EP3991974A1 - Puce de récipient d'encre et récipient d'encre - Google Patents

Puce de récipient d'encre et récipient d'encre Download PDF

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Publication number
EP3991974A1
EP3991974A1 EP20832692.6A EP20832692A EP3991974A1 EP 3991974 A1 EP3991974 A1 EP 3991974A1 EP 20832692 A EP20832692 A EP 20832692A EP 3991974 A1 EP3991974 A1 EP 3991974A1
Authority
EP
European Patent Office
Prior art keywords
chip
substrate
ink container
conductive sheet
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20832692.6A
Other languages
German (de)
English (en)
Other versions
EP3991974A4 (fr
Inventor
Haoming Ma
Weijian Chen
Yongqun QIU
Shichao LIANG
Zhizheng Jia
Yijing ZHU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhuhai Ninestar Management Co Ltd
Original Assignee
Zhuhai Ninestar Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201922184114.7U external-priority patent/CN211641446U/zh
Priority claimed from CN202020311962.XU external-priority patent/CN212499511U/zh
Application filed by Zhuhai Ninestar Management Co Ltd filed Critical Zhuhai Ninestar Management Co Ltd
Publication of EP3991974A1 publication Critical patent/EP3991974A1/fr
Publication of EP3991974A4 publication Critical patent/EP3991974A4/fr
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17543—Cartridge presence detection or type identification
    • B41J2/17546—Cartridge presence detection or type identification electronically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/1752—Mounting within the printer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17526—Electrical contacts to the cartridge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17526—Electrical contacts to the cartridge
    • B41J2/1753—Details of contacts on the cartridge, e.g. protection of contacts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17536—Protection of cartridges or parts thereof, e.g. tape
    • B41J2/1754—Protection of cartridges or parts thereof, e.g. tape with means attached to the cartridge, e.g. protective cap

Definitions

  • the present invention relates to the field of inkjet printer technologies and, in particular to, a chip of ink container and an ink container.
  • the existing inkjet printer is provided with a holding portion therein for housing the ink container, and the holding portion is detachably mounted with at least one ink container therein.
  • the ink container includes a chip, which is electrically connected with a stylus of the inkjet printer to achieve signal transmission between the ink container and the inkjet printer.
  • the chip generally includes a circuit board, a stable base, and a plurality of contacts.
  • the contact is used to electrically connect with the stylus of the inkjet printer.
  • the stable base is provided with a plurality of positioning jacks, and each positioning jack is inserted with one contact.
  • the contact is provided with a contact part that is electrically connected with the stylus, and the contact part passes through the stable base and protrudes from the surface of the stable base, so as to enable the contact part to be connected with the stylus of the inkjet printer.
  • a chip 1 has a circuit board 11, contacts 12, and a stable base 13.
  • the number of the contacts 12 is plural, and each contact 12 has a contact part 120 thereon that is used to electrically contact with a printer device (an inkjet printer).
  • the stable base 13 is provided with a plurality of positioning jacks thereon that correspond to contacts 12. Each contact 12 needs to pass through a positioning jack on the stable base 13, to expose the contact part 120 for being in contact with the printer device.
  • the volume of the contact and the stable base is small, and there are many component parts arranged on the chip, thus, when mounting the contact and the stable base, the mounting and operating space reserved for the contact and the stable base is very small, which results in assembly difficulties, thereby reducing the production efficiency of the ink container.
  • Embodiments of the present invention provide a chip of an ink container and an ink container.
  • a conductive sheet is mounted on a substrate through a positioning mounting portion.
  • the signal transmission between the chip and the inkjet printer is realized through a cell connecting portion of the conductive sheet, and the production efficiency of the ink container is improved.
  • An aspect of embodiments of the present invention provides a chip of an ink container, the chip is electrically connected with styluses of a holding portion in an inkjet printer; where the chip includes a substrate and at least one conductive sheet mounted on the substrate; the substrate has at least one substrate terminal that is in contact with a stylus of the inkj et printer, and a positioning portion that positions the at least one conductive sheet; the conductive sheet includes a body and a cell connecting portion that is provided at one end of the body; the cell connecting portion abuts the stylus; the body is provided with at least one positioning mounting portion, and the positioning mounting portion fits with the positioning portion; and the body is parallel to a surface of the substrate and is mounted on the positioning portion via the positioning mounting portion.
  • the substrate terminal is located on a +X axis side of the chip substrate, and the cell connecting portion protrudes, toward a +X axis direction, from a surface where the substrate terminal is located; the cell connecting portion is provided thereon with a conductive sheet contact area for being in contact with the stylus, and the conductive sheet contact area is located at a +X axis end of the cell connecting portion;
  • a direction where the ink container is mounted to the holding portion is a Z axis direction, a front side position of mounting is -Z axis direction;
  • a direction that is perpendicular to the Z axis direction and parallel to a surface where the substrate terminal is located is a Y axis direction;
  • a direction that is perpendicular to the Z axis direction and the Y axis direction is an X axis direction;
  • a direction in which an inner of the ink container points to the chip is the +X axis direction; when viewed along the +X axis
  • the positioning mounting portion is located on the +X axis side or the -X axis side of the body.
  • the substrate is provided with a plurality of the positioning holes thereon; the plurality of the positioning holes are divided into a first positioning hole set and a second positioning hole set that are distributed in rows and parallel to each other; where positioning holes in the first positioning hole set and positioning holes in the second positioning hole set are provided oppositely or alternately.
  • a number of the conductive sheet is plural; when the number of the conductive sheet is even, the conductive sheets are symmetrically distributed on the chip substrate along a center line L1; where the center line L1 passes through a center point in the Y axis direction of the chip and is parallel to the Z axis direction.
  • the cell connecting portion and the positioning mounting portion are respectively located on the same side of the body.
  • a plurality of substrate terminals thereon have contact parts of the substrate terminals that are in contact with corresponding styluses.
  • the cell connecting portion of conductive sheet is located in +Z axis direction of the contact parts of the substrate terminals.
  • the conductive sheet is located in +Z axis direction of the substrate terminals.
  • a plurality of substrate terminals have thereon contact parts of the substrate terminals that are in contact with corresponding styluses; the contact parts of the substrate terminals are arranged in multiple rows in the Z axis direction, the cell connecting portion of the conductive sheet is located between the contact parts of the substrate terminals that are arranged in multiple rows.
  • the substrate terminals are arranged in multiple rows in the Z axis direction, and the cell connecting portion is located between the substrate terminals in multiple rows; in the Z axis direction, the cell connecting portion and the mounting positioning portion are respectively located on two sides of the body.
  • a size of the cell connecting portion in the Y axis direction is larger than a size of the cell connecting portion in the Z axis direction.
  • the substrate is further provided with a substrate terminal that is electrically connected with a stylus, an additional terminal is provided between the cell connecting portion of the conductive sheet and the substrate terminal; the additional terminal is electrically connected with at least one wafer terminal that is in contact with a wafer of the chip storing data.
  • the chip has two conductive sheets, which are a first conductive sheet and a second conductive sheet respectively; the first conductive sheet and the second conductive sheet are symmetrically distributed along left and right of the chip.
  • an ink container including a chip of an ink container; the chip is provided with a plurality of limiting grooves thereon, the ink container is provided with a plurality of limiting blocks thereon that fit with the limiting grooves; the chip is detachably mounted on the ink container via the limiting grooves and the limiting blocks.
  • the ink container includes a cartridge body that is configured to store jet ink and a chip holder that is mounted on the cartridge body; a plurality of the limiting blocks are located on a surface of the chip holder being close to the stylus.
  • the cartridge body is provided with a mounting cavity configured to house the chip holder;
  • the chip holder includes a first connecting portion configured to connect with the cartridge body and a first fixing portion configured to fix the chip; two sides of the first connecting portion are respectively provided with first limiting bosses; side walls of the mounting cavity are respectively provided with first latching holes that fit with the first positioning bosses; one end of the first connecting portion away from the first fixing portion is provided with a second limiting boss; the second limiting boss thereon is sleeved with an elastic element, and the elastic element abuts on an inner wall of the mounting cavity.
  • one end of the first connecting portion away from the first fixing portion is provided with an inclined surface, and the second limiting boss is located on the inclined surface, so that the chip and the chip holder are located within the mounting cavity and are rotatable; when the ink container is in contact with the holding portion of the inkjet printer, there is a gap between the chip and the sidewall components of the holding portion of the inkjet printer.
  • the chip of the ink container and the ink container provided by embodiments of the present invention have the following advantages.
  • the chip of the ink container and the ink container provided by embodiments of the present invention includes a substrate and a conductive sheet that is provided on the substrate;
  • the conductive sheet includes a body, a cell connecting portion, and a positioning mounting portion;
  • the cell connecting portion is located at one end of the body, and the positioning mounting portion is located at a side of the body;
  • the base plate is provided with a positioning portion that fits with the positioning mounting portion, and the conductive sheet is inserted into the positioning portion via the positioning mounting portion, which can keep the body and the substrate to be attached, the cell connecting portion is configured to be electrically connected with the stylus of the inkjet printer, to perform the information transmission between the chip and the inkjet printer.
