ES2078761T3 - Procedimiento para el contactado pasante de placas conductoras de dos capas y de multicapas. - Google Patents
Procedimiento para el contactado pasante de placas conductoras de dos capas y de multicapas.Info
- Publication number
- ES2078761T3 ES2078761T3 ES93100647T ES93100647T ES2078761T3 ES 2078761 T3 ES2078761 T3 ES 2078761T3 ES 93100647 T ES93100647 T ES 93100647T ES 93100647 T ES93100647 T ES 93100647T ES 2078761 T3 ES2078761 T3 ES 2078761T3
- Authority
- ES
- Spain
- Prior art keywords
- conductive plates
- contact
- procedure
- layer
- multilayer conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000005553 drilling Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229920000123 polythiophene Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Abstract
PROCESO PARA LA FABRICACION DE PLACAS CONDUCTORAS DE CONTACTADO EN DOS CAPAS Y MULTICAPAS BAJO LA UTILIZACION DE POLITIOFENOS COMO EQUIPAMIENTO CONDUCTOR DEL AGUJERO DE TALADRADO PARA LA CONTACTACION GALVANICA DIRECTA Y LAS PLACAS CONDUCTORAS FABRICADAS DE ESTE MODO Y MULTIPLACAS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4202337A DE4202337A1 (de) | 1992-01-29 | 1992-01-29 | Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2078761T3 true ES2078761T3 (es) | 1995-12-16 |
Family
ID=6450433
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES93100647T Expired - Lifetime ES2078761T3 (es) | 1992-01-29 | 1993-01-18 | Procedimiento para el contactado pasante de placas conductoras de dos capas y de multicapas. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5403467A (es) |
EP (1) | EP0553671B1 (es) |
JP (1) | JP2609501B2 (es) |
AT (1) | ATE129845T1 (es) |
CA (1) | CA2088123C (es) |
DE (2) | DE4202337A1 (es) |
ES (1) | ES2078761T3 (es) |
Families Citing this family (81)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4227836C2 (de) † | 1992-08-20 | 1997-09-25 | Atotech Deutschland Gmbh | Verfahren zur Metallisierung von Nichtleitern |
US5415762A (en) * | 1993-08-18 | 1995-05-16 | Shipley Company Inc. | Electroplating process and composition |
DE4436391A1 (de) * | 1994-10-12 | 1996-04-18 | Bayer Ag | Verfahren zur direkten galvanischen Durchkontaktierung von zweilagigen Leiterplatten und Multilayern |
DE19527056C1 (de) * | 1995-07-25 | 1996-11-28 | Blasberg Oberflaechentech | Verfahren zur Herstellung von durchkontaktierten Leiterplatten oder Mehrlagenleiterplatten (Multilayer) |
DE19637018A1 (de) * | 1996-09-12 | 1998-03-19 | Bayer Ag | Verfahren zur Herstellung von starren und flexiblen Schaltungen |
JP3673357B2 (ja) * | 1997-01-27 | 2005-07-20 | メルテックス株式会社 | めっき用の前処理洗浄剤 |
DE19822075C2 (de) * | 1998-05-16 | 2002-03-21 | Enthone Gmbh | Verfahren zur metallischen Beschichtung von Substraten |
GB2338715B (en) * | 1998-06-24 | 2003-03-19 | Hang Fung Jewellery Co Ltd | A method of depositing a metal on an article |
US6190846B1 (en) | 1998-10-15 | 2001-02-20 | Eastman Kodak Company | Abrasion resistant antistatic with electrically conducting polymer for imaging element |
US6225039B1 (en) | 1998-10-15 | 2001-05-01 | Eastman Kodak Company | Imaging element containing an electrically-conductive layer containing a sulfonated polyurethane and a transparent magnetic recording layer |
US6096491A (en) * | 1998-10-15 | 2000-08-01 | Eastman Kodak Company | Antistatic layer for imaging element |
US6300049B2 (en) | 1998-10-15 | 2001-10-09 | Eastman Kodak Company | Imaging element containing an electrically-conductive layer |
