ES2047691T3 - Procedimiento de realizacion de una tarjeta de memoria electronica y tarjeta de memoria electronica obtenida por la realizacion de dicho procedimiento. - Google Patents

Procedimiento de realizacion de una tarjeta de memoria electronica y tarjeta de memoria electronica obtenida por la realizacion de dicho procedimiento.

Info

Publication number
ES2047691T3
ES2047691T3 ES89401407T ES89401407T ES2047691T3 ES 2047691 T3 ES2047691 T3 ES 2047691T3 ES 89401407 T ES89401407 T ES 89401407T ES 89401407 T ES89401407 T ES 89401407T ES 2047691 T3 ES2047691 T3 ES 2047691T3
Authority
ES
Spain
Prior art keywords
procedure
carrying
electronic memory
memory card
band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES89401407T
Other languages
English (en)
Other versions
ES2047691T5 (es
Inventor
Rene Rose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schlumberger SA
Original Assignee
Schlumberger SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9366579&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2047691(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Schlumberger SA filed Critical Schlumberger SA
Publication of ES2047691T3 publication Critical patent/ES2047691T3/es
Application granted granted Critical
Publication of ES2047691T5 publication Critical patent/ES2047691T5/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

PROCEDIMENTO PARA LA REALIZACION DE UNA TARJETA CON MEMORIA ELECTRONICA Y MAS PARTICULARMENTE DE UN MODULO ELECTRONICO. SE PARTE DE UNA BANDA METALICA (10) EN LA CUAL ESTAN DEFINIDOS UNA PLURALIDAD DE CUADROS CONDUCTORES (A). SE FIJA SOBRE LA CARA EXTERNA (10A) DE LA BANDA (10) UNA BANDA AISLANTE (50) QUE DEJA DESPRENDIDOS LOS ESPACIOS EXTERNOS (20A HASTA 34A) DEL MODULO ELECTRONICO. EN LAS ETAPAS SIGUIENTES SE FIJA LA PASTILLA SEMICONDUCTORA SOBRE LA CARA INTERNA DEL CUADRO CONDUCTOR Y SE SEPARA, POR CORTE, EL CUADRO CONDUCTOR (A) DEL RESTO DE LA BANDA (10).
ES89401407T 1988-05-25 1989-05-24 Procedimiento de realizacion de una tarjeta de memoria electronica y tarjeta de memoria electronica obtenida por la realizacion de dicho procedimiento. Expired - Lifetime ES2047691T5 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8806921A FR2632100B1 (fr) 1988-05-25 1988-05-25 Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede

Publications (2)

Publication Number Publication Date
ES2047691T3 true ES2047691T3 (es) 1994-03-01
ES2047691T5 ES2047691T5 (es) 1998-01-16

Family

ID=9366579

Family Applications (1)

Application Number Title Priority Date Filing Date
ES89401407T Expired - Lifetime ES2047691T5 (es) 1988-05-25 1989-05-24 Procedimiento de realizacion de una tarjeta de memoria electronica y tarjeta de memoria electronica obtenida por la realizacion de dicho procedimiento.

Country Status (6)