  • the conductive sheet is inserted on the substrate via the positioning mounting portion, and the body is parallel to a surface of the substrate, which increases the contact area between the conductive sheet and the substrate, thereby making the assembly more stable and simple; in addition, the cell connecting portion of the conductive sheet is located at one end of the body, to avoid the problem that the cell connecting portion is easily deformed due to the mounting technology, thereby improving the stability of the electrical connection between the cell connecting portion and the stylus of the inkjet printer; the length of the cell connecting portion in the Y axis direction is larger than that in the Z axis direction; since the length in the Y axis direction is larger, even if the ink container has a position deviation or offset in the Y axis direction, it will not cause the case where the chip cannot be unrecognizable, which makes the contact between the conductive sheet and the stylus more stable; the position relationship between the cell connecting portion and the substrate terminal and
  • an inkjet printer has a holding portion 200.
  • the holding portion 200 is configured to house an ink container and can carry multiple or one ink container 300.
  • the ink container 300 is detachably mounted on the holding portion 200. When the ink container 300 is used up, it needs to be replaced with a new one.
  • the ink container 300 includes a chip 100, a handle 330, an ink outlet 311, and a cartridge body 310.
  • the holding portion 200 has a stylus holder 201, an ink supply portion 202, a fixing portion 204, and an opening 205.
  • the cartridge body 310 stores with ink therein.
  • the ink reaches the ink supply portion 202 via the ink outlet 311, and then the ink supply portion 202 can supply the ink to a printer head, so that the ink can be used to carry out printing action.
  • the chip 100 can be electrically connected with styluses on the stylus holder 201 for mutual transmission of electrical signals.
  • the handle 330 is configured to fix the ink container 300 to the holding portion 200, and the handle 330 fits with the fixing portion 204 to prevent the ink container 300 from detaching from the holding portion 200.
  • the three-dimensional rectangular coordinate system of the holding portion is set, that is, the XYZ axis coordinate system is set.
  • a direction in which the ink container 300 is mounted to the holding portion 200 is a -Z axis direction, and then a direction in which the ink container 300 is detached from the holding portion is a +Z axis direction.
  • the opening 205 is located in the +Z axis direction, and a bottom wall 200a is located in the -Z axis direction.
  • the inkjet printer is placed flat on office desktop or printing desktop, the opening 205 of the holding portion 200 is located above the gravity direction, and the bottom wall 200a is located below the gravity direction, which makes it convenient for a user to mount or dismount the ink container 300.
  • the holding portion 200 can carry multiple or one ink container 300, and has multiple or one mounting position 203.
  • Four ink containers can store four different colors of ink therein, such as black, yellow, blue, and red.
  • the holding portion 200 can carry four ink containers 300 and has four mounting positions 203.
  • the holding portion 200 is an approximately rectangular or square component with the opening 205, and the bottom wall 200a and inner side walls of the holding portion 200 constitute the mounting positions 203.
  • the stylus holder 201 is mounted on a first side wall 200c of the holding portion 200, the mounting positions 203 are arranged in sequence in the Y-axis direction, and the four mounting positions 203 are arranged in sequence in the Y axis direction.
  • a direction perpendicular to both a Y axis and a Z axis is an X axis direction, where a direction from the mounting positions 203 to the stylus holder 201 is a +X axis direction.
  • the +X axis is perpendicular to the first side wall 200c. Viewed along the +X axis direction, when the +Z axis is above on the YZ plane, a +Y axis direction is on the left-hand side.
  • the three-dimensional rectangular coordinate system of the ink container 300 set in this embodiment is consistent with the three-dimensional rectangular coordinate system of the holding portion 200.
  • the stylus holder 201 has a base 210, and a plurality of styluses mounted on the base 210, which are first stylus 211 to ninth stylus 219 respectively.
  • the styluses are a flake-like metal sheet, which functions as conduct electricity and is not easy to be worn.
  • the base 210 has a plurality of slits, which are first slit 221 to ninth slit 229 respectively.
  • the plurality of slits 221-229 correspond to the plurality of styluses 211-219 one to one.
  • the plurality of slits 221-229 are U-shaped and have slit openings in the +Z axis direction.
  • the plurality of styluses 211-219 pass through the slit openings along -Z axis direction and are mounted into the plurality of slits 221-229.
  • the first stylus 211 passes through a slit opening along the -Z axis direction and is mounted into the first slit 221, and a second stylus 212 to the ninth stylus 219 are mounted in the same manner as the same, which will not be repeated here.
  • each stylus of the first stylus 211 to the ninth stylus 219 is connected to a main circuit of the inkjet printer through a circuit within the holding portion 200; and the other side is electrically connected with the chip 100.
  • the structures of the first stylus 211 to the ninth stylus 219 are the same, as shown in FIG. 4 .
  • the structure of each stylus is introduced taking the first stylus 211 as an example.
  • the first stylus 211 is divided into a first part 211a, a second part 211b, and a third part 211c.
  • the first part 211a or the third part 211c is used to be in contact with the chip 100; the second part 211b is used to be connected with a circuit within the inkjet printer, for example, connected with the main circuit of the inkjet printer via the holding portion chip 100.
  • the third part 211c is connected with the first part 211a and the second part 211b.
  • the substrate 10 has at least one substrate terminal 30 thereon.
  • the substrate 10 can be arranged with seven substrate terminals 31-37 thereon.
  • the first part 211a of the stylus is in contact with the first substrate terminal 201 to form a contact area; the second part 211b is connected with a circuit within the inkjet printer; and the third part 211c connects with the first part 211a and the second part 211b.
  • the third part is located in the +Z axis direction of the first stylus 211.
  • the first stylus 211 is fixed in the first slit 221 by the third part 211c or a part of the third part 211c (e.g., a horizontal part 211f of the third part 211c).
  • the first part 211a and the second part 211b are disposed at the tail end of the first stylus 211 in the -Z axis direction, so that the first part 211a and the second part 211b can elastically deform and easily return to their original state after deforming.
  • the first part 211a of the first stylus 211 is disposed in the -X axis direction
  • the second part 211b is disposed in the +X axis direction.
  • the first part 211a and the second part 211b protrude from the base 210, and the third part 211c does not protrude from the base 210.
  • the first part 211a and the second part 211b protrude from the base 210 in the X axis direction, and the base 210 is located between the first part 211a and the second part 211b.
  • the first part 211a is closer to the mounting position 203 than the second part 211b.
  • the third portion 211c is divided into a first vertical portion 211d and a second vertical portion 211e that are perpendicular to the X axis direction, and a horizontal portion 211f parallel to the X axis direction.
  • the horizontal portion 211f connects the first vertical portion 211d and the second vertical portion 211e.
  • the first vertical portion 211d and the second vertical portion 211e extend in the Z-axis direction.
  • the first vertical portion 211d is closer to the mounting position 203 than the second vertical portion 211e.
  • the tail end of the first vertical part 211d connects with the first part 211a
  • the tail end of the second vertical part 211e connects with the second part 211b.
  • the second stylus 212 to the seventh stylus 217 have the same arrangement and structure as those of the first stylus 211, which will not be provided detailed illustrations and description thereof.
  • An eighth stylus 218 and a ninth stylus 219 are electrically connected with a conductive sheet 30 via the first vertical part 219d and 219d respectively, and the resthave the same arrangement and structure as those of the first stylus 211, which will not be provided detailed illustrations and description thereof.
  • a chip 100 of an ink container is provided by an embodiment of the present invention.
  • the chip 100 is electrically connected with styluses of a holding portion 200 within an inkjet printer.
  • the chip 100 includes a substrate 10 and at least one conductive sheet 20 mounted on the substrate 10.
  • the substrate 10 has at least one substrate terminal that is in contact with a stylus of the inkjet printer and positioning portion 11 that positions at least one conductive sheet 20.
  • the conductive sheet 20 includes body 21 and cell connecting portion 22 that is provided at one end of the body 21.
  • the cell connecting portion 22 abuts with a stylus.
  • the body 21 is provided with at least one positioning mounting portion 23.
  • the body 21 is parallel to a surface of the substrate 10, attached and mounted on the substrate 10, and mounted at the positioning portion 11 via the positioning mounting portion 23.
  • an ink container typically includes the chip 100, which is electrically connected with styluses of an inkjet printer, so that the ink container information stored in the chip 100 of the ink container is transmitted to the inkjet printer.
  • the chip 100 includes the substrate 10, which is in the form of rectangular as whole.
  • the substrate has a face surface 10a, a back surface 10b, left surface 10c, right surface 10d, upper surface 10f, and lower surface 10e, where the face surface 10a is parallel to and opposite to the back surface 10b; the left surface 10c and the right surface 10d are located at the -Y axis side and the +Y axis side of the chip 100 respectively; and the upper surface 10f is parallel to and opposite to the lower surface 10e.