US6124083A (en) * | 1998-10-15 | 2000-09-26 | Eastman Kodak Company | Antistatic layer with electrically conducting polymer for imaging element |
US6025119A (en) * | 1998-12-18 | 2000-02-15 | Eastman Kodak Company | Antistatic layer for imaging element |
DE19903108A1 (de) * | 1999-01-27 | 2000-08-03 | Bayer Ag | Verfahren zur direkten galvanischen Durchkontaktierung von Leiterplatten |
US6187522B1 (en) | 1999-03-25 | 2001-02-13 | Eastman Kodak Company | Scratch resistant antistatic layer for imaging elements |
US6077655A (en) * | 1999-03-25 | 2000-06-20 | Eastman Kodak Company | Antistatic layer for imaging element containing electrically conductive polymer and modified gelatin |
AU4562900A (en) | 1999-05-20 | 2000-12-12 | Bayer Aktiengesellschaft | Method of producing pi-conjugated polymers |
US6162596A (en) * | 1999-08-30 | 2000-12-19 | Eastman Kodak Company | Imaging elements containing an electrically-conductive layer comprising polythiophene and a cellulosic polymer binder |
EP1081546A1 (en) | 1999-08-30 | 2001-03-07 | Eastman Kodak Company | Coating composition containing electrically-conductive polymer and solvent mixture |
JP3498306B2 (ja) * | 1999-09-16 | 2004-02-16 | 石原薬品株式会社 | ボイドフリー銅メッキ方法 |
US6785739B1 (en) | 2000-02-23 | 2004-08-31 | Eastman Kodak Company | Data storage and retrieval playback apparatus for a still image receiver |
US20050045851A1 (en) * | 2003-08-15 | 2005-03-03 | Konarka Technologies, Inc. | Polymer catalyst for photovoltaic cell |
DE10058116A1 (de) | 2000-11-22 | 2002-05-23 | Bayer Ag | Polythiophene |
DE50115774D1 (de) * | 2000-11-22 | 2011-02-24 | Strack H C Clevios Gmbh | Dispergierbare polymerpulver |
US6692663B2 (en) * | 2001-02-16 | 2004-02-17 | Elecon, Inc. | Compositions produced by solvent exchange methods and uses thereof |
US6692662B2 (en) * | 2001-02-16 | 2004-02-17 | Elecon, Inc. | Compositions produced by solvent exchange methods and uses thereof |
DE10111790A1 (de) * | 2001-03-12 | 2002-09-26 | Bayer Ag | Neue Polythiophen-Dispersionen |
US6440654B1 (en) | 2001-04-03 | 2002-08-27 | Eastman Kodak Company | Photographic element containing an electrically-conductive layer |
DE10124631C1 (de) * | 2001-05-18 | 2002-11-21 | Atotech Deutschland Gmbh | Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen |
US20050029496A1 (en) * | 2001-06-26 | 2005-02-10 | Schwark Dwight W. | Coating composition containing polythiophene, film-forming binder, and solvent mixture |
US20040135126A1 (en) * | 2001-06-26 | 2004-07-15 | Schwark Dwight W. | Coating composition containing polythiophene and solvent mixture |
US20030141487A1 (en) * | 2001-12-26 | 2003-07-31 | Eastman Kodak Company | Composition containing electronically conductive polymer particles |
US6800429B2 (en) | 2001-12-26 | 2004-10-05 | Eastman Kodak Company | Imaging materials with conductive layers containing electronically conductive polymer particles |
US7163746B2 (en) | 2002-06-12 | 2007-01-16 | Eastman Kodak Company | Conductive polymers on acicular substrates |
JP4239560B2 (ja) * | 2002-08-02 | 2009-03-18 | セイコーエプソン株式会社 | 組成物とこれを用いた有機導電性膜の製造方法 |
US7195036B2 (en) * | 2002-11-04 | 2007-03-27 | The Regents Of The University Of Michigan | Thermal micro-valves for micro-integrated devices |
US7051429B2 (en) * | 2003-04-11 | 2006-05-30 | Eastman Kodak Company | Method for forming a medium having data storage and communication capabilities |
US7508650B1 (en) | 2003-06-03 | 2009-03-24 | More Energy Ltd. | Electrode for electrochemical capacitor |
WO2005018808A1 (en) * | 2003-08-15 | 2005-03-03 | Konarka Technologies, Inc. | Polymer catalyst for photovoltaic cell |
