Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67017—Apparatus for fluid treatment
  • H01L21/67063—Apparatus for fluid treatment for etching
  • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
  • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
  • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02041—Cleaning
  • H01L21/02082—Cleaning product to be cleaned
  • H01L21/02087—Cleaning of wafer edges
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
  • H01J37/32—Gas-filled discharge tubes
  • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
  • H01J37/32366—Localised processing
  • H01J37/32385—Treating the edge of the workpieces

Definitions

• the invention relates to a device according to the preamble of claim 1 and a method for this.
• DE 102012 103330 A1 discloses a device for removing a coating from a substrate.
• Substrates such as wafers or circuit boards are coated for different applications or processing steps. This coating usually takes place over the entire surface of the substrate.
• an edge area of the substrate must be free of the coating. As a rule, it is very complex to coat a substrate only in certain areas and nevertheless very evenly. Therefore, the substrate is usually completely coated and then the coating is removed again in a previously defined edge area.
• a nozzle is preferably directed at a certain distance onto the edge area to be removed and the coating is then removed by means of solvent applied via the nozzle while the substrate rotates below the nozzle. This is even possible when the speed requirements for decoating increase.
• the coating on a substrate can be built up from different layers which have different solubility or can even be removed only by means of etching. Removing the different layers with just one nozzle is not easy to do.
• the object of the present invention is to overcome the disadvantages of the prior art.
• a device is to be provided by means of which the rapid decoating of substrates in any form is possible.
• the quality of the decoating should at least remain the same. default is that it should be possible to strip a substrate in less than a minute and that it should be possible to strip different layers of paint and/or metal on an upper and/or lower side of the substrate.
• the device according to the invention and the method for stripping an angular substrate is used to remove so-called photoresist and/or metals from a substrate in the field of photovoltaics or computer chip production.
• the device and the method are not limited to these two areas, but are designed in particular. If a decoating of the substrate is mentioned, then this means both the decoating of an upper side and/or an underside of the substrate.
• stripping also includes stripping paint and other terms for removing layers or paint or metal or the like.
• So-called decoating heads which have appropriate nozzles, are used here.
• the applied photoresist and/or the applied metals which have to be removed in the edge areas of the substrate in order to be able to carry out further processing, usually become liquid or, in the case of metal, galvanically or vapor-deposited applied to a carrier plate and forms/form a solid surface after the drying process.
• the solution medium and/or etching medium used in the decoating head are usually adapted to the coating to be removed.
• the device according to the invention for decoating is required in particular for decoating angular substrates and wafers that are not quite round (fiats).
• a substrate can, for example, have a size of up to 2000 mm x 2000 mm to have. However, other sizes are conceivable. Of course, however, round substrates can also be used in the present invention.
• the device has a decoating head and a mobilization device. Substrates that are not round are referred to as angular substrates. Angular substrates are also given, for example, when a basically square substrate with rounded corner edges is present.
• the decoating head has a nozzle through which the solution medium and/or etching medium is applied to the substrate in a working position.
• the respective medium is used to remove the paint or metal on the substrate, i.e. the coating.
• edge areas of the angular substrate should be evenly freed from paint and/or metal.
• the solution medium and/or etching medium should particularly preferably be applied in a straight line or in the form of a jet.
• the advantage of using the nozzle is that a width of the area to be removed can be determined by how close or how far away the nozzle is guided from an edge of the substrate. Preferably, an area of +/- 20 pm should be removed from an edge.
• the coating can be removed without damaging the substrate.
• the coating can be completely removed by a suitable choice of the solvent medium and/or etching medium and the pressure of the jet.
• the nozzle is suitable for discharging the jet of medium in such a way that it is guided in a jet of nitrogen until it strikes the coating to be removed.
• the decoating head can be guided in a working path along a longitudinal edge of the substrate. Guided in this context means that the decoating head can be moved back and forth in a first direction.
• the decoating head is arranged statically and the usually round substrates are held rotating under and/or above the decoating head, so that the edge area of the substrate can be decoated. This procedure does not make sense when decoating angular substrates, since only the corner areas would be decoated, but not the longitudinal edges of the substrate.
• a mobilization device is also provided, with the mobilization device and the decoating head being connected to one another in an either/or circuit.
• the decoating head is guided in operation or the mobilization device rotates the substrate in such a way that another longitudinal edge of the substrate is placed in operative connection with the working path of the decoating head.
• the procedure can be that the mobilization device can also be activated between the back and forth movement of the decoating head. Consequently, the first longitudinal edge of the substrate can be decoated during the moving movement. As soon as the mobilization device has put the additional longitudinal edge of the substrate in operative connection with the working path of the decoating head, the free movement of the decoating head can be used to decoat the additional longitudinal edge of the substrate. Depending on the paint and/or metal, however, it is also possible for the moving and moving of the decoating head to be completed before the mobilization device puts the further longitudinal edge of the substrate in operative connection with the working path of the decoating head.