  • the substrate terminal is located on the face surface 10a.
  • One end of the substrate 10 is provided with one or more conductive sheets 20.
  • the conductive sheet 20 is in contact with the stylus of the inkjet printer.
  • the chip 100 is electrically connected with the styluses.
  • the surface of the substrate 10 facing the styluses is the face surface 10a of the substrate 10, and the surface opposite to the face surface 10a of the substrate 10 is back surface 10b of the substrate 10.
  • the substrate 10 can be arranged with seven substrate terminals thereon, which are first substrate terminal 31 to seven substrate terminal 37 respectively, and in the X axis direction, the substrate terminals 201-207 are located on the +X axis side of the substrate 10 of the chip.
  • the first substrate terminal 31 is in contact with the first part 211a of the first stylus 211, and an area that is in contact with the first stylus 211 is a first substrate contact area.
  • the first substrate terminal 31 to the seventh substrate terminal 37 have a first substrate contact area to a seventh substrate contact area respectively thereon, which are collectively referred to as substrate contact area.
  • a plurality of substrate contact areas are arranged in plural rows in the Z axis direction.
  • the first substrate terminal 31 to the seventh substrate terminal 37 are arranged in two rows in the Z axis direction.
  • the first substrate terminal 31 to fourth substrate terminal 34 are on a first row
  • fifth substrate terminal 35 to the seventh substrate terminal 37 are on a second row.
  • the first substrate contact area to fourth substrate contact area are on the first row
  • fifth substrate contact area to the seventh substrate contact area are on the second row.
  • the substrate is provided with two conductive sheets 20.
  • the two conductive sheets 20 are first conductive sheet 20a and second conductive sheet 20b, which are provided on the face surface 10a of the substrate.
  • a center line L1 passes through a center point on the Y axis direction of the chip 100 and is parallel to the Z axis direction.
  • the first conductive sheet 20a and the second conductive sheet 20b are symmetrically distributed on the substrate 10 with the center line L1 as the symmetrical center; and the center line L1 passes through a sixth substrate terminal 206.
  • the chip 100 is symmetrical with the center line L1 as the symmetrical center.
  • the conductive sheet 20 is positioned relative to the chip substrate 10 via the positioning portion 11, and the positioning form may be a fixed form such as sticking welding, and clamping, etc.
  • the conductive sheet 20 provided in this embodiment includes a body 21 in rectangular shape.
  • One end of the body 21 is provided with a cell connecting portion 22, which can be formed through bending one end of the body 21 outward.
  • the body 21 is provided with at least one positioning mounting portion 23 along the direction from the cell connecting portion 22 to another end.
  • the positioning mounting portion 23 is located at an edge of a side of the body 21.
  • the cell connecting portion 22 and the positioning mounting portion 23 can be respectively located on the first surface 20e; or the cell connecting portion 22 is located on the first surface 20e, and the positioning mounting portion 23 is located on the second surface 20g. It should be understand that the cell connecting portion 22 and the positioning mounting portion 23 can be in a sheeting structure or a columnar structure. The shapes of the cell connecting portion 22 and the positioning mounting portion 23 are not limited in this embodiment, and the cell connecting portion 22 and the positioning mounting portion 23 can be provided into sheeting structures preferably.
  • the substrate 10 is provided with a positioning portion 11 thereon that is used to insert the positioning mounting portion 23, and the number of the positioning portion 11 is the same according to the number of the positioning mounting portion 23.
  • the positioning portion includes a positioning hole.
  • the positioning portion 11 is a positioning hole.
  • the conductive sheet 20 can be provided with a plurality of positioning mounting portions 23 thereon, which are respectively provided on both sides of the body 21 and can be provided along an edge of the body 21, for example, two sides of the body 21 can be respectively provided with two positioning mounting portions 23, and the positioning mounting portion 23 located at the each side can be provided oppositely or alternately.
  • the conductive sheet 20 is mounted from the back surface 10b of the substrate 10, the positioning mounting portion 23 is inserted into the positioning hole 11 located on the substrate 10, the body 21 is attached on the back surface 10b of the substrate 10, and the cell connecting portion 22 protrudes from the face surface 10a of the substrate 10.
  • the positioning mounting portion 23 of the selected conductive sheet 20 is located on the first surface 20e of the body 21, and the cell connecting portion 22 of the selected conductive sheet 20 is located on the second surface 20g of the body 21, at this point, the positioning mounting portion 23 of the conductive sheet 20 is mounted from the face surface 10a of the substrate 10 and inserted into the positioning hole 11 located on the substrate 10, so that the body 21 is parallel to and even attached to the face surface 10a of the substrate 10, and the cell connecting portion 22 protrudes from the face surface 10a of the substrate 10.
  • one end of the positioning mounting portion 23 away from the body 21 can be provided with guide angle.
  • one end of the positioning mounting portion 23 in a sheeting structure away from the body 21 can be chamfered to form a conical portion 23a, which is convenient for the positioning mounting portion 23 to be inserted into the positioning hole 11; or one end of the positioning mounting portion 23 in a columnar structure away from the body 21 can be provided with rounded corner to form an arc surface, which is convenient for the positioning mounting portion 23 to be inserted into the positioning hole 11.
  • the chip is provided with a conductive sheet 20; the conductive sheet 20 is inserted into the positioning hole 11 of the substrate 10 via positioning mounting portion 23 of the conductive sheet 20; the body 21 of the conductive sheet 20 is snugly provided onto the substrate 10, and the cell connecting portion 22 is provided protruding from the body 21; the body 21 is snugly provided on the substrate 10, which can increase the contact area between the body 21 and the substrate 10, and make the assembly to be easier; in addition, the cell connecting portion 22 of the conductive sheet 20 is located at one end of the body 21. In the mounting process of the conductive sheet 20, the cell connecting portion 22 is not easy to deform, so that the stability of the electrical connection between the cell connecting portion and the styluses of the inkjet printer can be improved.
  • the cell connecting portion 22 can be vertically provided on the body 21, which is convenient for electrically connecting with the stylus, and the positioning mounting portion 23 can also be vertically mounted on the body 21, which is convenient for the positioning mounting portion 23 to be inserted into the positioning hole 11 of the substrate 10.
  • the axial line of the positioning hole 11 of the substrate 10 can be perpendicular to a surface of the substrate 10, which is convenient for providing positioning hole 11 on the substrate 10.
  • the connecting portion of the chip 100 and the positioning mounting portion 23 can also be provided on the body 21 obliquely.
  • the cell connecting portion 22 and the positioning mounting portion 23 are disposed vertically on the body 21 in this embodiment.
  • the conductive sheet 20 can be inserted into the positioning hole 11 on the substrate 10 via positioning mounting portion 23 of the conductive sheet 20, to detachably connect the conductive sheet 20 onto the substrate 10. Furthermore, in this embodiment, the body 21 of conductive sheet 20 is attached to the substrate 10, and the conductive sheet 20 can also be stuck or welded onto the substrate 10 by the body 21, which can increase the connection strength between the conductive sheet 20 and the substrate 10.
  • the cell connecting portion 22 is disposed at one end of the body 21, and the mounting direction of the cell connecting portion 22 is different from the attaching direction of the body 21. Preferably, the cell connecting portion 22 is provided vertically on the body 21.
  • the cell connecting portion 22 does not deform even if the body 21 occurs deform, the fixedness of the electrical connection between the cell connecting portion 22 and the stylus can be ensured.
  • the conductive sheet 20 can be inserted into the positioning hole 11 through using the positioning mounting portion 23 alone; or can be welded or stuck onto the substrate 10 through using the body 21 alone; or, after the conductive sheet 20 being stuck onto the substrate 10 through using the positioning mounting portion 23, the body 21 is welded with the substrate 10, which can increase the connection strength between the conductive sheet 20 and the substrate 10.
  • the conductive sheet 20 is inserted into the positioning hole 11 through using the positioning mounting portion 23.
  • the conductive sheet 20 is inserted into the positioning hole 11 via the positioning mounting portion 23.
  • the substrate 10 is provided with a plurality of conductive sheets 20 thereon, and the plurality of conductive sheets 20 can be distributed on the substrate 10 in a array, taking an example where the substrate 10 is provided with two conductive sheets 20, two conductive sheets 20 are first conductive sheet 20a and second conductive sheet 20b respectively, the positioning hole 11 disposed on the substrate 10 is explained based on the first conductive sheet 20a and the second conductive sheet 20b.
  • the substrate of the chip 100 is provided with two, left-right symmetrical, first conductive sheet 20a and second conductive sheet 20b, where the first conductive sheet 20a is arranged on the -Y side of the second conductive sheet 20b.
  • first conductive sheet 20a the structure of the conductive sheet is introduced in detail.
  • the first conductive sheet 20a provided by this embodiment has: a cell connecting portion 22 that is in contact with an eighth stylus 218, the positioning mounting portion 23 fixed on the substrate 10, and the body 21 connecting the cell connecting portion 22 with the positioning mounting portion 23.
