Non-alterable magnetic coding
DE3703809A1 (de) * 1987-02-07 1988-08-18 Braun Ag Vorrichtung zum markieren von gegenstaenden mittels laserstrahlen
EP0329787A4 (en) * 1987-08-28 1990-09-05 Tsentralnoe Konstruktorskoe Bjuro Unikalnogo Priborostroenia Akademii Nauk Ssr Method and device for laser processing of an object
US4904853A (en) * 1987-09-22 1990-02-27 Kabushiki Kaisha Astex Dual-function information-carrying sheet device
US4831244A (en) * 1987-10-01 1989-05-16 Polaroid Corporation Optical record cards
FR2624651B1 (fr) * 1987-12-14 1991-09-06 Sgs Thomson Microelectronics Procede de mise en place d'un composant electronique et de ses connexions electriques sur un support et produit ainsi obtenu
FR2625000B1 (fr) * 1987-12-22 1991-08-16 Sgs Thomson Microelectronics Structure de carte a puce
US4922077A (en) * 1989-01-31 1990-05-01 Raytheon Company Method of laser marking metal packages
FR2645680B1 (fr) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication
GB9003446D0 (en) * 1990-02-15 1990-04-11 Sunman Robert P Cards
JPH03248784A (ja) * 1990-02-28 1991-11-06 Hitachi Ltd レーザマーキングシステム
US5353296A (en) * 1993-07-12 1994-10-04 Coherent, Inc. Materials processing with a high repetition rate isotopic carbon dioxide laser

Also Published As

Publication number Publication date
EP0589732B1 (fr) 1999-12-08
US5552574A (en) 1996-09-03
DE69327216T2 (de) 2000-04-13
JP3346614B2 (ja) 2002-11-18
US5681491A (en) 1997-10-28
FR2695234A1 (fr) 1994-03-04
EP0589732A1 (fr) 1994-03-30
DE69327216D1 (de) 2000-01-13
FR2695234B1 (fr) 1994-11-04
JPH06218564A (ja) 1994-08-09

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