US7163734B2 (en) * | 2003-08-26 | 2007-01-16 | Eastman Kodak Company | Patterning of electrically conductive layers by ink printing methods |
US7033713B2 (en) * | 2003-08-26 | 2006-04-25 | Eastman Kodak | Electrographic patterning of conductive electrode layers containing electrically-conductive polymeric materials |
US6893790B2 (en) | 2003-08-26 | 2005-05-17 | Eastman Kodak Company | Photopatterning of conductive electrode layers containing electrically-conductive polymer particles |
US7145464B2 (en) * | 2003-11-19 | 2006-12-05 | Eastman Kodak Company | Data collection device |
US7109986B2 (en) * | 2003-11-19 | 2006-09-19 | Eastman Kodak Company | Illumination apparatus |
US7009494B2 (en) * | 2003-11-21 | 2006-03-07 | Eastman Kodak Company | Media holder having communication capabilities |
DE102004014645A1 (de) * | 2004-03-25 | 2005-10-13 | Mitsubishi Polyester Film Gmbh | Transparente, elektrisch leitfähige, beschichtete Polyesterfolie, Verfahren zu ihrer Herstellung sowie ihre Verwendung |
US20060062983A1 (en) * | 2004-09-17 | 2006-03-23 | Irvin Glen C Jr | Coatable conductive polyethylenedioxythiophene with carbon nanotubes |
US7427441B2 (en) * | 2004-09-17 | 2008-09-23 | Eastman Kodak Co | Transparent polymeric coated conductor |
US7781047B2 (en) * | 2004-10-21 | 2010-08-24 | Eastman Kodak Company | Polymeric conductor donor and transfer method |
US20060147616A1 (en) * | 2004-12-20 | 2006-07-06 | Russell Gaudiana | Polymer catalyst for photovoltaic cell |
US7414313B2 (en) * | 2004-12-22 | 2008-08-19 | Eastman Kodak Company | Polymeric conductor donor and transfer method |
US7630029B2 (en) * | 2005-02-16 | 2009-12-08 | Industrial Technology Research Institute | Conductive absorption layer for flexible displays |
US7557875B2 (en) * | 2005-03-22 | 2009-07-07 | Industrial Technology Research Institute | High performance flexible display with improved mechanical properties having electrically modulated material mixed with binder material in a ratio between 6:1 and 0.5:1 |
US7438832B2 (en) * | 2005-03-29 | 2008-10-21 | Eastman Kodak Company | Ionic liquid and electronically conductive polymer mixtures |
US7564528B2 (en) * | 2005-05-20 | 2009-07-21 | Industrial Technology Research Institute | Conductive layer to reduce drive voltage in displays |
US7645497B2 (en) * | 2005-06-02 | 2010-01-12 | Eastman Kodak Company | Multi-layer conductor with carbon nanotubes |
US7535462B2 (en) * | 2005-06-02 | 2009-05-19 | Eastman Kodak Company | Touchscreen with one carbon nanotube conductive layer |
US7593004B2 (en) * | 2005-06-02 | 2009-09-22 | Eastman Kodak Company | Touchscreen with conductive layer comprising carbon nanotubes |
US7410825B2 (en) * | 2005-09-15 | 2008-08-12 | Eastman Kodak Company | Metal and electronically conductive polymer transfer |
US20080007518A1 (en) * | 2006-06-23 | 2008-01-10 | Debasis Majumdar | Conductive polymer coating with improved aging stability |
WO2008009475A2 (en) * | 2006-07-20 | 2008-01-24 | Henkel Loctite Adhesives Ltd. | Solder flux |
ATE549437T1 (de) * | 2006-09-07 | 2012-03-15 | Enthone | Abscheidung eines leitfähigen polymers und metallisierung eines nicht-leitenden substrats |
TWI410530B (zh) * | 2006-09-07 | 2013-10-01 | Enthone | 導電聚合物的沈積與非導電基板的金屬化 |
US20080264682A1 (en) * | 2007-04-24 | 2008-10-30 | John Catron | Substrate and negative imaging method for providing transparent conducting patterns |
WO2008141981A1 (en) | 2007-05-18 | 2008-11-27 | Essilor International (Compagnie Generale D'optique) | Curable coating compositions providing antistatic abrasion resistant coated articles |
