ES2030190T3 - Procedimiento para la realizacion de un conjunto de motivos electricamente conductores sobre una superficie aislante de forma compleja. - Google Patents

Procedimiento para la realizacion de un conjunto de motivos electricamente conductores sobre una superficie aislante de forma compleja.

Info

Publication number
ES2030190T3
ES2030190T3 ES198888402098T ES88402098T ES2030190T3 ES 2030190 T3 ES2030190 T3 ES 2030190T3 ES 198888402098 T ES198888402098 T ES 198888402098T ES 88402098 T ES88402098 T ES 88402098T ES 2030190 T3 ES2030190 T3 ES 2030190T3
Authority
ES
Spain
Prior art keywords
realization
reasons
complexly
procedure
electrically conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198888402098T
Other languages
English (en)
Inventor
Jean-Pierre Clariou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Airbus Group SAS
Original Assignee
Airbus Group SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Airbus Group SAS filed Critical Airbus Group SAS
Application granted granted Critical
Publication of ES2030190T3 publication Critical patent/ES2030190T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/14—Reflecting surfaces; Equivalent structures
    • H01Q15/141—Apparatus or processes specially adapted for manufacturing reflecting surfaces
    • H01Q15/142—Apparatus or processes specially adapted for manufacturing reflecting surfaces using insulating material for supporting the reflecting surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0376—Etching temporary metallic carrier substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Aerials With Secondary Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)

Abstract

EL PRESENTE INVENTO SE REFIERE A UN PROCEDIMIENTO PARA LA REALIZACION DE UN CONJUNTO DE MOTIVOS (9,16) ELECTRICAMENTE CONDUCTORES SOBRE UNA SUPERFICIE ELECTRICAMENTE AISLANTE (20) DE FORMA COMPLEJA. SEGUN EL INVENTO, SE FORMA EL MENCIONADO CONJUNTO DE MOTIVOS (16) SOBRE UNA CARA DE UN SOPORTE PLANO PLASTICAMENTE DEFORMABLE (10); SE APLICA DICHO SOPORTE PLANO (10), DEFORMANDOLO, CONTRA LA SUPERFICIE (20) DE FORMA COMPLEJA; Y SE SOLIDARIZA EL SOPORTE PLANO DEFORMADO DE LA SUPERFICIE (20) DE FORMA COMPLEJA. APLICACION, PREFERENTEMENTE, EN LA REALIZACION DE REFLECTORES PARA ANTENAS
ES198888402098T 1987-08-24 1988-08-11 Procedimiento para la realizacion de un conjunto de motivos electricamente conductores sobre una superficie aislante de forma compleja. Expired - Lifetime ES2030190T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8711851A FR2619984B1 (fr) 1987-08-24 1987-08-24 Procede de realisation de circuits imprimes presentant des surfaces complexes a priori non developpables

Publications (1)

Publication Number Publication Date
ES2030190T3 true ES2030190T3 (es) 1992-10-16

Family

ID=9354380

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198888402098T Expired - Lifetime ES2030190T3 (es) 1987-08-24 1988-08-11 Procedimiento para la realizacion de un conjunto de motivos electricamente conductores sobre una superficie aislante de forma compleja.

Country Status (8)

Country Link
US (1) US4937935A (es)
EP (1) EP0305267B1 (es)
JP (1) JP2714414B2 (es)
CA (1) CA1310175C (es)
DE (1) DE3868786D1 (es)
ES (1) ES2030190T3 (es)
FR (1) FR2619984B1 (es)
WO (1) WO1989002213A1 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2648305B1 (fr) * 1989-06-07 1993-03-26 Peugeot Procede de fabrication d'un boitier pour circuit electronique et boitier pour circuit electronique obtenu selon ce procede, notamment pour vehicule automobile
JPH03209769A (ja) * 1990-01-11 1991-09-12 Mitsubishi Electric Corp 赤外線イメージセンサ
US5437091A (en) * 1993-06-28 1995-08-01 Honeywell Inc. High curvature antenna forming process
JPH09139619A (ja) * 1995-11-16 1997-05-27 Toshiba Corp 曲面形状基板の製造方法及びその製造装置
DE19713735C1 (de) * 1997-04-03 1998-08-20 Daimler Benz Aerospace Ag Verfahren zur Herstellung von polarisationsselektiven Reflektoren
US6892441B2 (en) * 2001-04-23 2005-05-17 Appleton Papers Inc. Method for forming electrically conductive pathways
US6779246B2 (en) * 2001-04-23 2004-08-24 Appleton Papers Inc. Method and system for forming RF reflective pathways
DE102011102484B4 (de) * 2011-05-24 2020-03-05 Jumatech Gmbh Leiterplatte mit Formteil und Verfahren zu dessen Herstellung