  • the positioning mounting portion 23 fits with the positioning hole 11, to position the first conductive sheet 20a.
  • the first conductive sheet 20a has a conductive sheet contact area 22a that is in contact with the first vertical part 218d of the eighth stylus 218, and the conductive sheet contact area 22a is located at the +X axis end of the cell connecting portion 22 of the first conductive sheet 20a. Further, the conductive sheet contact area 22a is located at the +X axis end of the first conductive sheet 20a.
  • the cell connecting portion 22 is perpendicular to the body 21, and the positioning mounting portion 23 is perpendicular to the body 21.
  • the body 21 is disposed on and parallel to the face surface 10a where the substrate terminals 201-207 are located.
  • the first conductive sheet 20a includes: a first surface 20e, a second surface 20g, a third surface 20c, a fourth surface 20d, and a fifth surface 20f.
  • the first surface 20e and the second surface 20g are parallel and opposite to each other, and both are parallel to the face surface 10a.
  • the third surface 20c and the fourth surface 20d are parallel and opposite to each other.
  • the third surface 20c and the fourth surface 20d are respectively located on the -Y axis side and the +Y axis side of the first conductive sheet 20a.
  • the first surface 20e and the second surface 20g are also two surfaces of the body 21.
  • the third surface 20c and the fifth surface 20f are two surfaces of the cell connecting portion 22, and both are parallel and opposite to each other.
  • the third surface 20c and the fifth surface 20f are respectively located on the -Y axis side and the +Y axis side of the cell connecting portion 22.
  • the cell connecting portion 22 is perpendicular to the body 21, and the positioning mounting portion 23 is perpendicular to the body 21.
  • Such structure makes the chip to reduce the number of component parts, to have simple structure, and to have high production efficiency. Also, the contact area between the conductive sheet and the substrate is increased, and the positioning position of the conductive sheet and the substrate is increased, so that the design of the positioning mounting portion becomes simple and easy to operate, thereby making the assembly of the conductive sheet and the substrate 10 easier. In addition, the deformation of the cell connecting portion caused by the influence of welding, sticking and other technologies is prevented.
  • the deformation of the cell connecting portion 22 will result in the failure to accurately contact the eighth stylus 218.
  • the body 21 is disposed on and parallel to the face surface 10a where the substrate terminal is located, so that in the process of reproduction, the mounting, positioning and welding of the conductive sheet can be completed only on the face 10a of the substrate 10 without turning to the back surface 10b of the substrate 10, which is convenient for production, and thereby improving production efficiency.
  • the positioning mounting portion 23 includes four protrusions protruding from the body 21, and the four protrusions are perpendicular to the face surface 10a of the substrate.
  • the positioning hole 11 is used to fit with the positioning mounting portion 23, and the four protrusions are inserted into the positioning holes 11, which makes the mounting of the conductive sheet to be easier and more convenient.
  • the first conductive sheet 20a and the first vertical portion 218d of the eighth stylus 218 are not elastic since the first conductive sheet 20a is made of metal and is welded onto the substrate 10.
  • the first conductive sheet 20a When the ink container 300 is mounted on the holding portion 200, the first conductive sheet 20a will press the first vertical part 218d of the eighth stylus 218, so that the first vertical part 218d will move in the +X axis direction, and then the contact area 22a of the first conductive sheet 20a will enter into the eighth slit 228, +X axis side of the first conductive sheet 20a is inserted into the eighth slit 288, and the third surface 20c and a part of the fifth surface 20f is also inserted into the eighth slit 228, so as to position the chip and increase the accuracy of the contact between the chip and the stylus.
  • the second conductive sheet 20b has the same contact form and function as those of the first conductive sheet 20a, which will not be provided detailed illustration here.
  • the substrate 10 is provided with a plurality of positioning holes 11 thereon, and the plurality of positioning holes 11 are divided into a plurality of positioning hole sets distributed in rows and parallel to each other, and a row pitch between adjacent positioning hole sets is adjusted according to the positioning mounting portion of the conductive sheet.
  • the positioning holes between adjacent hole sets can be disposed oppositely or staggered.
  • the substrate 10 is provided thereon with a left-right symmetrical, first conductive sheet 20a and a second conductive sheet 20b, where each conductive sheet includes four positioning mounting portions 23, and the substrate 10 needs to be provided with four positioning holes 11 correspondingly that are used to mount a conductive sheet 20.
  • the substrate 10 is provided with two rows of positioning hole sets, including a first positioning hole set and a second positioning hole set.
  • the first positioning hole set and the second hole set are provided on the substrate 10 at intervals in rows.
  • the first positioning hole set includes four first positioning holes 11a that are located in the same row;
  • the second positioning hole set includes four second positioning holes 11b that are located in the same row; and
  • the first positioning hole set is arranged above the second positioning hole set.
  • the first positioning hole 11a and the second positioning hole 11b can be disposed oppositely or staggered. Accordingly, the positioning mounting portion 23 located on the two sides of the conductive sheet 20 can be disposed opposite or alternately.
  • one end of the positioning mounting portion 23 away from the body 21 is provided with a bending portion; the bending portion is connected with the positioning mounting portion 23, and the bending portion is clamped on the substrate 10 and located on a surface of the substrate 10 away from the body 21.
  • one end of the positioning mounting portion 23 is connected on the body 21, and the other end of the positioning mounting portion 23 is inserted into the positioning portion 11 of the substrate 10 and protrudes from a surface of the substrate 10 (the back surface 10b or the face surface 10a).
  • FIGS. 11 and 12 in this embodiment, an example where the conductive sheet 20 is mounted on the face surface 10a of the substrate is taken to explain.
  • the positioning mounting portion 23 is inserted into the positioning portion 11 from the face surface 10a of the substrate 10. One end of the positioning mounting portion 23 away from the body 21 protrudes from the back surface 10b of the substrate 10 and to be bent to form a bending portion. The bending portion can be attached on the back surface 10b of the substrate 10, to prevent the positioning mounting portion 23 from detaching from the insertion hole. Similarly, positioning mounting portion 23 is inserted into the positioning portion 11 from the back surface 10b of the substrate 10. One end of the positioning mounting portion 23 away from the body 21 protrudes from the face surface 10a of the substrate 10 and to be bent to form a bending portion. The bending portion can be attached on the face surface 10a of the substrate 10, to prevent the positioning mounting portion 23 from detaching from the insertion hole, as shown in FIGS. 13 and 14 .
  • the number of the conductive sheet may be one or more. When the number of the conductive sheet is even, the conductive sheets are symmetrically distributed on the substrate 10 of the chip along the center line L1.
  • the number of the second part of the conductive sheet and the hole of chip substrate 10 can be one or more, both can achieve the purpose of positioning.
  • the first conductive sheet 20a and the second conductive sheet 20b can be two parts disposed on a same metal sheet during the production process.
  • the above-mentioned metal sheet is positioned and welded onto the substrate 10 of the chip, a punch is used to thrust the metal sheet into a first conductive sheet 20a and a second conductive sheet 20b.
  • Such production mode increases the operability of the producer, optimizes the production procedure, and improves the production efficiency.
  • FIG. 15 is a schematic diagram where the stylus holder 201 fits with the chip 100 in Embodiment 1.
  • FIG. 15 is a schematic diagram of the chip 100 and the stylus holder 201 when the ink container 300 is mounted on the holding portion 200.
  • the first conductive sheet 20a is in contact with the first vertical part 218d of the eighth stylus 218.
  • the first conductive sheet 20a is not elastic since it is made of metal, and welded onto the substrate 10 of the chip.
  • the first conductive sheet 20a When the ink container 300 is mounted onto the holding portion 200, the first conductive sheet 20a will press the first vertical part 218d of the eighth stylus 218, so that the first vertical part 218k will move in the +X axis direction, and then the contact area 2082 of the first conductive sheet 20a will enter into the eighth slit 228, the +X axis side of the first conductive sheet 20a is inserted into the eighth slit 228, and a part of the third surface 20c and the fifth surface 20f is also inserted into the eighth slit 228, so as to position the chip 100 and increase the accuracy of the contact between the chip 100 and the styluses.
  • the second conductive sheet 20b has the same contact form and function as those of the first conductive sheet 20a, which will not be provided detailed illustration here.
  • the chip 100 has: a set of first limiting grooves 12, a set of second limiting grooves 13, and a set of third limiting grooves 14.
  • the set of first limiting grooves 12, the set of second limiting grooves 13 and the set of third limiting grooves 14 are through grooves that penetrate through the thickness direction of the substrate 10 of the chip (i.e., the X axis direction).
  • the third limiting grooves 14 are disposed on the - Y axis side and the -Z axis side, and the +Y axis side and the -Z axis side of the chip 100.
  • the third limiting groove 14 has a first limiting groove surface 14a on the +Y axis side.
