ES2140340A1 - Procedimiento de soldadura laser aplicable a la union de pines sobre circuitos impresos. - Google Patents
Procedimiento de soldadura laser aplicable a la union de pines sobre circuitos impresos.Info
- Publication number
- ES2140340A1 ES2140340A1 ES009800549A ES9800549A ES2140340A1 ES 2140340 A1 ES2140340 A1 ES 2140340A1 ES 009800549 A ES009800549 A ES 009800549A ES 9800549 A ES9800549 A ES 9800549A ES 2140340 A1 ES2140340 A1 ES 2140340A1
- Authority
- ES
- Spain
- Prior art keywords
- joining
- printed circuit
- circuit boards
- laser soldering
- over printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1081—Special cross-section of a lead; Different cross-sections of different leads; Matching cross-section, e.g. matched to a land
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Procedimiento de soldadura láser aplicable a la unión de pines sobre circuitos impresos. El procedimiento preconizado, el de soldadura por láser, es un proceso de alta energía en el que la densidad del rayo láser se consigue por la concentración de ondas luminosas. Dicho proceso involucro dos metales (similares o disimilares) y, previamente a la unión metalúrgica, han de posicionarse frente al cabezal láser con suficiente precisión. La unión metalúrgica se realiza por-fusión directa de los metales a unir, con lo que no es necesario ningún metal de aporte.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES009800549A ES2140340B1 (es) | 1998-03-13 | 1998-03-13 | Procedimiento de soldadura laser aplicable a la union de pines sobre circuitos impresos. |
EP99500025A EP0941798A3 (en) | 1998-03-13 | 1999-02-18 | Laser soldering procedure applicable to the joining of pins over printed circuit boards |
CA002265100A CA2265100A1 (en) | 1998-03-13 | 1999-03-09 | Laser soldering procedure applicable to the joining of pins over printed circuit boards |
US09/267,284 US6160239A (en) | 1998-03-13 | 1999-03-12 | Laser soldering procedure applicable to the joining of pins over printed circuit boards |
JP11066032A JPH11320154A (ja) | 1998-03-13 | 1999-03-12 | プリント回路基板上のピン接合用のレ―ザ溶着方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES009800549A ES2140340B1 (es) | 1998-03-13 | 1998-03-13 | Procedimiento de soldadura laser aplicable a la union de pines sobre circuitos impresos. |
Publications (2)
Publication Number | Publication Date |
---|---|
ES2140340A1 true ES2140340A1 (es) | 2000-02-16 |
ES2140340B1 ES2140340B1 (es) | 2000-10-16 |
Family
ID=8303113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES009800549A Expired - Lifetime ES2140340B1 (es) | 1998-03-13 | 1998-03-13 | Procedimiento de soldadura laser aplicable a la union de pines sobre circuitos impresos. |
Country Status (5)
Country | Link |
---|---|
US (1) | US6160239A (es) |
EP (1) | EP0941798A3 (es) |
JP (1) | JPH11320154A (es) |
CA (1) | CA2265100A1 (es) |
ES (1) | ES2140340B1 (es) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2833756A1 (fr) * | 2001-12-18 | 2003-06-20 | Valeo Electronique | Procede de soudure de pion par refusion et plaque de circuit imprime a double face |
CN100423085C (zh) * | 2002-10-09 | 2008-10-01 | 新科实业有限公司 | 通过焊接特定部件来改进硬盘驱动器磁头臂组件的设计和制造工艺的方法和装置 |
JP5043764B2 (ja) * | 2008-06-30 | 2012-10-10 | 株式会社ジャパンユニックス | レーザー式はんだ付け方法及び装置 |
US9120898B2 (en) | 2011-07-08 | 2015-09-01 | Baker Hughes Incorporated | Method of curing thermoplastic polymer for shape memory material |
US8939222B2 (en) | 2011-09-12 | 2015-01-27 | Baker Hughes Incorporated | Shaped memory polyphenylene sulfide (PPS) for downhole packer applications |
US8829119B2 (en) | 2011-09-27 | 2014-09-09 | Baker Hughes Incorporated | Polyarylene compositions for downhole applications, methods of manufacture, and uses thereof |
KR20130076286A (ko) * | 2011-12-28 | 2013-07-08 | 삼성전기주식회사 | 인쇄회로기판 및 그의 제조방법 |
US9144925B2 (en) | 2012-01-04 | 2015-09-29 | Baker Hughes Incorporated | Shape memory polyphenylene sulfide manufacturing, process, and composition |
US9707642B2 (en) | 2012-12-07 | 2017-07-18 | Baker Hughes Incorporated | Toughened solder for downhole applications, methods of manufacture thereof and articles comprising the same |
JP6497306B2 (ja) * | 2015-06-29 | 2019-04-10 | 株式会社デンソー | 電子装置及びその製造方法 |
JP6767245B2 (ja) * | 2015-11-20 | 2020-10-14 | 古河電気工業株式会社 | 基板接続構造、及び、導体部接続方法 |
