ES2140340A1 - Procedimiento de soldadura laser aplicable a la union de pines sobre circuitos impresos. - Google Patents

Procedimiento de soldadura laser aplicable a la union de pines sobre circuitos impresos.

Info

Publication number
ES2140340A1
ES2140340A1 ES009800549A ES9800549A ES2140340A1 ES 2140340 A1 ES2140340 A1 ES 2140340A1 ES 009800549 A ES009800549 A ES 009800549A ES 9800549 A ES9800549 A ES 9800549A ES 2140340 A1 ES2140340 A1 ES 2140340A1
Authority
ES
Spain
Prior art keywords
joining
printed circuit
circuit boards
laser soldering
over printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES009800549A
Other languages
English (en)
Other versions
ES2140340B1 (es
Inventor
Pitel Jose Antonio Cubero
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lear Automotive EEDS Spain SL
Original Assignee
Lear Automotive EEDS Spain SL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lear Automotive EEDS Spain SL filed Critical Lear Automotive EEDS Spain SL
Priority to ES009800549A priority Critical patent/ES2140340B1/es
Priority to EP99500025A priority patent/EP0941798A3/en
Priority to CA002265100A priority patent/CA2265100A1/en
Priority to US09/267,284 priority patent/US6160239A/en
Priority to JP11066032A priority patent/JPH11320154A/ja
Publication of ES2140340A1 publication Critical patent/ES2140340A1/es
Application granted granted Critical
Publication of ES2140340B1 publication Critical patent/ES2140340B1/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/005Soldering by means of radiant energy
    • B23K1/0056Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10295Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303Pin-in-hole mounted pins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/1081Special cross-section of a lead; Different cross-sections of different leads; Matching cross-section, e.g. matched to a land
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494Heating methods for reflowing of solder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

Procedimiento de soldadura láser aplicable a la unión de pines sobre circuitos impresos. El procedimiento preconizado, el de soldadura por láser, es un proceso de alta energía en el que la densidad del rayo láser se consigue por la concentración de ondas luminosas. Dicho proceso involucro dos metales (similares o disimilares) y, previamente a la unión metalúrgica, han de posicionarse frente al cabezal láser con suficiente precisión. La unión metalúrgica se realiza por-fusión directa de los metales a unir, con lo que no es necesario ningún metal de aporte.
ES009800549A 1998-03-13 1998-03-13 Procedimiento de soldadura laser aplicable a la union de pines sobre circuitos impresos. Expired - Lifetime ES2140340B1 (es)

Priority Applications (5)

Application Number Priority Date Filing Date Title
ES009800549A ES2140340B1 (es) 1998-03-13 1998-03-13 Procedimiento de soldadura laser aplicable a la union de pines sobre circuitos impresos.
EP99500025A EP0941798A3 (en) 1998-03-13 1999-02-18 Laser soldering procedure applicable to the joining of pins over printed circuit boards
CA002265100A CA2265100A1 (en) 1998-03-13 1999-03-09 Laser soldering procedure applicable to the joining of pins over printed circuit boards
US09/267,284 US6160239A (en) 1998-03-13 1999-03-12 Laser soldering procedure applicable to the joining of pins over printed circuit boards
JP11066032A JPH11320154A (ja) 1998-03-13 1999-03-12 プリント回路基板上のピン接合用のレ―ザ溶着方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES009800549A ES2140340B1 (es) 1998-03-13 1998-03-13 Procedimiento de soldadura laser aplicable a la union de pines sobre circuitos impresos.

Publications (2)

Publication Number Publication Date
ES2140340A1 true ES2140340A1 (es) 2000-02-16
ES2140340B1 ES2140340B1 (es) 2000-10-16

Family

ID=8303113

Family Applications (1)

Application Number Title Priority Date Filing Date
ES009800549A Expired - Lifetime ES2140340B1 (es) 1998-03-13 1998-03-13 Procedimiento de soldadura laser aplicable a la union de pines sobre circuitos impresos.

Country Status (5)