  • the first part 218a of the eighth stylus 218 is located at the first limiting groove 14 of the chip 100, and the third limiting groove surface 14a will play a positioning role for the eighth stylus 218 and the ninth stylus 219, thereby increasing the accuracy of the contact between the chip 100 and the stylus.
  • the second limiting groove 13 is disposed on the -Y axis side and the +Y axis side of the chip 100.
  • the first limiting groove 12 is disposed on the -Y axis side and the +Z axis side, and the +Y axis side and the +Z axis side of the chip 100.
  • the eighth stylus 218 and the ninth stylus 219 within the inkjet printer are high voltages (e.g., 42V square wave), used to detect the ink capacity of the ink container 300 or whether the ink container 300 is mounted on the holding portion 200 or not.
  • the operation voltage of the wafer 40 is relatively low, and thus which are applied by the ink container to the first stylus 211 to the seventh stylus 217, and the wafer 40 are low voltages (2.7V to 3.3V).
  • the chip 100 can be fixed on the ink container 300 through a manner that the second limiting groove 13 or the first limiting groove 12 fits with a projection correspondingly provided on the ink container 300, or through a manner of sticking.
  • the first conductive sheet 20a and the second conductive sheet 20b are positioned relative to substrate 10 of the chip 100 through the first positioning hole 11a and the second positioning hole 11b.
  • the conductive sheet is welded onto the substrate 10 of the chip 100 through a manner of welding.
  • the substrate 10 is provided thereon with a left terminal 38a, a right terminal 38b, a left rear terminal 39a, a right rear terminal 39b, a wafer 40, and electronic components.
  • the left terminal 38a corresponds to the first conductive sheet 20a
  • the right terminal 38b corresponds to the second conductive sheet 20b.
  • heated tin for welding is spot on the left terminal 38a firstly, and then the first conductive sheet 20a is placed on the substrate 10 via the first positioning hole 11a. At that point, the tin will cause the first conductive sheet 20a to be welded together with the substrate 10.
  • the left terminal 38a is connected with the left rear terminal 39a that is provided on the back surface 10b of the substrate 10 through the wiring within the substrate 10, and the left rear terminal 39a is connected with the wafer 40 or an electronic component through the wiring within the substrate 10, which allows the first conductive sheet 20a to serve corresponding functions.
  • the second conductive sheet 20b has the same production process and arrangement as those of the first conductive sheet 20a.
  • heated tin (for welding) is spot on the right terminal 38b firstly, and then the second conductive sheet 208 is placed on the substrate 10 via the second positioning hole 11b. At that point, the tin will cause the second conductive sheet 20b to be welded together with the substrate 10.
  • the right terminal 38b is connected with the right rear terminal 39b disposed on the back surface 10b of the substrate 10 through the wiring within the substrate 10, and the right rear terminal 39b is connected with the wafer 40 or an electronic component through the wiring within the substrate 10, which allows the second conductive sheet 20b to serve corresponding functions.
  • one end of the substrate 10 close to the upper surface 10f of the substrate 10 is provided with left terminal 38 and right terminal 38b, which are both located on the face surface 10a of the substrate.
  • the left terminal 38a is extended to the upper side of the substrate, and the left side of the left terminal 38a is extended to an edge of the substrate, to increase surface area of the left terminal 38b, and then the welding area and welding spot between the left terminal 38b and the left conductive sheet can be increased, and the connection strength between the left conductive sheet and the substrate can be increased to prevent from detaching from the substrate.
  • the upper and the right sides of the right terminal 38b is extended to edges of the substrate, to increase the surface area of the right terminal, and then the welding area and welding spot between the right terminal 38b and the left conductive sheet can be increased, and the connection strength between the left conductive sheet and the substrate can be increased to prevent from detaching from the substrate. It can be understood that there is a gap between the right side of the left terminal 38a and the left side of the right terminal 38b. In order to further reduce the gap between the right side of the left terminal 38a and the left side of the right terminal 38b, further increase the surface areas of the left terminal 38a and the right terminal 38b. As shown in FIG.
  • the left side of the left terminal 38a can be extended and wrapped around the positioning hole on the left side, and a gap is maintained from the right terminal.
  • the right side of the right terminal 38b can be extended and wrapped around the positioning hole on the right side, and a gap is maintained from the left terminal 38a.
  • the substrate 10 is provided with a substrate terminal 30 that is electrically connected with the stylus.
  • An additional terminal is also provided between the substrate terminal 30 and the conductive sheet 20, and is connected with at least one wafer 40 of the chip 100 that stores data.
  • the substrate 10 is provided with one or more substrate terminals 30 thereon, the number of the substrate terminals 30 may be the same with the number of the styluses.
  • the number of styluses and the number of substrate terminals 30 may also be different, for example, there are merely five substrate terminals on the substrate 10, and there are nine styluses, where there is one empty stylus.
  • the empty stylus does not be connected with an inner circuit within the inkjet printer, or the circuit connected with the empty stylus does not affect the use of the ink container.
  • the first substrate terminal 31 on the substrate 10 has an extending part that is in contact with both the first stylus 211 and the second stylus 212.
  • the first substrate terminal 31 has two contact areas. Such technology can be used to detect whether the ink container 300 is correctly mounted into the holding portion 200 or not.
  • the first stylus 211 and the second stylus 212 are both in contact with the first substrate terminal 31, the first stylus 211 and the second stylus 212 will be connected together via the first substrate terminal 31, and thus the voltages on the first stylus 211 and the second stylus 212 are the same. Finally, it is only necessary to detect whether the voltages on the first stylus 211 and the second stylus 212 are the same or not, so as to determine whether the first stylus 211 and the second stylus 212 are both in contact with the first substrate terminal 31, and further complete the mounting detection.
  • the fourth stylus 214 is not connected with the internal circuit of the inkjet printer, and is an empty stylus.
  • the connection forms of other substrate terminals, conductive sheet, and chip 100 are the same as the connection form in which the substrate is provided with seven substrate terminals.
  • FIG. 25 is a schematic diagram of another chip 100 of the Embodiment 1.
  • the substrate 10 has: seven substrate terminals 31 to 37, and the seven substrate terminals 31 to 37 in a rectangular shape are arranged in a row one after another, but the contact areas are still the same as those of the chip 100 shown in FIG. 6 .
  • the beneficial effect of this embodiment can still be achieved if the shape of the substrate terminals on the substrate 10 is changed.
  • substrate 10 is provided thereon with a first substrate terminal 31, a second substrate terminal, a third substrate terminal 33, a fourth substrate terminal 34, a fifth substrate terminal 35, a sixth substrate terminal 36, and a seventh substrate terminal 37; and one end of the substrate is provided with a first conductive sheet 20a and a second conductive sheet 20b, and a first additional terminal 51a is provided between the above-mentioned substrate terminals and the first conductive sheet 20a, a second additional terminal 51b is provided between the above-mentioned substrate terminals and the second conductive sheet; where, the second substrate terminal 32, the third substrate terminal 33, the fifth substrate terminal 35 and the seventh substrate terminal 37 (hereinafter collectively referred to as terminal of wafer 40) are connected with the wafer 40.
  • terminal of wafer 40 terminal of wafer 40
  • the first additional terminal 51a is connected with the second substrate terminal 32 (e.g., via a wire provided on the substrate 10), and the second additional terminal 51b is connected with the seventh substrate terminal 37. That is, the first additional terminal 51a and the second additional terminal 51b can be equivalent to extending parts of the substrate terminals connected with the wafer 40. Since there are the first additional terminal 51a and the second additional terminal 51b, a barrier is presented between the conductive sheet and the first substrate terminal 30 and the second substrate terminal 30. Such structure reduces the possibility that the conductive sheet 20 is short circuited in series with the first substrate terminal 31 and the second substrate terminal 32.
  • the terminal of wafer is typically provided with an ESD protection circuit, which can make the first substrate terminal withstand electric shock voltage of hundreds of volts to thousands of volts. Therefore, even if a short circuit occurs between the terminal of the wafer 40 and the conductive sheet 20 / the first substrate terminal 31 and the second substrate terminal 32, the risk of damage to the inkjet printer/ink container is relatively low. In this way, the terminal of wafer is provided between the conductive sheet 20 and the first substrate terminal 31 and the second substrate terminal 32, which reduces the probability of short circuit series connection between the conductive sheet 20 and the first substrate terminal 31 and the second substrate terminal 32, and thus reducing the risk of damage.
  • FIG. 20 is a schematic diagram where the above-mentioned chip 100 is mounted onto an ink container 300.
  • An adapter 340 is a part of the ink container 300.
  • the adapter 340 typically fits with a cartridge body 310 to form a complete ink container 300. When ink in the cartridge body 310 is exhausted, only the cartridge body 310 needs to be replaced, and the adapter can still be used, which reduces the costs and saves resources.
  • the adapter 340 has thereon a notch 343 for inserting an ink outlet 311, a chip mounting surface 340c, two oppositely provided first protruded posts 341 and two oppositely provided second protruded posts 342.