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2724674A (en) * 1952-11-26 1955-11-22 Pritikin Nathan Printed circuit and method for producing the same
US2874085A (en) * 1953-10-27 1959-02-17 Northern Engraving & Mfg Co Method of making printed circuits
US2910351A (en) * 1955-01-03 1959-10-27 Gen Electric Method of making printed circuit
US3024151A (en) * 1957-09-30 1962-03-06 Automated Circuits Inc Printed electrical circuits and method of making the same
FR1306698A (fr) * 1961-09-04 1962-10-19 Electronique & Automatisme Sa Procédé de réalisation de circuits électriques du genre dit
US3279969A (en) * 1962-11-29 1966-10-18 Amphenol Corp Method of making electronic circuit elements
US3757087A (en) * 1970-09-11 1973-09-04 Smiths Industries Ltd Heating elements
US3832176A (en) * 1973-04-06 1974-08-27 Eastman Kodak Co Novel photoresist article and process for its use
JPS5341978B2 (es) * 1973-05-02 1978-11-08
GB1475031A (en) * 1975-01-18 1977-06-01 Marconi Co Ltd Curved rigid printed circuit boards
JPS53114074A (en) * 1977-03-15 1978-10-05 Matsushita Electric Works Ltd Method of producing board
JPS53124761A (en) * 1977-04-07 1978-10-31 Citizen Watch Co Ltd Method of forming basic pattern for watch circuits
JPS5541722A (en) * 1978-09-14 1980-03-24 Sanyo Electric Co Method of forming conductive path
JPS5827677B2 (ja) * 1978-12-19 1983-06-10 ソニー株式会社 凹凸を有する基板への微細パタ−ンの形成方法
JPS5816594A (ja) * 1981-07-22 1983-01-31 共立工業株式会社 プリント配線板の製造法
JPS58137291A (ja) * 1982-02-09 1983-08-15 塩尻工業株式会社 プリント配線板の製造方法
US4499152A (en) * 1982-08-09 1985-02-12 General Electric Company Metal-clad laminate construction
JPS60170291A (ja) * 1984-02-15 1985-09-03 ソニー株式会社 回路配線基板
JPS60198799A (ja) * 1984-03-23 1985-10-08 株式会社日立製作所 プリント基板の製造方法
JPS6134992A (ja) * 1984-07-25 1986-02-19 松下電工株式会社 厚膜回路形成法
JPS62128591A (ja) * 1985-11-29 1987-06-10 凸版印刷株式会社 表面にプリント配線を設けた立体成形品
US4697335A (en) * 1986-03-31 1987-10-06 Hy-Meg Corporation Method of manufacturing a film-type electronic device
JPS63177497A (ja) * 1987-01-16 1988-07-21 大日本印刷株式会社 印刷回路を有する成形品およびその製造方法

Also Published As

Publication number Publication date
EP0305267B1 (fr) 1992-03-04
EP0305267A1 (fr) 1989-03-01
US4937935A (en) 1990-07-03
DE3868786D1 (de) 1992-04-09
JP2714414B2 (ja) 1998-02-16
FR2619984A1 (fr) 1989-03-03
CA1310175C (fr) 1992-11-17
FR2619984B1 (fr) 1996-03-01
JPH02500629A (ja) 1990-03-01
WO1989002213A1 (fr) 1989-03-09

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