Country Link
US (1) US5005282A (es)
EP (1) EP0344058B2 (es)
JP (1) JP2824275B2 (es)
DE (1) DE68910385T3 (es)
ES (1) ES2047691T5 (es)
FR (1) FR2632100B1 (es)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2650530B1 (fr) * 1989-08-07 1991-11-29 Schlumberger Ind Sa Procede de realisation de corps de carte avec graphisme
JP2560895B2 (ja) * 1990-07-25 1996-12-04 三菱電機株式会社 Ｉｃカードの製造方法およびｉｃカード
FR2674052A1 (fr) * 1991-03-15 1992-09-18 Philips Composants Carte a microcircuit.
FR2684471B1 (fr) * 1991-12-02 1994-03-04 Solaic Procede de fabrication d'une carte a memoire et carte a memoire ainsi obtenue.
DE4209184C1 (es) * 1992-03-21 1993-05-19 Orga Kartensysteme Gmbh, 6072 Dreieich, De
DE4344297A1 (de) * 1993-12-23 1995-06-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Ausweiskarten
FR2714534B1 (fr) * 1993-12-27 1996-02-02 Pontarlier Connectors Bande de contacts et connecteur pour carte la comprenant.
US5917705A (en) * 1994-04-27 1999-06-29 Siemens Aktiengesellschaft Chip card
WO1995029460A1 (de) * 1994-04-27 1995-11-02 Siemens Aktiengesellschaft Chipkarte
DE4441931C1 (de) * 1994-04-27 1995-07-27 Siemens Ag Chipkarte
DE4427309C2 (de) * 1994-08-02 1999-12-02 Ibm Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul
DE19502157B4 (de) * 1995-01-25 2011-07-21 Sagem Orga GmbH, 33106 Trägerelement für einen IC-Baustein zum Einbau in Chipkarten
DE19512725C1 (de) * 1995-04-05 1996-09-12 Orga Kartensysteme Gmbh Ausweiskarte o.dgl. in Form einer Chipkarte
FR2738077B1 (fr) * 1995-08-23 1997-09-19 Schlumberger Ind Sa Micro-boitier electronique pour carte a memoire electronique et procede de realisation
JPH09327990A (ja) * 1996-06-11 1997-12-22 Toshiba Corp カード型記憶装置
US6054648A (en) * 1998-01-28 2000-04-25 Rohm Co., Ltd. Shield case for a semiconductor optical device
JP2002500794A (ja) 1998-03-27 2002-01-08 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 金属リードフレームを主体とする差し込みモジュールを有するデータ媒体
FR2778769B1 (fr) * 1998-05-15 2001-11-02 Gemplus Sca Carte a circuit integre comportant un bornier d'interface et procede de fabrication d'une telle carte
FR2779851B1 (fr) * 1998-06-12 2002-11-29 Gemplus Card Int Procede de fabrication d'une carte a circuit integre et carte obtenue
FR2781068B1 (fr) * 1998-07-07 2000-10-13 Rue Cartes Et Systemes De Procede de fabrication d'une carte a microcircuit permettant de limiter les contraintes mecaniques transmises a celui-ci et carte ainsi obtenue
FR2793330B1 (fr) * 1999-05-06 2001-08-10 Oberthur Card Systems Sas Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue
FR2794265B1 (fr) 1999-05-25 2003-09-19 Gemplus Card Int Procede de fabrication de cartes a puce a contact avec dielectrique bas cout
US7245005B2 (en) * 2001-05-17 2007-07-17 Nxp B.V. Lead-frame configuration for chips
WO2004036648A2 (en) * 2002-10-15 2004-04-29 Axalto Sa Method of manufacturing a data carrier
CN100533473C (zh) * 2002-11-12 2009-08-26 Nxp股份有限公司 具有带有加固条的模块的数据载体
US20080149730A1 (en) * 2003-08-05 2008-06-26 Koninklijke Philips Electronics N.V. Module With At Least Two Pairs of Module Connecting Plates
US7785932B2 (en) * 2005-02-01 2010-08-31 Nagraid S.A. Placement method of an electronic module on a substrate and device produced by said method
US8119458B2 (en) * 2005-02-01 2012-02-21 Nagraid S.A. Placement method of an electronic module on a substrate
TWI269414B (en) * 2005-06-20 2006-12-21 Via Tech Inc Package substrate with improved structure for thermal dissipation and electronic device using the same
EP1796024A1 (en) * 2005-12-08 2007-06-13 Assa Abloy Identification Technology Group AB Method for the connection of a printed antenna with a RFID module and unit produced by said method
DE102006053922A1 (de) * 2006-11-15 2008-05-29 Infineon Technologies Ag Modul mit Trägerelement
FR2963458B1 (fr) * 2010-07-28 2012-08-31 Oberthur Technologies Procede d'encartage d'un microcircuit dans un corps de carte pour former une carte a microcircuit resistant a la compression
FR2968431B1 (fr) * 2010-12-06 2012-12-28 Oberthur Technologies Procédé de fabrication d'un dispositif a microcircuit

