FR2777506B1 - Procede de realisation d'une entite decorative sur une carte du type a circuit integre - Google Patents
Procede de realisation d'une entite decorative sur une carte du type a circuit integreInfo
- Publication number
- FR2777506B1 FR2777506B1 FR9805267A FR9805267A FR2777506B1 FR 2777506 B1 FR2777506 B1 FR 2777506B1 FR 9805267 A FR9805267 A FR 9805267A FR 9805267 A FR9805267 A FR 9805267A FR 2777506 B1 FR2777506 B1 FR 2777506B1
- Authority
- FR
- France
- Prior art keywords
- producing
- integrated circuit
- type card
- circuit type
- decorative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C5/00—Processes for producing special ornamental bodies
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9805267A FR2777506B1 (fr) | 1998-04-17 | 1998-04-17 | Procede de realisation d'une entite decorative sur une carte du type a circuit integre |
EP99911849A EP1073997A1 (fr) | 1998-04-17 | 1999-03-26 | Procede de realisaiton d'une entite decorative sur une carte du type a circuit integre |
AU30390/99A AU3039099A (en) | 1998-04-17 | 1999-03-26 | Method for producing a decorative item on an integrated circuit card |
PCT/FR1999/000705 WO1999054845A1 (fr) | 1998-04-17 | 1999-03-26 | Procede de realisaiton d'une entite decorative sur une carte du type a circuit integre |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9805267A FR2777506B1 (fr) | 1998-04-17 | 1998-04-17 | Procede de realisation d'une entite decorative sur une carte du type a circuit integre |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2777506A1 FR2777506A1 (fr) | 1999-10-22 |
FR2777506B1 true FR2777506B1 (fr) | 2000-06-30 |
Family
ID=9525719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9805267A Expired - Fee Related FR2777506B1 (fr) | 1998-04-17 | 1998-04-17 | Procede de realisation d'une entite decorative sur une carte du type a circuit integre |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1073997A1 (fr) |
AU (1) | AU3039099A (fr) |
FR (1) | FR2777506B1 (fr) |
WO (1) | WO1999054845A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2720175A1 (fr) * | 2012-10-09 | 2014-04-16 | Gemalto SA | Module électronique, dispositif à module électronique et procédé de fabrication. |
FR3040516B1 (fr) | 2015-08-27 | 2017-09-15 | Linxens Holding | Procede de fabrication d’un circuit electrique, circuit electrique obtenu par ce procede et carte a puce comportant un tel circuit electrique |
EP3889839A1 (fr) | 2020-03-31 | 2021-10-06 | Thales Dis France Sa | Procédé de personnalisation graphique optimisé de modules de carte à puce et module obtenu |
FR3110734B1 (fr) | 2020-05-20 | 2022-07-29 | Smart Packaging Solutions | Module électronique pour carte à puce avec motifs de sécurité |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5708545A (en) * | 1992-07-23 | 1998-01-13 | Deutsche Thomson-Brandt Gmbh | Recording device with electrical contacts |
FR2695234B1 (fr) * | 1992-08-26 | 1994-11-04 | Gemplus Card Int | Procédé de marquage d'une carte à puce. |
DE19630049A1 (de) * | 1996-07-25 | 1998-01-29 | Siemens Ag | Chipkarte mit einer Kontaktzone und Verfahren zum Herstellen einer solchen Kontaktzone |
-
1998
- 1998-04-17 FR FR9805267A patent/FR2777506B1/fr not_active Expired - Fee Related
-
1999
- 1999-03-26 AU AU30390/99A patent/AU3039099A/en not_active Abandoned
- 1999-03-26 WO PCT/FR1999/000705 patent/WO1999054845A1/fr not_active Application Discontinuation
- 1999-03-26 EP EP99911849A patent/EP1073997A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO1999054845A1 (fr) | 1999-10-28 |
AU3039099A (en) | 1999-11-08 |
EP1073997A1 (fr) | 2001-02-07 |
FR2777506A1 (fr) | 1999-10-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2730894B3 (fr) | Procede de fabrication d'une carte electronique a refroidissement par conduction thermique | |
FR2774214B1 (fr) | PROCEDE DE REALISATION D'UNE STRUCTURE DE TYPE SEMI-CONDUCTEUR SUR ISOLANT ET EN PARTICULIER SiCOI | |
FR2665280B1 (fr) | Procede de production d'une carte a circuit integre et carte obtenue. | |
FR2756955B1 (fr) | Procede de realisation d'un circuit electronique pour une carte a memoire sans contact | |
FR2743194B1 (fr) | Identification de carte a pointes pour une fabrication assistee par ordinateur | |
FR2776788B1 (fr) | Procede de commutation d'applications sur une carte a puce multi-applicative | |
FR2663783B1 (fr) | Procede de montage d'un circuit integre sur un support mince. | |
FR2818067B1 (fr) | Procede d'acheminement de messages electroniques | |
FR2766618B1 (fr) | Procede de fabrication d'un film conducteur anisotrope a inserts conducteurs | |
FR2723248B1 (fr) | Procede de realisation d'un inducteur | |
DE59914351D1 (de) | Elektronischer Blinkgeber | |
FR2781298B1 (fr) | Procede de fabrication d'une carte a puce electronique et carte a puce electronique | |
FR2774811B1 (fr) | Procede de formation de lignes conductrices sur des circuits integres | |
FR2748601B1 (fr) | Procede de formation d'interconnexions dans un circuit integre | |
FR2779008B1 (fr) | Procede de fabrication d'un dispositif a semiconducteur | |
FR2758729B1 (fr) | Procede de fabrication d'un surf de neige et surf de neige ainsi obtenu | |
FR2777506B1 (fr) | Procede de realisation d'une entite decorative sur une carte du type a circuit integre | |
FR2766654B1 (fr) | Procede de fabrication d'une carte de circuit imprime | |
FR2793331B1 (fr) | Procede de fabrication d'une carte a microcircuit | |
FR2712354B1 (fr) | Dispositif pour produire un courant d'air ayant une forme aplatie en section transversale. | |
FR2771854B1 (fr) | Procede de realisation d'interconnexions metalliques dans des circuits integres | |
FR2784230B1 (fr) | Procede de realisation d'un isolement inter et/ou intra-metallique par air dans un circuit integre et circuit integre obtenu | |
FR2781603B1 (fr) | Procede de formation d'une capacite sur un circuit integre | |
FR2775099B1 (fr) | Procede de fabrication d'une carte a circuit integre | |
FR2778494B1 (fr) | Procede de formation d'une structure a double incrustation pour un circuit integre |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20091231 |