KR101959216B1 (ko) * | 2017-07-17 | 2019-03-19 | (주)제이스텍 | 플렉시블 디스플레이 패널과 cof의 융착용 정렬 표식 백라이트 장치 |
US10849239B2 (en) * | 2018-01-19 | 2020-11-24 | Ncc Nano, Llc | Method for curing solder paste on a thermally fragile substrate |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4696104A (en) * | 1985-06-07 | 1987-09-29 | Vanzetti Systems, Inc. | Method and apparatus for placing and electrically connecting components on a printed circuit board |
ES2008536A6 (es) * | 1987-06-11 | 1989-07-16 | Ericsson Telefon Ab L M | Una espiga fijada a una placa de circuito impreso mediante soldadura para conectar conductores electricos. |
US5227604A (en) * | 1991-06-28 | 1993-07-13 | Digital Equipment Corporation | Atmospheric pressure gaseous-flux-assisted laser reflow soldering |
US5302801A (en) * | 1990-11-16 | 1994-04-12 | Mitsubishi Denki Kabushiki Kaisha | Laser bonding apparatus |
US5495089A (en) * | 1993-06-04 | 1996-02-27 | Digital Equipment Corporation | Laser soldering surface mount components of a printed circuit board |
US5560534A (en) * | 1994-03-18 | 1996-10-01 | Fujitsu Limited | Soldering apparatus |
US5590455A (en) * | 1994-01-21 | 1997-01-07 | Pioneer Electronic Corporation | Apparatus for manufacturing a printed circuit board |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3267249A (en) * | 1963-09-26 | 1966-08-16 | George J Veth | Optical soldering technique and apparatus |
US3485996A (en) * | 1967-01-11 | 1969-12-23 | Ibm | Laser welding |
US4278867A (en) * | 1978-12-29 | 1981-07-14 | International Business Machines Corporation | System for chip joining by short wavelength radiation |
US4612208A (en) * | 1985-04-22 | 1986-09-16 | Westinghouse Electric Corp. | Coupling aid for laser fusion of metal powders |
US4733039A (en) * | 1985-05-06 | 1988-03-22 | General Electric Company | Method of laser soldering |
EP0218069A1 (de) * | 1985-09-19 | 1987-04-15 | Siemens Aktiengesellschaft | Verfahren zum Verschweissen mittels Laserlicht |
US4774394A (en) * | 1987-09-02 | 1988-09-27 | E. I. Du Pont De Nemours And Company | Laser welding method |
DE3831743A1 (de) * | 1988-09-17 | 1990-03-29 | Philips Patentverwaltung | Vorrichtung zur bearbeitung eines werkstueckes mit laserlicht und verwendung dieser vorrichtung |
US5604831A (en) * | 1992-11-16 | 1997-02-18 | International Business Machines Corporation | Optical module with fluxless laser reflow soldered joints |
JPH10242595A (ja) * | 1997-02-26 | 1998-09-11 | Brother Ind Ltd | 回路基板 |
-
1998
- 1998-03-13 ES ES009800549A patent/ES2140340B1/es not_active Expired - Lifetime
-
1999
- 1999-02-18 EP EP99500025A patent/EP0941798A3/en not_active Withdrawn
- 1999-03-09 CA CA002265100A patent/CA2265100A1/en not_active Abandoned
- 1999-03-12 JP JP11066032A patent/JPH11320154A/ja not_active Withdrawn
- 1999-03-12 US US09/267,284 patent/US6160239A/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4696104A (en) * | 1985-06-07 | 1987-09-29 | Vanzetti Systems, Inc. | Method and apparatus for placing and electrically connecting components on a printed circuit board |
ES2008536A6 (es) * | 1987-06-11 | 1989-07-16 | Ericsson Telefon Ab L M | Una espiga fijada a una placa de circuito impreso mediante soldadura para conectar conductores electricos. |
US5302801A (en) * | 1990-11-16 | 1994-04-12 | Mitsubishi Denki Kabushiki Kaisha | Laser bonding apparatus |
US5227604A (en) * | 1991-06-28 | 1993-07-13 | Digital Equipment Corporation | Atmospheric pressure gaseous-flux-assisted laser reflow soldering |
US5495089A (en) * | 1993-06-04 | 1996-02-27 | Digital Equipment Corporation | Laser soldering surface mount components of a printed circuit board |
US5590455A (en) * | 1994-01-21 | 1997-01-07 | Pioneer Electronic Corporation | Apparatus for manufacturing a printed circuit board |
US5560534A (en) * | 1994-03-18 | 1996-10-01 | Fujitsu Limited | Soldering apparatus |
Also Published As
Publication number | Publication date |
---|---|
EP0941798A2 (en) | 1999-09-15 |
EP0941798A3 (en) | 2004-03-24 |
CA2265100A1 (en) | 1999-09-13 |
US6160239A (en) | 2000-12-12 |
JPH11320154A (ja) | 1999-11-24 |
ES2140340B1 (es) | 2000-10-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC2A | Transfer of patent | ||
EC2A | Search report published |
Date of ref document: 20000216 Kind code of ref document: A1 Effective date: 20000216 |