• the decoating head and the further decoating head work simultaneously. In this way, the opposite longitudinal edges of the substrate would each be stressed in the same way at the same time, which generally simplifies the stabilization of the substrate and halves the time for aligning the substrate.
• the decoating head and the further decoating head can be guided in the same direction or in opposite directions.
• the same direction here means that both decoating heads carry out the same back and forth movement in parallel.
• Opposite means that the decoating head performs the forward movement while the other decoating head performs the forward movement.
• the structure can be arranged in a space-saving manner in the device. In the case of decoating heads working in opposite directions, the feed lines of the two decoating heads are less at risk of interfering with one another in a too narrow housing of the device.
• a cantilever can be provided on the device.
• the boom is designed in such a way that there is gas extrusion.
• the gas extrusion is set up as an air outlet or an air outlet nozzle.
• the cantilever slides along the substrate to be stripped on the other side of the associated stripping head.
• the substrate can deform if there is no stabilization on the other side by the cantilever.
• the cantilever features gas extrusion.
• the gas extrusion forms a stabilizing air flow.
• gas extrusion is an air outlet that is provided in the boom and is set up in such a way that the substrate is flown against on the other side of the decoating head and is thus stabilized.
• Thin means that the substrate can be less than 1mm thick.
• the present invention is not limited to this, since substrates with a thickness of several millimeters can also be provided.
• each decoating head it is also possible that more than one nozzle is used in each decoating head. In this way, in turn, the shortening of the working time for the decoating of the substrate can advantageously be achieved.
• different solvent media, etching media, water and/or a gas or gas mixture can also be discharged through different nozzles, which can/can dissolve, purify water or dry any different layers of a coating on the substrate differently.
• nozzles with different solvent medium and/or etching medium used during the back and/or forth movements of the decoating heads. It is conceivable, for example, to have a first nozzle deliver a first solution medium/etching medium during the outward movement of a decoating head, then a further nozzle can deliver a further solution medium/etching medium during the forward movement, and with a renewed outward movement of the decoating head, a third nozzle could be activated third solution medium/etching medium, etc. Of course, it should also be considered to have all nozzles discharge different solution medium/etching medium only when the decoating head moves to and fro, even if this seems impractical.
• the device also includes a suction device.
• a suction device This results in the advantage that the solution medium and/or etching medium that bounces off the substrate does not get into the environment or the process environment, but can be sucked off, possibly processed and possibly reused.
• Another benefit of The suction device is that the coating removed from the substrate can also be suctioned off and does not get into the process environment.
• the suction device is preferably provided with a hood. The hood consequently serves as an additional protective device against solvent medium and/or etching medium and/or dissolved coating spraying around.
• Sensor monitoring is also provided.
• the sensor monitoring in the quality assurance of the work process.
• a method according to the invention for decoating angular substrates is claimed.
• the decoating head and a mobilization device are also used there, with the decoating head being guided along a longitudinal edge of the substrate in a working path and the mobilization device then bringing another longitudinal edge of the substrate into operative connection with the working path of the decoating head.
• the decoating head and the mobilization device have an either/or circuit. This means that either the decoating head takes action or the mobilization facility takes action. This does not rule out the possibility that the decoating head performs the decoating during a forward movement.
• the mobilization device can then bring another longitudinal edge of the substrate into the work path of the decoating head by rotating the substrate by 90 degrees. Then, in turn, the further longitudinal edge of the substrate is decoated during the forward movement. A further increase in efficiency can also be achieved in this way, for example.
• Another decoating head can also be used in the method according to the invention, which at the same time processes and decoats a further longitudinal edge of the substrate with a further working path. It is advantageous if the decoating head and the further decoating head work at the same time.
• the decoating head moves on its working path and the further decoating head on its own further working path.
• the decoating head and the further decoating head are guided either in the same direction or in opposite directions. In the same direction here means that the decoating head and the further decoating head are moved parallel to one another in one direction. Opposite here means that the decoating head, for example, performs the forward movement and the further decoating head performs the forward movement at the same time.
• a boom moves on the other side of the substrate, which is either materially connected to the respective associated decoating head or, as part of the device, moves independently of the decoating head on the other side of the substrate in the working position and at the level of the decoating head a gas or gas mixture always flows on the part of the substrate longitudinal edge on the one hand, which is being processed by the decoating head on the other side of the substrate. This is advantageous because in this way the area of the substrate or the longitudinal edge of the substrate that is currently being decoated is stabilized.