  • the chip 100 is disposed on the chip mounting surface 340c.
  • the two oppositely provided first limiting grooves 11 and two oppositely provided second limiting grooves 13 on the chip 100 are used to fix the chip 100 on the ink container 300.
  • the two first protruded posts 341 on the adapter 340 respectively fits with the two second limiting grooves 13, and the two second protruded posts 342 respectively fits with the first limiting grooves 11, so that the chip 100 can be fixed on the ink container 300.
  • the shape of the first protruded posts 341 matches with the shape of the second limiting grooves 13.
  • the first protruded post 341 abuts against the third limiting groove 11, so that the chip 100 does not move on the adapter 340.
  • the fitting form between the second protruded posts 342 and the first limiting grooves 11 is the same, which will not be provided detailed illustration here.
  • this embodiment also provides another ink container, including a chip 100 of an ink container; the chip 100 is provided with a plurality of limiting grooves thereon; the ink container is provided thereon with a plurality of limiting blocks that fit with the limiting grooves; and the chip 100 is detachably mounted on the ink container via the limiting grooves and the limiting blocks.
  • FIG. 26 is another ink container provided by this embodiment, including a chip holder 320, and the chip holder 320 can be detachably mounted on the ink container.
  • FIG. 27 is a holding portion 200 that fits with the above-mentioned ink container, and the holding portion 200 is configured to mount such ink container with the chip holder 320 onto the holding portion 200.
  • the ink container 300 includes a cartridge body 310, and ink outlet 311 and a clamping portion 312 that are disposed on the cartridge body 310.
  • the clamping portion 312 is configured to connect cartridge body 310 on the holding portion 200 of the inkjet printer.
  • One side of the cartridge body 310 away from the ink outlet 311 is provided with a mounting surface for mounting the chip 100, and two sides of the mounting surface are provided with a plurality of limiting blocks.
  • the substrate 10 of the chip 100 is provided with a plurality of limiting grooves, which can be provided on the two, left and right sides of the substrate 10.
  • the position of the limiting block in the cartridge body and the position of the limiting groove on the substrate 10 are not limited, and the chip 100 may be detachably connected onto the cartridge body.
  • the holding portion 200 has a bottom wall 200a.
  • the cartridge body 310 stores ink therein. Ink reaches an ink supply portion 202 via the ink outlet 311, and then the ink supply portion 202 can supply the ink to a printer head, so that the ink can be used to perform printing action.
  • a first side wall 200c in the holding portion 200 is not perpendicular to the bottom wall 200a, and is inclined relative to the bottom wall 200a.
  • the chip 100 is mounted on the chip holder 320, and the combination of the chip holder 320 and the chip 100 is mounted at an inclined part on the ink container 300 via a first latching hole 313.
  • the chip 100 can be electrically connected with a stylus on the stylus holder 201 for mutual transmission of electrical signals.
  • the clamping portion 312 is configured to fix the ink container 300 onto the holding portion 200, and the clamping portion 312 fits with the fixing portion 204 to prevent the ink container 300 from detaching from the holding portion 200.
  • the cartridge body 310 also includes a chip holder 320, which is configured to fix the chip 100.
  • the chip 100 is detachably connected on the chip holder 320, and located on the cartridge body 310 of the mounting position of the chip.
  • the cartridge body 310 is provided with a mounting cavity that is configured to mount the chip holder 320, so that the chip holder 320 is mounted within the mounting cavity through inserting.
  • the limiting block provided on the cartridge body 310 may be located on the chip holder 320 and provided close to a surface of the mounting face of the chip 100.
  • the chip 100 is provided with a plurality of limit grooves fitted with the limiting blocks, so that the chip 100 can be detachably connected on the chip holder 320, and then the chip holder 320 is fixed on the cartridge body 310, so as to achieve mounting of the chip 100 onto the ink container.
  • the cartridge body 310 is provided with at least one first clamping hole 313 on two sides of the mounting cavity respectively.
  • the chip holder 320 includes a first connecting portion 325 and a first fixing portion 321.
  • the first fixing portion 321 is provided thereon with a mounting surface for mounting the chip 100.
  • the first connecting portion 325 is configured to fix the chip holder 320 on the cartridge body 310, and two sides of the first connecting portion 325 are respectively provided with first positioning bosses 326 that fit with the first clamping holes 313.
  • the first positioning bosses 326 can be latched into the first positioning holes 11a, to fix the chip holder 320 on the cartridge body 310.
  • the first connecting portion 325 can be formed through extending the first fixing portion 321, that is, one end of the first connecting portion 325 is joined with the first fixing portion 321, and the other end of the first connecting portion 325 is provided with a second limiting boss 327.
  • the second limiting boss 327 is sleeved with an elastic element 328 thereon.
  • One end of the elastic element 328 abuts on an abutting surface that forms between the second limiting boss 327 and the first connecting portion 325, the other end of the elastic element 328 abuts on the inner wall of the mounting cavity.
  • the elastic element 328 provided by this embodiment may be made of silica gel or rubber.
  • the second limiting boss 327 may be a cylinder, and an abutting surface is formed between the cylinder and the first connecting portion 325.
  • the elastic element 328 is sleeved on the cylinder; one end of the elastic element 328 abuts on the abutting surface, and the other end of the elastic element 328 abuts on the inner wall of the mounting cavity; and then the chip holder 320 is elastically mounted within the mounting cavity of the cartridge body 310.
  • one end of the first connecting portion 325 away from the first fixing portion 321 is provided with a bevel 329.
  • the inclined angle of the bevel 329 inclines toward rotation direction of the chip holder 320, so that one end of the first connecting portion 325 has a certain gap from the cavity wall of the mounting cavity, which causes the chip holder 320 rotatable within the mounting cavity.
  • the ink container 300 with the chip holder 320 When the ink container 300 with the chip holder 320 is mounted to the holding portion 200 of a printer, two sides of the chip holder 320 are provided with the first positioning bosses 326, the cartridge body of the ink container 300 is provided thereon with the first latching hole 313, the first positioning boss 326 is mounted to the first latching hole 313, and the first positioning boss 326 is rotatable within the first latching hole 313.
  • the first positioning boss 326 When holder 320 of the chip 100 is inserted into the ink container 300 of the inkjet printer, the first positioning boss 326 is latched into the first latching hole 313, and if the cartridge body is rotated, the chip holder 320 can be rotated relative to holding portion 200, and then the mounting position of the chip 100 relative to the stylus holder 210 can be adjusted to enable the conductive sheet 20 to be in contact with the stylus 211.
  • the first connecting portion 325 is provided with the inclined surface 329, so that the chip holder 320 has a certain rotatable angle within the mounting cavity, and the rotation angle of the chip holder 320 may be 10° to 15°, preferably 12.4°.
  • the chip 100 of this embodiment includes at least one conductive sheet, and the following takes an example where the number of the conductive sheet is two for illustration.
  • FIGS. 16 and 17 are schematic diagrams of a chip in the Embodiment 2. As shown in FIGS. 16 and 17 , the chip 100 has a chip substrate 10, a first conductive sheet 20a, and a second conductive sheet 20b. The seven substrate terminals 31 to 37 on the chip substrate 10 are arranged in two rows in the Z axis direction, first row R1 and second row R2 in sequence along the -Z axis direction.
  • the chip 100 has: a first recess 151, a second recess 152, a third recess 153, a fourth recess 154, a fifth recess 155, a sixth recess 156, and a seventh recess 157.
  • the third recess 153, the fourth recess 154, and the seventh recess 157 can be served as positioning recesses to fix the chip 100 onto an adapter 340 or the ink container 300.
  • the third recess 153, the fourth recess 154, and the seventh recess 157 matches with the protrusions on the chip holder 320, or the adapter 340, or the ink container 300, to fix the chip 100 on the chip holder 320, or the adapter 340, or the ink container 300.
  • the third recess 153 and the fourth recess 154 are located on the +Z axis direction side of the chip 100 and have a circular hole shape; the seventh recess 157 is located on the -Z axis direction side of the chip 100 and have a semicircular shape. It can be understood for those skilled in the art that the third recess 153, the fourth recess 154, and the seventh recess 157 may have other shapes, as long as the fixing of the chip 100 can be ensured.
  • the positioning portion 11 that positions conductive sheet 20 includes two through holes that penetrate the chip 100 in the thickness direction.
  • the positioning portion 11 may include a plurality of positioning holes.
  • the positioning portion 11 includes a first positioning hole 11a and a second positioning hole 11b.
  • the positioning mounting portion 23 of the conductive sheet 20 passes through the positioning portion 11 to position the conductive sheet 20.
  • the positioning mounting portion 23 is a protrusion that protrudes from the body 21, and the positioning mounting portion 23 is inserted into the corresponding positioning portion 11.
  • the conductive sheet 20 can be fixed by fixing the positioning mounting portion 23 and the body 21 with the corresponding part of the chip substrate, through welding, sticking.
