DE10343821A1 - Verfahren zur Abschirmung von Bauelementen beim Laserschweißen - Google Patents
Verfahren zur Abschirmung von Bauelementen beim Laserschweißen Download PDFInfo
- Publication number
- DE10343821A1 DE10343821A1 DE10343821A DE10343821A DE10343821A1 DE 10343821 A1 DE10343821 A1 DE 10343821A1 DE 10343821 A DE10343821 A DE 10343821A DE 10343821 A DE10343821 A DE 10343821A DE 10343821 A1 DE10343821 A1 DE 10343821A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- screening
- welding
- components
- emissions during
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/706—Protective screens
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Die vorliegende Erfindung betrifft zwei Verfahren zum Anschweißen eines anzuschweißenden Elementes (20) an einer Schweißstelle (21) mittels eines Laserstrahls (50), wobei ein Bauelement (40) gegen an der Schweißstelle (21) gestreutes oder reflektiertes Laserlicht (51) unter Verwendung einer Abschirmvorrichtung (30) geschützt wird. Die Abschirmvorrichtung ist dabei entweder mit dem anzuschweißenden Element und/oder mit dem zu schützenden Bauelement (40) verbunden.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10343821A DE10343821B4 (de) | 2003-09-22 | 2003-09-22 | Verfahren zur Abschirmung von Bauelementen beim Laserschweißen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10343821A DE10343821B4 (de) | 2003-09-22 | 2003-09-22 | Verfahren zur Abschirmung von Bauelementen beim Laserschweißen |
Publications (2)
Publication Number | Publication Date |
---|---|
DE10343821A1 true DE10343821A1 (de) | 2005-04-21 |
DE10343821B4 DE10343821B4 (de) | 2006-05-18 |
Family
ID=34352992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10343821A Expired - Fee Related DE10343821B4 (de) | 2003-09-22 | 2003-09-22 | Verfahren zur Abschirmung von Bauelementen beim Laserschweißen |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE10343821B4 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008028949A1 (de) * | 2006-09-07 | 2008-03-13 | Brose Fahrzeugteile Gmbh & Co. Kg | Abschirmung von thermisch empfindlichen bauelementen beim laserbearbeiten |
US8563364B2 (en) | 2011-09-29 | 2013-10-22 | Infineon Technologies Ag | Method for producing a power semiconductor arrangement |
US8586420B2 (en) | 2011-09-29 | 2013-11-19 | Infineon Technologies Ag | Power semiconductor arrangement and method for producing a power semiconductor arrangement |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4691092A (en) * | 1984-12-07 | 1987-09-01 | Skf Industrial Trading And Development Company B.V. | Method for welding two parts together employing a concentrated energy beam and protective member |
-
2003
- 2003-09-22 DE DE10343821A patent/DE10343821B4/de not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4691092A (en) * | 1984-12-07 | 1987-09-01 | Skf Industrial Trading And Development Company B.V. | Method for welding two parts together employing a concentrated energy beam and protective member |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008028949A1 (de) * | 2006-09-07 | 2008-03-13 | Brose Fahrzeugteile Gmbh & Co. Kg | Abschirmung von thermisch empfindlichen bauelementen beim laserbearbeiten |
US8563364B2 (en) | 2011-09-29 | 2013-10-22 | Infineon Technologies Ag | Method for producing a power semiconductor arrangement |
US8586420B2 (en) | 2011-09-29 | 2013-11-19 | Infineon Technologies Ag | Power semiconductor arrangement and method for producing a power semiconductor arrangement |
Also Published As
Publication number | Publication date |
---|---|
DE10343821B4 (de) | 2006-05-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: INFINEON TECHNOLOGIES AG, 81669 MUENCHEN, DE |
|
8364 | No opposition during term of opposition | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee | ||
R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: B23K0026420000 Ipc: B23K0026700000 |