• decoating heads are considered and described here. However, it should be covered by the invention to also provide more than two decoating heads. For example, three or four or, in the case of substrates with more than four longitudinal side edges, more four decoating heads may be provided. These would then only have to be switched in such a way that they do not interfere with their back and forth movement.
• the present invention is intended to enable edge stripping, especially of quadrangular substrates with ABF coating (Ajinomoto Build-up Film) or other resinous coatings.
• ABF coating Ajinomoto Build-up Film
• the square substrates are supplied with an ABF coating, for example. They are covered with a plastic film (PET in the case of ABF) in such a way that it covers almost the entire coating. Outside of the film, an edge of a few millimeters usually remains free and is not covered with the film.
• PET plastic film
• the loosened, but slimy, greasy coating material can be removed by a high-pressure jet through a fan nozzle, so that only the coating remains under the film.
• low and high pressure nozzles are combined in one nozzle head.
• the first step only the low-pressure nozzles are switched on and the solvent is applied for dissolving.
• the coating is then removed in the second run using the high-pressure fan nozzles.
• the exposure time may vary depending on the coating material and layer thickness.
• FIG. 1 shows a schematic plan view of a device for stripping an angular substrate
• Figure 2 shows a schematic side view of the device according to Figure 1.
• a device 1 for stripping angular substrates 2 is shown.
• the decoating comprises the removal of a coating, in particular photoresist and/or metals, from a surface of the substrate 2 and in this case in particular from edge regions 12 of the substrate 2.
• Examples of possible substrates are square wafers, rectangular wafers, polygonal wafers, thin-film panels, printed circuit boards or the like.
• the device 1 has two decoating heads 3.1 and 3.2, which can be guided along a substrate longitudinal edge 4.1 or 4.2 of the substrate 2 in a respective working path along the arrows 10 and 11. That is, the decoating heads 3.1 and 3.2 can be moved in the X and Y direction along the arrows 10 and 11. However, it should also be possible to move the decoating heads 3.1 and 3.2 in the Z direction. Thus, a distance between the decoating head 3.1 or 3.2 and the surface of the substrate 2 can be set, but also a distance between the decoating head 3.1 or 3.2 and the respective substrate longitudinal edge 4.1 or 4.2.
• the adjustment or The decoating heads 3.1 and 3.2 can be moved by an adjustment device that is not shown in detail.
• the device 1 also has a mobilization device 5 for holding, positioning and/or aligning the substrate 2 .
• the mobilization device 5 is shown in broken lines in FIG. It enables the substrate 2 to be rotated by 90 degrees in the direction of the arrow 6, whereby a further substrate longitudinal edge 4.3 or 4.4 of the substrate 2 can come into operative connection with the working path of the decoating head 3.1 or 3.2.
• the decoating head 3.1 or 3.2 and the mobilization device 5 have an either/or circuit that is not shown in detail. This causes either the decoating heads 3.1 and 3.2 to be guided in their work path along the substrate longitudinal edge 4.1 or 4.2 or 4.3 or 4.4 or the mobilization device 5 to rotate the substrate 2. As a result, the individual elements do not get in each other's way.
• the two decoating heads 3.1 and 3.2 act in preferably opposite directions. However, within the scope of the invention, the movement of the two decoating heads 3.1 and 3.2 in the same direction should also be included. However, this is only possible if the substrate 2 is sufficiently large so that there is sufficient space for the respective decoating head 3.1 or 3.2 along the respective longitudinal edge of the substrate.
• the device 1 also has a boom 7 which, in the working position, is arranged on a side of the substrate 2 opposite the decoating head 3.1 or 3.2.
• the cantilever 7 is provided with a gas extrusion 8 for the substrate 2 .
• a stabilizing air flow is discharged in the direction of the substrate 2 via this. Since the substrate 2 can usually be very thin (up to less than 1 mm), it could change over the course of the Arching or sagging when the substrate has a large surface. This could result in irregularities in the area to be decoated. In order to prevent this, the stabilizing flow is discharged in the direction of the substrate 2 via the gas extrusion 8 . Consequently, the substrate 2 is flown against the other side of the stripping head 3.1 or 3.2 with the stabilizing air stream via the gas extrusion 8 and is thus stabilized and pulled flat, so that the substrate 2 can be stripped evenly.
• Each decoating head 3.1 and 3.2 has more than one nozzle 9, preferably five to six nozzles 9, for decoating.
• the device 1 has a sensor monitor, not shown in detail, preferably for quality assurance.
• the substrate 2 to be stripped of the coating is placed on the mobilization device 5 and held by suction cups that are not shown in detail.