Country Link
US (1) US6160239A (es)
EP (1) EP0941798A3 (es)
JP (1) JPH11320154A (es)
CA (1) CA2265100A1 (es)
ES (1) ES2140340B1 (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2833756A1 (fr) * 2001-12-18 2003-06-20 Valeo Electronique Procede de soudure de pion par refusion et plaque de circuit imprime a double face
CN100423085C (zh) * 2002-10-09 2008-10-01 新科实业有限公司 通过焊接特定部件来改进硬盘驱动器磁头臂组件的设计和制造工艺的方法和装置
JP5043764B2 (ja) * 2008-06-30 2012-10-10 株式会社ジャパンユニックス レーザー式はんだ付け方法及び装置
US9120898B2 (en) 2011-07-08 2015-09-01 Baker Hughes Incorporated Method of curing thermoplastic polymer for shape memory material
US8939222B2 (en) 2011-09-12 2015-01-27 Baker Hughes Incorporated Shaped memory polyphenylene sulfide (PPS) for downhole packer applications
US8829119B2 (en) 2011-09-27 2014-09-09 Baker Hughes Incorporated Polyarylene compositions for downhole applications, methods of manufacture, and uses thereof
KR20130076286A (ko) * 2011-12-28 2013-07-08 삼성전기주식회사 인쇄회로기판 및 그의 제조방법
US9144925B2 (en) 2012-01-04 2015-09-29 Baker Hughes Incorporated Shape memory polyphenylene sulfide manufacturing, process, and composition
US9707642B2 (en) 2012-12-07 2017-07-18 Baker Hughes Incorporated Toughened solder for downhole applications, methods of manufacture thereof and articles comprising the same
JP6497306B2 (ja) * 2015-06-29 2019-04-10 株式会社デンソー 電子装置及びその製造方法
JP6767245B2 (ja) * 2015-11-20 2020-10-14 古河電気工業株式会社 基板接続構造、及び、導体部接続方法
KR101959216B1 (ko) * 2017-07-17 2019-03-19 (주)제이스텍 플렉시블 디스플레이 패널과 cof의 융착용 정렬 표식 백라이트 장치
US10849239B2 (en) * 2018-01-19 2020-11-24 Ncc Nano, Llc Method for curing solder paste on a thermally fragile substrate

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4696104A (en) * 1985-06-07 1987-09-29 Vanzetti Systems, Inc. Method and apparatus for placing and electrically connecting components on a printed circuit board
ES2008536A6 (es) * 1987-06-11 1989-07-16 Ericsson Telefon Ab L M Una espiga fijada a una placa de circuito impreso mediante soldadura para conectar conductores electricos.
US5227604A (en) * 1991-06-28 1993-07-13 Digital Equipment Corporation Atmospheric pressure gaseous-flux-assisted laser reflow soldering
US5302801A (en) * 1990-11-16 1994-04-12 Mitsubishi Denki Kabushiki Kaisha Laser bonding apparatus
US5495089A (en) * 1993-06-04 1996-02-27 Digital Equipment Corporation Laser soldering surface mount components of a printed circuit board
US5560534A (en) * 1994-03-18 1996-10-01 Fujitsu Limited Soldering apparatus
US5590455A (en) * 1994-01-21 1997-01-07 Pioneer Electronic Corporation Apparatus for manufacturing a printed circuit board

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3267249A (en) * 1963-09-26 1966-08-16 George J Veth Optical soldering technique and apparatus
US3485996A (en) * 1967-01-11 1969-12-23 Ibm Laser welding
US4278867A (en) * 1978-12-29 1981-07-14 International Business Machines Corporation System for chip joining by short wavelength radiation
US4612208A (en) * 1985-04-22 1986-09-16 Westinghouse Electric Corp. Coupling aid for laser fusion of metal powders
US4733039A (en) * 1985-05-06 1988-03-22 General Electric Company Method of laser soldering
EP0218069A1 (de) * 1985-09-19 1987-04-15 Siemens Aktiengesellschaft Verfahren zum Verschweissen mittels Laserlicht
US4774394A (en) * 1987-09-02 1988-09-27 E. I. Du Pont De Nemours And Company Laser welding method
DE3831743A1 (de) * 1988-09-17 1990-03-29 Philips Patentverwaltung Vorrichtung zur bearbeitung eines werkstueckes mit laserlicht und verwendung dieser vorrichtung
US5604831A (en) * 1992-11-16 1997-02-18 International Business Machines Corporation Optical module with fluxless laser reflow soldered joints
JPH10242595A (ja) * 1997-02-26 1998-09-11 Brother Ind Ltd 回路基板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4696104A (en) * 1985-06-07 1987-09-29 Vanzetti Systems, Inc. Method and apparatus for placing and electrically connecting components on a printed circuit board
ES2008536A6 (es) * 1987-06-11 1989-07-16 Ericsson Telefon Ab L M Una espiga fijada a una placa de circuito impreso mediante soldadura para conectar conductores electricos.
US5302801A (en) * 1990-11-16 1994-04-12 Mitsubishi Denki Kabushiki Kaisha Laser bonding apparatus
US5227604A (en) * 1991-06-28 1993-07-13 Digital Equipment Corporation Atmospheric pressure gaseous-flux-assisted laser reflow soldering
US5495089A (en) * 1993-06-04 1996-02-27 Digital Equipment Corporation Laser soldering surface mount components of a printed circuit board
US5590455A (en) * 1994-01-21 1997-01-07 Pioneer Electronic Corporation Apparatus for manufacturing a printed circuit board
US5560534A (en) * 1994-03-18 1996-10-01 Fujitsu Limited Soldering apparatus

Also Published As

Publication number Publication date
EP0941798A2 (en) 1999-09-15
EP0941798A3 (en) 2004-03-24
CA2265100A1 (en) 1999-09-13
US6160239A (en) 2000-12-12
JPH11320154A (ja) 1999-11-24
ES2140340B1 (es) 2000-10-16

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