US8357858B2 (en) | 2008-11-12 | 2013-01-22 | Simon Fraser University | Electrically conductive, thermosetting elastomeric material and uses therefor |
US20110248223A1 (en) | 2008-12-31 | 2011-10-13 | Essilor International (Compagnie Generale D'optique) | Additives for Enhancing the Antistatic Properties of Conductive Polymer-Based Coatings |
US8258078B2 (en) | 2009-08-27 | 2012-09-04 | Eastman Kodak Company | Image receiver elements |
TWI397614B (zh) * | 2009-12-22 | 2013-06-01 | Zhen Ding Technology Co Ltd | 電鍍治具 |
ES2662039T3 (es) | 2010-10-29 | 2018-04-05 | Macdermid Enthone Inc. | Composición y método para la deposición de polímeros conductores en sustratos dieléctricos |
US8628840B2 (en) | 2011-06-29 | 2014-01-14 | Eastman Kodak Company | Electronically conductive laminate donor element |
US8865298B2 (en) | 2011-06-29 | 2014-10-21 | Eastman Kodak Company | Article with metal grid composite and methods of preparing |
US9017927B2 (en) | 2013-02-25 | 2015-04-28 | Eastman Kodak Company | Patterning of transparent conductive coatings |
US8709194B1 (en) | 2013-02-25 | 2014-04-29 | Eastman Kodak Company | Assembling an electrode device |
CN104284527A (zh) * | 2013-07-01 | 2015-01-14 | 深圳市环基实业有限公司 | 印刷电路板及其制作方法 |
DE102013218755B4 (de) | 2013-09-18 | 2020-10-29 | Bundesdruckerei Gmbh | Wert- oder Sicherheitsprodukt mit mindestens einer innenliegenden elektrischen Schaltung |
JP6406841B2 (ja) * | 2014-03-24 | 2018-10-17 | アトテック・ドイチュラント・ゲーエムベーハーAtotech Deutschland Gmbh | 金属層形成方法およびプリント回路基板製造方法 |
EP3037497A1 (en) | 2014-12-23 | 2016-06-29 | Heraeus Deutschland GmbH & Co. KG | Process for producing functionalized polythiophenes |
CA2974312A1 (en) | 2015-01-20 | 2016-07-28 | Macdermid Enthone Inc. | Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrates |
CN107447241A (zh) * | 2017-07-27 | 2017-12-08 | 苏州天承化工有限公司 | 一种环保型高分子导电膜的活化液及活化工艺 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE68918085T2 (de) * | 1988-03-03 | 1995-01-26 | Blasberg Oberflaechentech | Gedruckte schaltplatte mit metallisierten löchern und deren herstellung. |
DE3843412A1 (de) * | 1988-04-22 | 1990-06-28 | Bayer Ag | Neue polythiophene, verfahren zu ihrer herstellung und ihre verwendung |
DE3927440A1 (de) * | 1989-08-16 | 1991-02-28 | Schering Ag | Verfahren zur direkten metallisierung eines nicht leitenden substrats |
DE3939676C2 (de) * | 1989-11-28 | 1994-01-27 | Schering Ag | Metallisierung von Nichtleitern |
-
1992
- 1992-01-29 DE DE4202337A patent/DE4202337A1/de not_active Withdrawn
-
1993
- 1993-01-18 ES ES93100647T patent/ES2078761T3/es not_active Expired - Lifetime
- 1993-01-18 DE DE59300832T patent/DE59300832D1/de not_active Expired - Lifetime
- 1993-01-18 AT AT93100647T patent/ATE129845T1/de active
- 1993-01-18 EP EP93100647A patent/EP0553671B1/de not_active Expired - Lifetime
- 1993-01-19 US US08/005,779 patent/US5403467A/en not_active Expired - Lifetime
- 1993-01-22 JP JP5025967A patent/JP2609501B2/ja not_active Expired - Lifetime
- 1993-01-26 CA CA002088123A patent/CA2088123C/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE59300832D1 (de) | 1995-12-07 |
EP0553671B1 (de) | 1995-11-02 |
JP2609501B2 (ja) | 1997-05-14 |
CA2088123C (en) | 2003-11-11 |
ATE129845T1 (de) | 1995-11-15 |
US5403467A (en) | 1995-04-04 |
CA2088123A1 (en) | 1993-07-30 |
JPH05275851A (ja) | 1993-10-22 |
DE4202337A1 (de) | 1993-08-05 |
EP0553671A1 (de) | 1993-08-04 |
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