• Two stripping heads 3.1 and 3.2 are positioned on the two opposite longitudinal substrate edges 4.1 and 4.2 at a previously determined distance from the substrate longitudinal edge 4.1 or 4.2, specifically such that they are arranged diagonally to one another.
• the nozzles 9 of the decoating heads 3.1 and 3.2 must be arranged at a predetermined distance from the surface of the substrate 2 and in particular from the region of the substrate 2 to be decoated.
• the booms 7 with the gas extrusion 8 are positioned at a small distance below the substrate or on the side of the substrate 2 opposite the decoating heads 3.1 or 3.2. This is done in such a way that the stabilizing air flow from the gas extrusion 8 directly to the stabilizing area on the opposite side of the edge region 12 of the substrate 2 can flow.
• the air flows very quickly through the small gap between the gas extrusion 8 and the substrate 2 .
• the static pressure between the two elements decreases.
• a lower pressure acts on the underside of the substrate 2 than on the top. The substrate 2 is therefore pressed downwards by the greater ambient pressure at the top.
• the decoating heads 3.1 and 3.2 are moved along the substrate longitudinal edges 4.1 and 4.2 in their work path, in the present case in opposite directions. i.e. in the direction of the distal end of the respective substrate longitudinal edge 4.1 or 4.2 shown in relation to FIG.
• the booms 7 together with the gas extrusion 8 are also carried along uniformly below the substrate 2 in order to flow onto the substrate 2 so that it is kept evenly flat during the decoating process can. If the substrate 2 was crooked or curved, the coating could not be removed evenly and not in the desired area. Furthermore, a substrate that arches would be problematic, since under certain circumstances too much or too little material would be removed. The leveling of the substrate 2 thus takes place simultaneously with the movement of the decoating heads 3.1 and 3.2 along the substrate longitudinal edges 4.1 and 4.2 and consequently the decoating.
• the decoating heads 3.1 and 3.2 are moved along the longitudinal substrate edges 4.1 and 4.2 in the work path, one or more solvent media and/or etching media are sprayed via the nozzles 9 depending on the structure of a coating on the substrate surface.
• the nozzles 9 are for this purpose with a media pump and not shown connected to a solution or etching medium reservoir, not shown.
• the media pump is preferably suitable for discharging the solution medium and/or etching medium under (low) pressure.
• the solution medium and/or etching medium is preferably applied in a straight line or else in the form of a jet.
• the nozzles 9 are preferably connected to a compressed air source or nitrogen source, not shown in detail.
• the nozzles 9 can have two delivery tubes (not shown in detail) which are guided into one another.
• the dissolving medium and/or etching medium is preferably discharged straight or in the form of a jet and under pressure from an inner tube.
• the compressed air or nitrogen jet is then discharged from the outer tube. In this way, the coating is then loosened and removed along the substrate longitudinal edges 4.1 and 4.2.
• a suitable solvent, caustic media or small particles that have an abrasive effect can be used as the dissolving medium.
• a suction device 13 is provided with a hood, not shown in detail, which is connected via a line, not shown in detail, to a vacuum source, not shown in detail.
• the hood serves as an additional protective device against solvent and/or etching medium spraying around.
• the decoating heads 3.1 and 3.2 When the decoating heads 3.1 and 3.2 have reached the respective distal end of the longitudinal substrate edge 4.1 or 4.2 and have completed the decoating process for these longitudinal substrate edges 4.1 and 4.2, the decoating heads 3.1 and 3.2 are moved back to their starting position in the work path.
• the mobilization device 5 then rotates the substrate 2 by 90 degrees and the further substrate longitudinal edges 4.3 and 4.4 of the substrate 2 arrive with a further work path of a further one Decoating head is brought into operative connection and the processes described above are repeated. Because of the either/or circuit, either the decoating heads 3.1 and 3.2 or the mobilization device 5 are in action. The steps listed above are repeated until all desired edges and/or sides of the substrate 2 have been processed and the coating has been removed completely or at least as far as desired.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Manufacturing Of Printed Circuit Boards (AREA)
• Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
• Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
• Cleaning Or Drying Semiconductors (AREA)

Applications Claiming Priority (3)

Publications (1)

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• 2022
  • 2022-07-15 TW TW111126649A patent/TW202314909A/zh unknown
  • 2022-07-15 JP JP2024502110A patent/JP2024526780A/ja active Pending
  • 2022-07-15 WO PCT/EP2022/069938 patent/WO2023285689A1/de active Application Filing
  • 2022-07-15 US US18/577,891 patent/US20240326103A1/en active Pending
  • 2022-07-15 EP EP22754022.6A patent/EP4371149A1/de active Pending

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