ES2131898T3 - Instalacion de recubrimiento por vacio con un crisol situado en la camara de vacio para el alojamiento de material a vaporizar. - Google Patents

Instalacion de recubrimiento por vacio con un crisol situado en la camara de vacio para el alojamiento de material a vaporizar.

Info

Publication number
ES2131898T3
ES2131898T3 ES96113894T ES96113894T ES2131898T3 ES 2131898 T3 ES2131898 T3 ES 2131898T3 ES 96113894 T ES96113894 T ES 96113894T ES 96113894 T ES96113894 T ES 96113894T ES 2131898 T3 ES2131898 T3 ES 2131898T3
Authority
ES
Spain
Prior art keywords
pot
vacuum
installation
vacuum chamber
lodging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96113894T
Other languages
English (en)
Inventor
Joachim Dr Szczyrbowski
Gotz Teschner
Alfons Zoller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balzers und Leybold Deutschland Holding AG
Original Assignee
Leybold AG
Balzers und Leybold Deutschland Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold AG, Balzers und Leybold Deutschland Holding AG filed Critical Leybold AG
Application granted granted Critical
Publication of ES2131898T3 publication Critical patent/ES2131898T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/31—Processing objects on a macro-scale
    • H01J2237/3132—Evaporating
    • H01J2237/3137—Plasma-assisted co-operation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

EN UNA INSTALACION DE RECUBRIMIENTO POR VACIO CON UN CRISOL (4) COLOCADO EN LA CAMARA DE VACIO (3) PARA EL MATERIAL QUE SE EVAPORA, POR EJEMPLO SIO{SUB,2}, Y CON UNA FUENTE DE RADIACION ELECTRONICA (5) QUE EVAPORA EL MATERIAL Y CON UNOS SUSTRATOS (7, 7{SUP,''}, ...) MANTENIDOS A DISTANCIA DEL CRISOL (4), POR EJEMPLO LENTES OPTICAS, SE DISPONE A AMBOS LADOS DE UNA LINEA DE UNION (L) ENTRE EL CRISOL (4) Y EL SOPORTE DE SUSTRATO (6) UNA UNIDAD (9, 10), EN LAS QUE SE DISPONE EN CADA UNO UN CATODO MAGNETRONICO (11, 12) UNIDO CON UNA FUENTE DE FRECUENCIA MEDIA (16), ESTANDO UNIDA CADA UNA DE LAS UNIDADES (9, 10) MEDIANTE UNA HENDIDURA, ORIFICIO O CANAL (21, 22 O 27, 28) CON LA ZONA O LUGAR DEL PROCESO (30) QUE ESTA ENTRE EL SUSTRATO (7, 7{SUP,''}, ...) Y EL CRISOL, ESTANDO AMBAS PIEZAS UNIDAS (9, 10) ENTRE SI (4), MEDIANTE CONDUCCIONES DE PRESION (19, 20) A UNA FUENTE (15) DEL GAS DEL PROCESO.
ES96113894T 1995-11-30 1996-08-30 Instalacion de recubrimiento por vacio con un crisol situado en la camara de vacio para el alojamiento de material a vaporizar. Expired - Lifetime ES2131898T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19544584A DE19544584A1 (de) 1995-11-30 1995-11-30 Vakuumbeschichtungsanlage mit einem in der Vakuumkammer angeordneten Tiegel zur Aufnahme von zu verdampfendem Material

Publications (1)

Publication Number Publication Date
ES2131898T3 true ES2131898T3 (es) 1999-08-01

Family

ID=7778762

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96113894T Expired - Lifetime ES2131898T3 (es) 1995-11-30 1996-08-30 Instalacion de recubrimiento por vacio con un crisol situado en la camara de vacio para el alojamiento de material a vaporizar.

Country Status (5)

Country Link
US (1) US5888305A (es)
EP (1) EP0776987B1 (es)
JP (1) JPH09176840A (es)
DE (2) DE19544584A1 (es)
ES (1) ES2131898T3 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0783174B1 (de) * 1995-10-27 2006-12-13 Applied Materials GmbH & Co. KG Vorrichtung zum Beschichten eines Substrats
SE520716C2 (sv) * 1999-05-06 2003-08-12 Sandvik Ab En process för tillverkning av ett skärverktyg belagt med aluminiumoxid
DE60234620D1 (de) * 2001-09-10 2010-01-14 Univ Virginia Verfahren zum aufbringen von metalllegierungsüberzügen und überzogene komponente
US20050092253A1 (en) * 2003-11-04 2005-05-05 Venkat Selvamanickam Tape-manufacturing system having extended operational capabilites
TWI486469B (zh) * 2010-04-22 2015-06-01 Hon Hai Prec Ind Co Ltd 鍍膜系統
TW201200614A (en) * 2010-06-29 2012-01-01 Hon Hai Prec Ind Co Ltd Coating device
CN102312200B (zh) * 2010-06-30 2014-04-23 鸿富锦精密工业（深圳）有限公司 蒸镀机
EP4379087A2 (en) 2013-03-15 2024-06-05 RTX Corporation Deposition apparatus and methods
EP3366804B1 (en) * 2017-02-22 2022-05-11 Satisloh AG Box coating apparatus for vacuum coating of substrates, in particular spectacle lenses

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4885070A (en) * 1988-02-12 1989-12-05 Leybold Aktiengesellschaft Method and apparatus for the application of materials
JPH01268869A (ja) * 1988-04-20 1989-10-26 Fuji Photo Film Co Ltd スパッタリング装置
DE4026367A1 (de) * 1990-06-25 1992-03-12 Leybold Ag Vorrichtung zum beschichten von substraten
DE4128547A1 (de) * 1991-08-28 1993-03-04 Leybold Ag Verfahren und vorrichtung fuer die herstellung einer entspiegelungsschicht auf linsen
US5415757A (en) * 1991-11-26 1995-05-16 Leybold Aktiengesellschaft Apparatus for coating a substrate with electrically nonconductive coatings
DE4203632C2 (de) * 1992-02-08 2003-01-23 Applied Films Gmbh & Co Kg Vakuumbeschichtungsanlage
EP0570618B1 (en) * 1992-05-21 1996-11-06 Nissin Electric Company, Limited Film forming method and apparatus
DE4237517A1 (de) * 1992-11-06 1994-05-11 Leybold Ag Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten
DE4416525B4 (de) * 1993-05-27 2008-06-05 Oerlikon Trading Ag, Trübbach Verfahren zur Herstellung einer Beschichtung erhöhter Verschleißfestigkeit auf Werkstückoberflächen, und dessen Verwendung
DE4343042C1 (de) * 1993-12-16 1995-03-09 Fraunhofer Ges Forschung Verfahren und Einrichtung zum plasmaaktivierten Bedampfen

Also Published As

Publication number Publication date
EP0776987A1 (de) 1997-06-04
DE59601991D1 (de) 1999-07-01
US5888305A (en) 1999-03-30
DE19544584A1 (de) 1997-06-05
JPH09176840A (ja) 1997-07-08
EP0776987B1 (de) 1999-05-26

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