GB2338715B - A method of depositing a metal on an article - Google Patents
A method of depositing a metal on an articleInfo
- Publication number
- GB2338715B GB2338715B GB9813671A GB9813671A GB2338715B GB 2338715 B GB2338715 B GB 2338715B GB 9813671 A GB9813671 A GB 9813671A GB 9813671 A GB9813671 A GB 9813671A GB 2338715 B GB2338715 B GB 2338715B
- Authority
- GB
- United Kingdom
- Prior art keywords
- depositing
- article
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- A—HUMAN NECESSITIES
- A44—HABERDASHERY; JEWELLERY
- A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
- A44C27/00—Making jewellery or other personal adornments
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/005—Jewels; Clockworks; Coins
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9813671A GB2338715B (en) | 1998-06-24 | 1998-06-24 | A method of depositing a metal on an article |
HK00103979A HK1026928A1 (en) | 1998-06-24 | 2000-06-29 | A method of depositing a metal on an article |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9813671A GB2338715B (en) | 1998-06-24 | 1998-06-24 | A method of depositing a metal on an article |
Publications (4)
Publication Number | Publication Date |
---|---|
GB9813671D0 GB9813671D0 (en) | 1998-08-26 |
GB2338715A GB2338715A (en) | 1999-12-29 |
GB2338715A8 GB2338715A8 (en) | 2001-04-23 |
GB2338715B true GB2338715B (en) | 2003-03-19 |
Family
ID=10834328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9813671A Expired - Fee Related GB2338715B (en) | 1998-06-24 | 1998-06-24 | A method of depositing a metal on an article |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB2338715B (en) |
HK (1) | HK1026928A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1396670B1 (en) * | 2009-03-02 | 2012-12-14 | Aura S R L L | DEVICE FOR IMPROVING THE PHYSICAL PERFORMANCE AND THE ABILITY TO MAINTAIN THE BALANCE OF AN INDIVIDUAL, AND A RELATIVE MANUFACTURING METHOD |
WO2012041382A1 (en) * | 2010-09-30 | 2012-04-05 | Beat Schild-Kessler | Jewelry object and arrangement of a jewelry object and a remaining piece |
CN108468073A (en) * | 2018-06-22 | 2018-08-31 | 成都高赛尔股份有限公司 | A kind of method of spherical surface plating noble metal |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2847370A (en) * | 1956-09-18 | 1958-08-12 | Chas D Briddell Inc | Method of ornamentation |
US4683036A (en) * | 1983-06-10 | 1987-07-28 | Kollmorgen Technologies Corporation | Method for electroplating non-metallic surfaces |
GB2260790A (en) * | 1991-10-23 | 1993-04-28 | Glacier Metal Co Ltd | Making bearings |
US5328588A (en) * | 1993-03-19 | 1994-07-12 | Samuel Hopkins | Method of inlaying metals in non-conductive materials |
GB2274853A (en) * | 1993-01-29 | 1994-08-10 | Mec Co Ltd | Process for electroplating nonconductive surface e.g through holes in print wiring board |
GB2277745A (en) * | 1993-04-20 | 1994-11-09 | Enthone Omi | Post activator solution for use in electroplating non-conductive substrates e.g in plating through holes in PCB,s |
US5403467A (en) * | 1992-01-29 | 1995-04-04 | Bayer Ag | Process for through-hole plating of two-layer circuit boards and multilayers |
US5681441A (en) * | 1992-12-22 | 1997-10-28 | Elf Technologies, Inc. | Method for electroplating a substrate containing an electroplateable pattern |
-
1998
- 1998-06-24 GB GB9813671A patent/GB2338715B/en not_active Expired - Fee Related
-
2000
- 2000-06-29 HK HK00103979A patent/HK1026928A1/en not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2847370A (en) * | 1956-09-18 | 1958-08-12 | Chas D Briddell Inc | Method of ornamentation |
US4683036A (en) * | 1983-06-10 | 1987-07-28 | Kollmorgen Technologies Corporation | Method for electroplating non-metallic surfaces |
GB2260790A (en) * | 1991-10-23 | 1993-04-28 | Glacier Metal Co Ltd | Making bearings |
US5403467A (en) * | 1992-01-29 | 1995-04-04 | Bayer Ag | Process for through-hole plating of two-layer circuit boards and multilayers |
US5681441A (en) * | 1992-12-22 | 1997-10-28 | Elf Technologies, Inc. | Method for electroplating a substrate containing an electroplateable pattern |
GB2274853A (en) * | 1993-01-29 | 1994-08-10 | Mec Co Ltd | Process for electroplating nonconductive surface e.g through holes in print wiring board |
US5328588A (en) * | 1993-03-19 | 1994-07-12 | Samuel Hopkins | Method of inlaying metals in non-conductive materials |
GB2277745A (en) * | 1993-04-20 | 1994-11-09 | Enthone Omi | Post activator solution for use in electroplating non-conductive substrates e.g in plating through holes in PCB,s |
Also Published As
Publication number | Publication date |
---|---|
HK1026928A1 (en) | 2000-12-29 |
GB9813671D0 (en) | 1998-08-26 |
GB2338715A8 (en) | 2001-04-23 |
GB2338715A (en) | 1999-12-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20090624 |