  • the substrate terminals 31 to 37 are provided on the face surface 10a of the chip 100, the substrate terminals 31 to 37 are in contact with the corresponding styluses on the stylus holder 201, and each substrate terminal has a the substrate terminal contact part that is in contact with the corresponding stylus, where it should be understood that the face surface 10a of the chip 100 is the face surface 10a of the chip substrate, and the back surface 10b of the chip 100 is the back surface 10b of the chip substrate.
  • the bodies 21 of the conductive sheets 20a and 20b are provided on a side of the back surface of the chip 100.
  • the cell connecting portions 22 of the conductive sheets 20a and 20b pass through the fifth recess 155 and the sixth recess 156 of the chip 100 from one side of the back surface 10b, and protrude from the face surface 10a.
  • the bodies 21 of the conductive sheets 20a, 20b are provided on the back surface 10b side of the chip 100; the cell connection portions 22 of the conductive sheets 20a and 20b extend from the bodies 21 toward a side of the +X axis of the chip substrate; the cell connecting portions 22 pass through the fifth recess 155 and the sixth recess 156 served as avoiding recesses, and protrude from the face surface side of the chip substrate to be in contact with the corresponding styluses.
  • the reasonable arrangement of the substrate terminals and the conductive sheets is better realized, thereby making the chip 100 easier to achieve miniaturization.
  • the fifth recess 155 and the sixth recess 156 are respectively located on the -Y axis side and the +Y axis side of the chip 100.
  • the contact parts of the seven substrate terminals are arranged in two rows in the Z axis direction, which are first row and second row in sequence along the -Z axis direction.
  • the cell connecting portions 22 of the conductive sheets 20a and 20b are located between the first row and the second row. Further, the cell connection portions 22 of the conductive sheets 20a and 20b are located between the first row R1 and the second row R2 that the substrate terminals 31 to 37 are arranged separately in the Z axis direction.
  • the contact parts of the substrate terminals are arranged in multiple rows in the Z axis direction, and the cell connecting portions 22 of the conductive sheets 20 are located between the multiple rows formed by the contact parts of the substrate terminals.
  • the substrate terminals 30 can be arranged in multiple rows (e.g. three rows, four rows) in the Z axis direction, and the cell connecting portions 22 of the conductive sheets 20 are located between the multiple rows formed by the substrate terminals.
  • the conductive sheets 20 when the conductive sheets 20 are in contact with the styluses, the conductive sheets 20 will be in contact with the first part 218a of the eighth stylus 218, and the first part 219a of the ninth stylus 219, rather than the conductive sheets 20 are in contact with the first vertical part 218d of the eighth stylus 218 and the first vertical part 219d of the ninth stylus 219 as in the content of the first embodiment.
  • the conductive sheets 20 In the content of the first embodiment, at least a part of the cell connecting portion 22 of the conductive sheet 20 penetrates deeply into the stylus groove, and it is necessary to press the first vertical part 218d of the eighth stylus 218 and the first vertical part 219d of the ninth stylus 219.
  • the conductive sheets 20a and 20b are in contact with the first part 218a of the eighth stylus 218 and the first part 219a of the ninth stylus 219, and thus the conductive sheets will not enter into the stylus grooves, and it is easier for the conductive sheets to be in contact with the styluses, while the electrical connection failure caused by excessive extrusion of the styluses is avoid.
  • FIG. 18 is a schematic diagram of a first conductive sheet 20a.
  • the cell connecting portion 22 of the first conductive sheet 20 is perpendicular to the body 21, and the positioning mounting portion 23 is perpendicular to the body 21.
  • the body 21 is parallel to the surface 10a where the substrate terminal is located, and is provided on one side of the back surface 10b of the chip 100, and the length D1 of the cell connecting portion 22 in the Y axis direction is greater than the length D2 of the cell connecting portion 22 in the Z axis direction.
  • the length in the Y axis direction is relatively large, and thus even if the ink container has a position deviation or offset in the Y axis direction, it will not cause the case where the chip cannot be unrecognizable, thereby making the contact between the conductive sheet and the stylus more stable.
  • the disposition manner and the structure of the second conductive sheet 20b are symmetrically disposed with those of the first conductive sheet 20a along the center line L1.
  • the amount of the styluses 218 and 219 to be compressed is more than other styluses 211 to 217 that contact with substrate terminal, thereby the styluses 218 and 219 are closer to the +X axis direction than the styluses 211 to 217, and the styluses 218 and 219 will not enter into the third recess 14.
  • the chip substrate 10 is provided thereon with a left rear terminal 39a, a right rear terminal 39b, a wafer 40, and electronic components.
  • the left rear terminal 39a corresponds to the first conductive sheet 20a
  • the right rear terminal 39b corresponds to the second conductive sheet 20b.
  • the first conductive sheet 20a is fixed to the chip substrate 10 via the left rear terminal 39a through welding or sticking, and the first conductive sheet 20a is electrically connected with the wafer 230 or the electronic component 231 via the left rear terminal 39a.
  • the second conductive sheet 20b is fixed to the chip substrate 10 via the right rear terminal 39b through welding or sticking, and the second conductive sheet 20b is electrically connected with the wafer 40 or the electronic component via the right rear terminal 39b.
  • the positioning mounting portion 23 of the first conductive sheet 20a is located in the -Z axis direction of the cell connecting portion 22. Further, the substrate terminals 31 to 34 of the first row R1 are located between the positioning mounting portion 23 and the cell connecting portion 22 of the first conductive sheet 20a, so that the chip can be further miniaturized and the size of the chip can be reduced.
  • the cell connecting portion 22 and the positioning mounting portion 23 of the first conductive sheet 20a may be located on two sides of the body 21 respectively, while in the X axis direction, the cell connecting portion 22 and the positioning mounting portion 23 may be located on the same side of the body 21 respectively.
  • the face surface 10a of the chip substrate can also be provided with an additional terminal thereon, which blocks between the cell connecting portion of the conductive sheet and the substrate terminal correspondingly adjacent to the cell connecting portion of the conductive sheet, that is, there is also an additional terminal provided between a substrate terminal 30 and a conductive sheet 20, to avoid short circuit between the conductive sheet and the adjacent substrate terminal.
  • the additional terminal can extend from the substrate terminal that is located at inner side in the Y axis direction, and the additional terminal is connected with at least one wafer 40 of the chip 100 that stores data.
  • the second substrate terminal 32 of the chip 100 has an additional terminal 32a
  • the third substrate terminal 33 has an additional terminal 33a.
  • the additional terminal 32a is provided between the first substrate terminal 31 and the first conductive sheet 20a
  • the additional terminal 33a is provided between the fourth substrate terminal 34 and the second conductive sheet 20b.
  • the additional terminals have the same technical effect as that in Embodiment 1, and detailed illustration thereof will not be provided here.
  • the chip 100 is placed on the chip mounting surface 340c of the ink container.
  • the third recess 153, the fourth recess 154, and the seventh recess 157 on the chip 100 are parts for fixing the chip 100 on the adapter 340.
  • the protrusions on the adapter 340 fit with the third recess 153, the fourth recess 154, and the seventh recess 157, so that the chip 100 can be fixed on the adapter 340.
  • the chip 100 being mounted to the adapter 340 and the chip holder 320 is the same as Embodiment 1.
  • the detailed illustration thereof will not be provided here.
  • the chip mounting surface of the chip holder 320 has three protrusions. These three protrusions respectively abut against the seventh recess 157, the third recess 153, and the fourth recess 154 on the chip 100, so that the chip 100 is fixed on the chip holder 320.
  • protrusions can also be provided on the chip holder 320, to prevent displacement of the first conductive sheet 20a and the second conductive sheet 20b when the first conductive sheet 20a and the second conductive sheet 20b are subjected to an external force.
  • protrusions can be provided at the -Y axis side of the first conductive sheet 20a, and the +Y axis side of the second conductive sheet 20b, to block the movement of the first conductive sheet 20a and the second conductive sheet 20b in the Y axis direction, which increases the accuracy of the contact between the chip 100 and the stylus.
  • the length of the first substrate terminal 31' on the chip substrate 10' in the Y axis direction is longer than the length of other terminals.
  • the first substrate terminal 31' is in contact with both first stylus 211 and second stylus 212, and has two contact areas. Such technology can be used to detect whether the ink container 300 is correctly mounted within the holding portion 200 or not.
  • the first stylus 211 and the second stylus 212 are both in contact with the first substrate terminal 31', the first stylus 211 and the second stylus 212 will be connected together via the first substrate terminal 31', and thus the voltages on the first stylus 211 and the second stylus 212 are the same. Finally, it is only necessary to detect whether the voltages on the first stylus 211 and the second stylus 212 are the same or not, so as to determine whether the first stylus 211 and the second stylus 212 are both in contact with the first substrate terminal 31', and further complete the mounting detection.
  • the fourth stylus 214 is not connected with the internal circuit of the inkjet printer, and is an empty stylus.
