DE10343821A1 - Verfahren zur Abschirmung von Bauelementen beim Laserschweißen - Google Patents

Verfahren zur Abschirmung von Bauelementen beim Laserschweißen Download PDF

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Publication number
DE10343821A1
DE10343821A1 DE10343821A DE10343821A DE10343821A1 DE 10343821 A1 DE10343821 A1 DE 10343821A1 DE 10343821 A DE10343821 A DE 10343821A DE 10343821 A DE10343821 A DE 10343821A DE 10343821 A1 DE10343821 A1 DE 10343821A1
Authority
DE
Germany
Prior art keywords
circuit board
screening
welding
components
emissions during
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE10343821A
Other languages
English (en)
Other versions
DE10343821B4 (de
Inventor
Oliver Schilling
Franz Auerbach
Reinhold Spanke
Christof Klos
Dirk Froebus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
EUPEC GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUPEC GmbH filed Critical EUPEC GmbH
Priority to DE10343821A priority Critical patent/DE10343821B4/de
Publication of DE10343821A1 publication Critical patent/DE10343821A1/de
Application granted granted Critical
Publication of DE10343821B4 publication Critical patent/DE10343821B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/706—Protective screens
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Die vorliegende Erfindung betrifft zwei Verfahren zum Anschweißen eines anzuschweißenden Elementes (20) an einer Schweißstelle (21) mittels eines Laserstrahls (50), wobei ein Bauelement (40) gegen an der Schweißstelle (21) gestreutes oder reflektiertes Laserlicht (51) unter Verwendung einer Abschirmvorrichtung (30) geschützt wird. Die Abschirmvorrichtung ist dabei entweder mit dem anzuschweißenden Element und/oder mit dem zu schützenden Bauelement (40) verbunden.
DE10343821A 2003-09-22 2003-09-22 Verfahren zur Abschirmung von Bauelementen beim Laserschweißen Expired - Fee Related DE10343821B4 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10343821A DE10343821B4 (de) 2003-09-22 2003-09-22 Verfahren zur Abschirmung von Bauelementen beim Laserschweißen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10343821A DE10343821B4 (de) 2003-09-22 2003-09-22 Verfahren zur Abschirmung von Bauelementen beim Laserschweißen

Publications (2)

Publication Number Publication Date
DE10343821A1 true DE10343821A1 (de) 2005-04-21
DE10343821B4 DE10343821B4 (de) 2006-05-18

Family

ID=34352992

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10343821A Expired - Fee Related DE10343821B4 (de) 2003-09-22 2003-09-22 Verfahren zur Abschirmung von Bauelementen beim Laserschweißen

Country Status (1)

Country Link
DE (1) DE10343821B4 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008028949A1 (de) * 2006-09-07 2008-03-13 Brose Fahrzeugteile Gmbh & Co. Kg Abschirmung von thermisch empfindlichen bauelementen beim laserbearbeiten
US8563364B2 (en) 2011-09-29 2013-10-22 Infineon Technologies Ag Method for producing a power semiconductor arrangement
US8586420B2 (en) 2011-09-29 2013-11-19 Infineon Technologies Ag Power semiconductor arrangement and method for producing a power semiconductor arrangement

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4691092A (en) * 1984-12-07 1987-09-01 Skf Industrial Trading And Development Company B.V. Method for welding two parts together employing a concentrated energy beam and protective member

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4691092A (en) * 1984-12-07 1987-09-01 Skf Industrial Trading And Development Company B.V. Method for welding two parts together employing a concentrated energy beam and protective member

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008028949A1 (de) * 2006-09-07 2008-03-13 Brose Fahrzeugteile Gmbh & Co. Kg Abschirmung von thermisch empfindlichen bauelementen beim laserbearbeiten
US8563364B2 (en) 2011-09-29 2013-10-22 Infineon Technologies Ag Method for producing a power semiconductor arrangement
US8586420B2 (en) 2011-09-29 2013-11-19 Infineon Technologies Ag Power semiconductor arrangement and method for producing a power semiconductor arrangement

Also Published As

Publication number Publication date
DE10343821B4 (de) 2006-05-18

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8327 Change in the person/name/address of the patent owner

Owner name: INFINEON TECHNOLOGIES AG, 81669 MUENCHEN, DE

8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: B23K0026420000

Ipc: B23K0026700000