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2439478A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres
JPS5626457A (en) * 1979-08-11 1981-03-14 Daido Steel Co Ltd Connecting method for conductive terminal
JPS6056309B2 (ja) * 1980-11-14 1985-12-09 松下電子工業株式会社 リ−ドフレ−ムおよびその製造方法
US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
JPS60239043A (ja) * 1984-05-14 1985-11-27 Oki Electric Ind Co Ltd 半導体装置用パツケ−ジの製造方法
FR2579798B1 (fr) * 1985-04-02 1990-09-28 Ebauchesfabrik Eta Ag Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
FR2584862B1 (fr) * 1985-07-12 1988-05-20 Eurotechnique Sa Procede de fabrication en continu de micromodules pour cartes contenant des composants, bande continue de micromodules et micromodules realises selon un tel procede
US4722137A (en) * 1986-02-05 1988-02-02 Hewlett-Packard Company High frequency hermetically sealed package for solid-state components
US4996411A (en) * 1986-07-24 1991-02-26 Schlumberger Industries Method of manufacturing a card having electronic memory and a card obtained by performing said method
JPH0815829B2 (ja) * 1987-11-27 1996-02-21 松下電器産業株式会社 Ｉｃカード用モジュールの製造方法

Also Published As

Publication number Publication date
JPH0264889A (ja) 1990-03-05
EP0344058B2 (fr) 1997-08-13
US5005282A (en) 1991-04-09
ES2047691T5 (es) 1998-01-16
JP2824275B2 (ja) 1998-11-11
FR2632100A1 (fr) 1989-12-01
DE68910385D1 (de) 1993-12-09
EP0344058A1 (fr) 1989-11-29
DE68910385T3 (de) 1998-03-19
FR2632100B1 (fr) 1992-02-21
DE68910385T2 (de) 1994-05-19
EP0344058B1 (fr) 1993-11-03

Similar Documents

Publication Publication Date Title
ES2047691T5 (es) Procedimiento de realizacion de una tarjeta de memoria electronica y tarjeta de memoria electronica obtenida por la realizacion de dicho procedimiento.
DE68918442D1 (de) Flüssig gekühltes integriertes multichip-schaltungsmodul.
IL35503A0 (en) An electrical socket and an insulating carrier for an integrated circuit module
ES369959A1 (es) Un dispositivo semiconductor.
KR900019207A (ko) 수지밀봉형 반도체장치
DE3575364D1 (de) Elektrischer kontakt in halbleiteranordnungen.
DE59504352D1 (de) Schaltungsanordnung mit einem chipkartenmodul und einer damit verbundenen spule
DE68921441T2 (de) Abtrennung von elektrischen Schaltungskarten von Stromversorgungseinheiten.
IT8121777A0 (it) Procedimento per realizzare il contatto di contatti galvanici di una scheda di riconosciumento con modulo a circuito integrato incorporato.
ES2155489T3 (es) Lector de tarjetas inteligentes.
GB1515160A (en) Electrically integrated circuit package protectors
GB1209901A (en) Improvements relating to the mounting of integrated circuit assemblies
DE3381460D1 (de) Integrierte halbleiterschaltungsanordnung.
ES557668A0 (es) Un dispositivo para proteger un circuito electrico de una transitoria de tension.
MX173485B (es) Microfusible con caracteristicas variables de tiempo-corriente
JPS55115339A (en) Ic stem
GB1518397A (en) Light emitting diode mounting
GB1553133A (en) Electrical dual-inline circuit package
ES2078498T3 (es) Un dispositivo electronico incluyendo un circuito integrado montado sobre una base aislante.
KR920002981Y1 (ko) Ic 소자
JPS5369047A (en) Light conbining and separating circuit utilizing light banding conductor
JPS58201349A (ja) 集積回路の放熱方法
DE69011387T2 (de) Elektrischer Schutzschalter.
GB1227529A (es)
IT8319228A0 (it) Piastra di separazione elettrica per disposizioni di sicurezza di grande potenza e bassa tensione.

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 344058

Country of ref document: ES