  • the other substrate terminals and conductive sheets 20a to 20b are the same as those of the chip 100. There are merely eight contact areas on the chip 100'.
  • FIG. 29 is a schematic diagram of the chip of Embodiment 4.
  • the chip substrate 10" of the chip 100" has substrate terminals 31" to 37".
  • the substrate terminals 31" to 37" are in a rectangular shape and arranged in a row one after another. But the contact areas are still the same as those of the chip shown in FIG. 10 .
  • the beneficial effect of the present application can still be achieved if merely the shape of terminals on the chip substrate of the chip is changed.
  • the contact parts of the seven substrate terminals are arranged in two rows in the Z axis direction, which are first row and second row in sequence along the -Z axis direction.
  • the cell connecting portions of the conductive sheets 20a and 20b are located between the first row and the second row.
  • the contact parts of the substrate terminals are arranged in multiple rows in the Z axis direction, and the cell connecting portions of the conductive sheets 20a, 20b are located between the multiple rows formed by the contact parts of the substrate terminals.
  • the characteristics of the substrate terminals and recesses are the same as those described in the embodiment 1.
  • FIG. 35 is a schematic diagram of a chip of Embodiment 5.
  • Embodiment 5 a part of the substrate terminals being provided on the lower surface of the chip.
  • the fifth substrate terminal 35 to the seventh substrate terminal 37 are provided on the lower surface 10e of the substrate 10 of the chip 100.
  • the fifth substrate terminal 35, the sixth substrate terminal 36, and the seventh substrate terminal 37 are not only provided on the lower surface 10e, but also provided on the face surface 10a and the back surface 10b.
  • the fifth substrate terminal 35, the sixth substrate terminal 36, and the seventh substrate terminal 37 can be brought into contact with the slope portions of the first parts of the respective styluses.
  • the fifth substrate terminal 35 is in contact with the slope portion of the first part 215a of the fifth stylus 215. In this way, the force exerted on the chip by the stylus can be reduced, and the chip can be better avoided from being damaged.
  • the third recess 153, the fourth recess 154, and the eighth recess 158 are in a semicircular shape for fixing the chip onto the ink container.
  • the substrate terminals are on the face surface 10a.
  • the substrate terminals 31 to 37 are located on the +X axis side of the chip substrate 10. It can also be considered that in the X axis direction, the substrate terminals 31 to 37 are located on the +X axis side of the chip substrate 10, through which technical effect of Embodiment 2 can also be achieved.
  • FIG. 36 is a schematic diagram of a chip of Embodiment 6.
  • Embodiment 6 and Embodiment 1 The difference between Embodiment 6 and Embodiment 1 is: a part of the substrate terminals being provided on the lower surface of the chip.
  • the fifth substrate terminal 35 to the seventh substrate terminal 37 are provided on the lower surface 10e of the substrate 10 of the chip 100.
  • the fifth substrate terminal 35, the sixth substrate terminal 36, and the seventh substrate terminal 37 are not only provided on the lower surface 100e, but also provided on the face surface 10a and the back surface 10b.
  • the fifth substrate terminal 35, the sixth substrate terminal 36, and the seventh substrate terminal 37 can be brought into contact with the slope portions of the first parts of the respective styluses.
  • the fifth substrate terminal 35 is in contact with the slope portion of the first part 215a of the fifth stylus 215. In this way, the force exerted on the chip by the stylus can be reduced, and the chip can be better avoided from being damaged.
  • the substrate terminals are on the face surface 10a.
  • the substrate terminals 31 to 37 are located on the +X axis side of the chip substrate 10. It can also be considered that in the X axis direction, the substrate terminals 31 to 37 are located on the +X axis side of the chip substrate 10, through which technical effect of Embodiment 1 can also be achieved.
  • the chip 100 in this embodiment is detachably connected on the chip holder 320.
  • the chip 100 includes a substrate 10.
  • One end of the substrate 10 is provided with a conductive sheet 20.
  • the substrate 10 is successively provided with a set of first limiting grooves 12, a set of second limiting grooves 13 and a set of third limiting grooves 14.
  • the first limiting grooves 12, the second limiting grooves 13 and the third limiting grooves 14 are served as relief recesses, and each set of limiting grooves includes two limiting grooves symmetrically provided on two sides of the chip 100.
  • the first limiting grooves 12 are provided close to the conductive sheet 20.
  • the third limiting grooves 14 extend to near the middle of the substrate 10 from one end of the substrate 10 away from the conductive sheet 20.
  • the length direction of the third limiting grooves 14 is parallel to the X axis direction.
  • the second limiting grooves 13 are provided between the first limiting grooves 12 and the second limiting grooves 13.
  • the second limiting grooves 13 can be provided to an arc groove, and the first limiting grooves 12 and the third limiting grooves 14 can be rectangular notches.
  • the first fixing portions 321 on the chip holder 320 are provided with first limiting blocks 322 that fit with the first limiting grooves 12, the second limiting blocks 323 that fit with the second limiting grooves 13, and a third limiting blocks 324 that fit with the third limiting grooves 14.
  • first limiting blocks 322 abut in the first limiting grooves 12
  • second limiting blocks 323 abut in the second limiting grooves 13
  • third limiting blocks 324 abut in the third limiting grooves 14, and then the chip 100 is detachably connected on the chip holder 320.
  • the height of the first limiting block 322 can be protruded from the face surface 10a of the substrate 10.
  • the first limiting block 322 is partially abutted on the substrate 10 of the chip 100, and partially abutted on the cell connecting portion 22 of the conductive sheet 20, which can avoid the deformation of the cell connecting portion 22, and enhance the stability of the electrical connection between the cell connecting portion 22 and the stylus.

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EP20832692.6A 2019-06-28 2020-06-02 Puce de récipient d'encre et récipient d'encre Pending EP3991974A4 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN201921005051 2019-06-28
CN201921138083 2019-07-18
CN201922184114.7U CN211641446U (zh) 2019-06-28 2019-12-09 墨水容器的芯片及墨水容器
CN201922297657 2019-12-19
CN202020311962.XU CN212499511U (zh) 2019-06-28 2020-03-13 一种用于墨水容器的芯片及使用该芯片的墨水容器
PCT/CN2020/093980 WO2020259228A1 (fr) 2019-06-28 2020-06-02 Puce de récipient d'encre et récipient d'encre

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EP3991974A1 true EP3991974A1 (fr) 2022-05-04
EP3991974A4 EP3991974A4 (fr) 2023-07-12

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Publication number Priority date Publication date Assignee Title
JP4502067B2 (ja) * 2009-05-11 2010-07-14 セイコーエプソン株式会社 液体収容容器
CN102998957B (zh) * 2011-09-09 2015-06-24 珠海艾派克微电子有限公司 一种成像盒芯片的修复方法
CN202428832U (zh) * 2012-01-13 2012-09-12 珠海并洲贸易有限公司 一种用于打印机的芯片及包含该芯片的墨盒
JP6136100B2 (ja) * 2012-04-06 2017-05-31 凸版印刷株式会社 インクカートリッジ
JP6115041B2 (ja) * 2012-08-24 2017-04-19 ブラザー工業株式会社 印刷流体収容装置及び印刷流体供給装置
JP6560907B2 (ja) * 2015-06-01 2019-08-14 ローム株式会社 インクカートリッジ、検出回路、インク搭載ユニット、プリンタ、プリントシステム、およびインク残量検出方法
JP2017056686A (ja) * 2015-09-18 2017-03-23 セイコーエプソン株式会社 端子接続部およびカートリッジ
CN106864040B (zh) * 2015-12-14 2018-05-25 珠海纳思达企业管理有限公司 喷墨打印机用芯片及喷墨打印机
WO2017101249A1 (fr) * 2015-12-14 2017-06-22 珠海纳思达企业管理有限公司 Puce d'imprimante à jet d'encre et imprimante à jet d'encre
CN205395457U (zh) * 2016-03-07 2016-07-27 珠海天威飞马打印耗材有限公司 墨盒芯片和墨盒
JP6709321B2 (ja) * 2016-08-12 2020-06-10 珠海納思達企業管理有限公司 インクカートリッジチップ、インクカートリッジ及びインクジェットプリンタ
JP6779385B2 (ja) * 2017-06-28 2020-11-04 珠海納思達企業管理有限公司 チップ、インクカートリッジおよびインクカートリッジ取り出し方法
CN109130512B (zh) * 2017-06-28 2024-02-23 珠海纳思达企业管理有限公司 芯片、墨盒及墨盒取出的方法
CN207128412U (zh) * 2017-07-12 2018-03-23 珠海纳思达企业管理有限公司 芯片、墨盒以及打印装置
CN115246270B (zh) * 2017-10-12 2024-03-12 珠海纳思达企业管理有限公司 芯片及墨盒

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JP7256331B2 (ja) 2023-04-11
EP3991974A4 (fr) 2023-07-12
WO2020259228A1 (fr) 2020-12-30

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